Conductive composition, conductive member, conductive member production method, touch panel, and solar cell

ABSTRACT

The conductive composition contains at least (a) conductive metal fibers, and (b) at least one compound selected from a compound represented by the following Formula (1) and a compound represented by the following Formula (2). In Formula (1), each of R 1  and R 2  independently represents an alkyl group, an aryl group, an alkoxy group, an aryloxy group, or a halogen atom, and R 3  represents an alkyl group or an aryl group. The compound represented by Formula (1) may include a structure that plural compounds represented by Formula (1) are linked to each other in a single molecule. In Formula (2), each of R 4  and R 5  independently represents an alkyl group. The compound represented by Formula (2) may include a structure that plural compounds represented by Formula (2) are linked to each other.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of PCT International Application No.PCT/JP2013/057995 filed on Mar. 21, 2013, which claims priority under 35U.S.C §119(a) to Japanese Patent Application No. 2012-068273 filed onMar. 23, 2012. The applications are hereby expressly incorporated byreference, in its entirety, into the present application.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a conductive composition, a conductivemember, a conductive member production method, a touch panel, and asolar cell.

2. Description of the Related Art

In recent years, as an input device, a touch panel has been mounted ondisplay devices such as a liquid crystal panel and electronic paper. Thetouch panel is known to be constituted by various systems such as aresistive film system, a surface acoustic wave system, and a capacitivesystem. Among these, the capacitive system is known as a system thatfacilitates multipoint touch and makes it easy to produce a large-areatouch panel. For example, there is a disclosure regarding a capacitivetouch panel using indium tin oxide (ITO) as a transparent conductivematerial.

However, indium as a raw material of ITO is expensive, and stable supplythereof is limited. Moreover, in order to be made into a thin film,indium requires a vacuum process, and accordingly, the production costincreases. Furthermore, the ITO film has problems in that it is brittleand exhibits poor bending resistance. Therefore, alternative substancessuch as a metal nanowire, a carbon nanotube, PEDOT, and polyaniline arebeing suggested.

For example, a conductive member having a conductive layer containingconductive fiber, such as a metal nanowire, a carbon nanotube, and acomplex consisting of a carbon nanotube and a metal, has been suggested(for example, see JP2009-505358A). In the conductive member, aconductive layer containing plural metal nanowires is placed on asubstrate, and the conductive layer contains a photocurable compositionas a matrix. Accordingly, by being subjected to pattern exposure andthen development, the conductive member can be easily processed into aconductive member having a conductive layer including an intendedconductive region and a non-conductive region.

As another system of the conductive fiber-containing conductive member,it is possible to use a method in which a non-photocurable compositionas a matrix is added to a conductive layer, the resultant is driedand/or crosslinked if necessary by a condensation reaction or apolymerization reaction to form a conductive layer, a resist layer isthen formed image-wise on the conductive layer by using an etchingresist or the like, and then an etching step is performed; a method inwhich a conductive network in a uniformly formed transparent conductivelayer is irradiated with laser beams such that a portion of the networkis cut; or the like. By such a method, the conductive member can beeasily processed into a conductive member having a conductive layerincluding an intended conductive region and a non-conductive region (forexample, see JP2010-507199A and JP2010-44968A).

Moreover, as another system of the conductive fiber-containingconductive member, a conductive layer transfer-type conductive layerformed in a manner in which a conductive fiber-containing conductivemember is formed on a temporary support, transferred to a glasssubstrate or the like, and subjected to patterning if necessary by amethod such as photolithography has been suggested (for example, seeJP2006-35771A and JP2009-251186A).

As the conductive fiber preferably used for the conductive member,various materials including a nanowire and a nanorod of metals such assilver, gold, and copper, a carbon nanotube, a carbon nanorod, and acomplex of a carbon nanotube and a metal are known. Among these,conductive metal fiber formed of metals such as silver, gold, and copperis known to more preferably form an excellent conductive member havinglow resistance and a high degree of optical transparency. Particularly,a silver nanowire excellent in the balance among low resistance,durability, and cost is preferably used.

However, when these conductive members using the conductive metal fiberare exposed to harsh conditions such as a high temperature, a highhumidity, and the presence of ozone for a long time, increase inresistivity, which is assumed to result from oxidation or deformation ofmetal, occurs in some cases. Therefore, depending on the purpose, theconductive members are required to be improved in terms of weatherresistance in some cases.

As a method for improving weather resistance of a conductive metalfiber-containing transparent conductive material, a method of using ametal-adsorbent compound having a specific structure is known (forexample, see JP2009-505358A and JP2009-146678A). This method iseffective when the compound is stored under specific conditions.However, since the metal-adsorbent compound exhibits strong adsorptivitywith respect to the conductive metal fiber, the conductive metal fibersare aggregated during the production of the transparent conductivematerial, and homogeneity of the conductive layer deteriorates.Consequentially, conductivity or transparency of the conductive layerdeteriorates, or contact resistance between the conductive metal fibersincreases, and this leads to a problem in that conductivity of theconductive layer deteriorates in some cases.

As a method for producing an aqueous dispersion containing metalnanowires, a method of adding a metal complex solution or metal ionsolution to an aqueous solvent containing a halogen compound and areductant is known (for example, see JP2010-84173A). In the productionmethod, in order to improve purity of the metal nanowires, desaltingtreatment is preferably performed. Presumably, when the desalting(washing) treatment described in examples of JP2010-84173A is performed,most of the reductant that does not make contribution to formation ofthe metal nanowires may be removed. In JP2010-84173A, neither a methodof intentionally leaving a reductant added for reducing a metal complexnor an effect of such a method is described.

As described above, it cannot be mentioned that the conductivity of theconductive metal fiber-containing transparent conductive material isstably kept to a sufficient degree by the technique in the related arteven under harsh conditions such as a high temperature, a high humidity,and the presence of ozone. Therefore, improvement of weather resistancethereof is required.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a conductive metalfiber-containing conductive composition of which the conductivity can bemaintained over time even if the composition is exposed to harshconditions such as a high temperature, a high humidity, and the presenceof ozone, a conductive member, a conductive member production method,and a touch panel and a solar cell using the conductive member.

The conductive composition, the conductive member, the touch panel, thesolar cell, and the conductive member production method of the presentinvention for achieving the object are as follows.

The conductive composition of the present invention contains at least(a) conductive metal fibers having an average minor-axis length from 1nm to 150 nm, and (b) at least one compound selected from a compoundrepresented by the following Formula (1) and a compound represented bythe following Formula (2).

In Formula (1), each of R¹ and R² independently represents an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, or a halogenatom, and R³ represents an alkyl group or an aryl group. At least twoamong R¹, R², and R³ may be linked to each other through an organicgroup having a valency of 2 or higher or a single bond. The Formula (1)may include a structure that plural compounds represented by Formula (1)are linked to each other through an organic group having a valency of 2or higher or through a single bond. In Formula (2), each of R⁴ and R⁵independently represents an alkyl group. R⁴ and R⁵ may be linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond. Moreover, the Formula (2) may include a structurethat plural compounds represented by Formula (2) are linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond.

The conductive composition preferably further contains (c) apolymerizable compound that can form a matrix.

The (c) polymerizable compound that can form a matrix is preferably anon-photosensitive compound.

The (c) polymerizable compound that can form a matrix is preferably acompound that can form a cured sol-gel substance.

A ratio of content of the (c) polymerizable compound that can form amatrix to the (a) conductive metal fibers ((c)/(a)) is preferably0.001/1 to 100/1 in terms of a mass ratio.

A content of (b) at least one compound selected from a compoundrepresented by Formula (1) and a compound represented by Formula (2) ispreferably from 0.005 mmol to 30 mmol per 1 g of the (a) conductivemetal fibers.

At least one of the R¹ and R² in Formula (1) is preferably an alkoxygroup or an aryloxy group, and R³ is preferably an aryl group.

The conductive composition preferably further contains at least one kindof the compound represented by the following Formulae (3) to (11).

In Formula (3), V₃ represents a hydrogen atom or a substituent. InFormula (4), V₄ represents a hydrogen atom or a substituent. In Formula(5), V₅ represents a hydrogen atom or a substituent, and each of R₅₁ andR₅₂ independently represents a hydrogen atom or a group that can besubstituted with a nitrogen atom. In Formula (6), V₆ represents ahydrogen atom or a substituent, and each of R₆₁ and R₆₂ independentlyrepresents a hydrogen atom or a group that can be substituted with anitrogen atom. In the Formula (7), V₇ represents a hydrogen atom or asubstituent, and each of R₇₁ and R₇₂ independently represents a hydrogenatom or a substituent.

In the Formula (8), V₈ represents a hydrogen atom or a substituent, andeach of R₈₁ and R₈₂ independently represents a hydrogen atom or asubstituent. In Formula (9), V₉ represents a hydrogen atom or asubstituent, and each of R₉₁, R₉₂, R₉₃, and R₉₄ independently representsa hydrogen atom or a group that can be substituted with a nitrogen atom.In Formula (10), V₁₀ represents a hydrogen atom or a substituent, andeach of R₁₀₁, R₁₀₂, R₁₀₃, and R₁₀₄ independently represents a hydrogenatom or a group that can be substituted with a nitrogen atom. In Formula(11), R₁₁₁ represents a hydrogen atom or a group that can be substitutedwith a nitrogen atom, each of V₁₁₁, V₁₁₂, V₁₁₃, and V₁₁₄ independentlyrepresents a hydrogen atom or a substituent, and V₁₁₁ and V₁₁₂ as wellas V₁₁₃ and V₁₁₄ may form a bicyclo-ring or a tricyclo-ring by beinglinked to each other.

The conductive metal fibers preferably contain silver in an amount from50 mol % to 100 mol %.

The average minor-axis length of the conductive metal fibers ispreferably from 1 nm to 30 nm.

A conductive member of the present invention has a substrate and aconductive layer which is disposed on the substrate and formed of theconductive composition of the present invention.

The conductive member preferably further has, on the conductive layer, asoluble protective layer containing at least a water-soluble polymer.

A surface resistance of the conductive layer is preferably from 1Ω/square to 1,000 Ω/square.

The conductive layer preferably has a conductive region and anon-conductive region.

The conductive member preferably further has, between the substrate andthe conductive layer, at least one intermediate layer.

A touch panel of the present invention has the conductive member of thepresent invention.

A solar cell of the present invention has the conductive member of thepresent invention.

A conductive member production method of the present invention includesa conductive layer formation step of forming a conductive layer by usingthe conductive composition of the present invention on a substrate, inwhich the conductive composition contains at least (a) conductive metalfibers having an average minor-axis length from 1 nm to 150 nm and (b)at least one compound selected from a compound represented by thefollowing Formula (1) and a compound represented by the followingFormula (2).

In Formula (1), each of R¹ and R² independently represents an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, or a halogenatom, and R³ represents an alkyl group or an aryl group. At least twoamong R¹, R², and R³ may be linked to each other through an organicgroup having a valency of 2 or higher or a single bond. The Formula (1)may include a structure that plural compounds represented by Formula (1)are linked to each other through an organic group having a valency of 2or higher or through a single bond. In Formula (2), each of R⁴ and R⁵independently represents an alkyl group. R⁴ and R⁵ may be linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond. Moreover, the Formula (2) may include a structurethat plural compounds represented by Formula (2) are linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond.

Preferably, in the conductive layer formation step, the conductivecomposition, which contains the (a) conductive metal fibers having anaverage minor-axis length from 1 nm to 150 nm and the (b) at least onecompound selected from a compound represented by Formula (1) and acompound represented by Formula (2), is applied onto the substrate, andthen (c) a matrix is applied onto the substrate so as to form aconductive layer containing the component (a), the component (b), andthe component (c).

Preferably, in the conductive layer formation step, a conductivecomposition, which contains the (a) conductive metal fibers having anaverage minor-axis length from 1 nm to 150 nm, the (b) at least onecompound selected from a compound represented by Formula (1) and acompound represented by Formula (2), and (c) a matrix is applied ontothe substrate so as to form a conductive layer containing the component(a), the component (b), and the component (c).

Preferably, in a conductive member production method of the presentinvention, (a) conductive metal fibers having an average minor-axislength from 1 nm to 150 nm are applied onto a substrate, and then acomposition, which contains (b) at least one compound selected from acompound represented by the following Formula (1) and a compoundrepresented by the following Formula (2) and (c) a matrix, is appliedonto the substrate so as to form a conductive layer containing thecomponent (a), the component (b), and the component (c).

In Formula (1), each of R¹ and R² independently represents an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, or a halogenatom, and R³ represents an alkyl group or an aryl group. At least twoamong R¹, R², and R³ may be linked to each other through an organicgroup having a valency of 2 or higher or through a single bond. TheFormula (1) may include a structure that plural compounds represented byFormula (1) are linked to each other through an organic group having avalency of 2 or higher or through a single bond. In Formula (2), each ofR⁴ and R⁵ independently represents an alkyl group. R⁴ and R⁵ may belinked to each other through an organic group having a valency of 2 orhigher or through a single bond. Moreover, the Formula (2) may include astructure that plural compounds represented by Formula (2) are linked toeach other through an organic group having a valency of 2 or higher orthrough a single bond.

Preferably, the conductive member has a patterned conductive layerproduced by a method which includes at least a step of providing aphotoresist layer to the conductive member of the present invention thathas the substrate and the conductive layer, a step of forming aphotoresist layer in the form of a pattern by exposing the photoresistlayer to light in the form of a pattern and developing the photoresistlayer, and a step of etching the conductive layer through thephotoresist layer in the form of a pattern.

According to the present invention, there are provided a conductivemetal fiber-containing conductive composition that can maintainconductivity over time even when being exposed to harsh conditions suchas a high temperature, a high humidity, or the presence of ozone, aconductive member, a conductive member production method, and a touchpanel and a solar cell which use the conductive member.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of a conductive memberaccording to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of a conductive memberaccording to a second embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of a conductive memberaccording to a third embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a conductive memberaccording to a fourth embodiment of the present invention.

FIG. 5 is a view illustrating an example of a conductive memberproduction method of the present invention.

FIG. 6A and FIG. 6B are drawings illustrating another example of theconductive member production method of the present invention.

FIG. 7A and FIG. 7B are drawings illustrating another example of theconductive member production method of the present invention.

FIG. 8A, FIG. 8B and FIG. 8C are drawings illustrating another exampleof the conductive member production method of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, the conductive composition of the present invention will bedescribed in detail.

The following description will be made based on typical embodiments ofthe present invention. However, the present invention is not limited tothe described embodiments, within a range that does not depart from thegist of the present invention.

Moreover, in the present specification, a range of numerical valuesdescribed using “to” has numerical values listed before and after “to”as a lower limit and an upper limit respectively.

In the present specification, the term “light” is used under a conceptincluding not only visible rays but also high-energy rays such as UVrays, X-rays, and γ-rays, particle beams such as electron beams, and thelike.

In the present specification, in some cases, “(meth)acrylic acid”indicates either or both of acrylic acid and methacrylic acid, and“(meth)acrylate” indicates either or both of acrylate and methacrylate.

Furthermore, unless otherwise specified, a content is expressed in termsof mass. Moreover, unless otherwise specified, “% by mass” indicates aratio of a component to a total amount of a composition, and “solidcontent” indicates components contained in the composition excluding asolvent.

<Conductive Composition>

The conductive composition of the present invention contains at least(a) conductive metal fibers (hereinafter, referred to as “(a) conductivemetal fibers” in some cases) having an average minor-axis length(hereinafter, referred to as “average minor-axis length” or “averagediameter” in some cases) from 1 nm to 150 nm, and (b) at least onecompound (hereinafter, referred to as “(b) component compound” in somecases) selected from a compound represented by the following Formula (1)and a compound represented by the following Formula (2).

In Formula (1), each of R¹ and R² independently represents an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, or a halogenatom, and R³ represents an alkyl group or an aryl group. At least twoamong R¹, R², and R³ may be linked to each other through an organicgroup having a valency of 2 or higher or through a single bond. TheFormula (1) may include a structure that plural compounds represented byFormula (1) are linked to each other through an organic group having avalency of 2 or higher or through a single bond. That is, the Formula(1) includes the structure that are formed when a monovalent group ofone compound is linked to a monovalent group of other compound throughan organic group having a valency of 2 or higher or through a singlebond in a single molecule. The monovalent group of the compound isformed by removing one hydrogen atom from at least one of the R¹, R²,and R³ of the Formula (1).

In Formula (2), each of R⁴ and R⁵ independently represents an alkylgroup. R⁴ and R⁵ may be linked to each other through an organic grouphaving a valency of 2 or higher or through a single bond. Moreover, theFormula (2) may include a structure that plural compounds represented byFormula (2) are linked to each other through an organic group having avalency of 2 or higher or through a single bond. That is, the Formula(2) includes the structure that are formed when a monovalent group ofone compound is linked to a monovalent group of other compound throughan organic group having a valency of 2 or higher or through a singlebond in a single molecule. The monovalent group of the compound isformed by removing one hydrogen atom from at least one of the R⁴ and R⁵of the Formula (2).

If the conductive composition of the present invention is constituted asabove, deterioration of conductivity is inhibited even when thecomposition is exposed to harsh conditions such as a high temperature, ahigh humidity, or the presence of ozone. The following can be assumed tobe as the reason, though it is not a definite reason.

Under the conditions such as a high temperature, a high humidity, or thepresence of ozone, a radical species is generated in the conductivemetal fiber-containing conductive layer, layers in the vicinity of theconductive layers, and the like. The radical species reacts with oxygenand generates peroxide and the like. At this time, at least one compound((b) component compound) selected from the compound represented byFormula (1) and the compound represented by Formula (2) is considered tofunction to deactivate the generated peroxide and the like.

Therefore, presumably, if the (b) component compound is added to theconductive layer or to a layer coming into contact with the conductivelayer such that the compound is present in the vicinity of theconductive metal fiber, the amount of peroxide may be reduced, oxidationof the conductive metal fiber may be inhibited, and consequentially,deterioration of conductivity may be inhibited.

Hereinafter, components of the conductive composition of the presentinvention will be described in detail.

(a) Conductive Metal Fiber

The conductive composition of the present invention contains conductivemetal fibers having an average minor-axis length from 1 nm to 150 nm.The average minor-axis length of the conductive metal fibers is 1 nm to150 nm. From the viewpoint of durability and optical characteristics,the average minor-axis length is preferably 1 nm to 70 nm, morepreferably 1 nm to 50 nm, even more preferably 1 nm to 40 nm, andparticularly preferably 10 nm to 40 nm.

Herein, the average minor-axis length (average diameter) and averagemajor-axis length (average major-axis length) of the conductive metalfibers can be measured by observing a TEM image or an optical microscopeimage by using, for example, a transmission electron microscope (TEM) oran optical microscope. In the present invention, 300 strands ofconductive metal fibers are observed using a transmission electronmicroscope (TEM; manufactured by JEOL Ltd., JEM-2000FX) to measure theaverage minor-axis length (average diameter) and average major-axislength of the conductive metal fibers, and an average thereof is takenas an average minor-axis length and a average major-axis length.

When a cross-section of the conductive metal fiber in the minor-axisdirection is not circular, a length of a site that is confirmed to bethe longest when being measured in the minor-axis direction is taken asthe average minor-axis length. Moreover, when the conductive metal fiberis curved, a circle having the fiber as an arc is conceived, and a valuecalculated from the diameter and curvature is taken as the averagemajor-axis length.

An aspect ratio of the conductive metal fiber is preferably from 50 orhigher. The aspect ratio generally refers to a ratio between a long sideand a short side (ratio of average major-axis length/average minor-axislength) of a fibrous substance.

A method of measuring the aspect ratio is not particularly limited andcan be appropriately selected according to the purpose. For example, ameasurement method using an electron microscope or the like can be used.

When the aspect ratio of the conductive metal fiber is measured using anelectron microscope, whether or not the aspect ratio of the conductivemetal fiber is 50 or higher is preferably able to be confirmed in onefield of view of the electron microscope. Moreover, if each of theaverage major-axis length and average minor-axis length of theconductive metal fibers is separately measured, the aspect ratio of allof the conductive metal fibers can be estimated.

Furthermore, when the conductive metal fiber is tubular, the outerdiameter of the tube is used as a diameter for calculating the aspectratio.

The aspect ratio of the conductive metal fiber can be appropriately setaccording to the purpose. However, it is preferably 50 to 1,000,000, andmore preferably 100 to 1,000,000. If the aspect ratio is set to be equalto or higher than 50, it is easy for the conductive metal fibers to forma network, and sufficient conductivity is easily obtained. Moreover, ifthe aspect ratio is set to be equal to or lower than 1,000,000, at thetime when the conductive metal fibers are formed or when the formedconductive metal fibers are handled, the conductive metal fibers are notentangled with each other, and a solution excellent in stability andproduction suitability is easily obtained.

Examples of conductive metal material forming the fiber include metaloxides such as ITO, zinc oxide, and tin oxide, metallic carbon, a singlemetal element, a composite structure consisting of plural metalelements, an alloy consisting of plural metals, and the like. Moreover,the material may be shaped into fiber and then subjected to surfacetreatment. For example, plated metal fiber can be used.

The conductive metal fiber may be in any form including a solidstructure, a porous structure, and a hollow structure, but among these,a solid structure and a hollow structure are preferable. In the presentinvention, in some cases, the fiber having a solid structure is referredto as “wire”, and the fiber having a hollow structure is referred to as“tube”.

(Metal Nanowire)

From the viewpoint of making it easy to form a transparent conductivefilm, it is preferable to use a metal nanowire as the conductive metalfiber. In the present invention, it is preferable to use a metalnanowire having an average minor-axis length of 1 nm to 150 nm and anaverage major-axis length of 1 μm to 100 μm.

The average minor-axis length (average diameter) of the metal nanowireis preferably 1 nm to 50 nm, more preferably 1 nm to 30 nm, even morepreferably 5 nm to 30 nm, and particularly preferably 5 nm to 25 nm. Ifthe average minor-axis length is equal to or longer than 1 nm, the metalnanowire tends to exhibit excellent oxidation resistance, and durabilitythereof tends to be improved. When the average minor-axis length isequal to or shorter than 150 nm, deterioration of opticalcharacteristics such as increase in haze resulting from light scatteringand the like is inhibited.

The average major-axis length (also referred to as “average length” insome cases) of the metal nanowire is preferably 1 μm to 40 morepreferably 3 μm to 35 μm, and particularly preferably 5 μm to 30 μm. Ifthe average major-axis length of the metal nanowire is equal to orshorter than 40 μm, generation of aggregates at the time of producingthe metal nanowire is inhibited. If the average major-axis length isequal to or longer than 1 μm, sufficient conductivity tends to beobtained.

A coefficient of variation of the average minor-axis length (diameter)of the metal nanowire used for the conductive layer according to thepresent invention is preferably equal to or less than 40%, morepreferably equal to or less than 35%, and particularly preferably equalto or less than 30%.

If the coefficient of variation is controlled to be equal to or lessthan 40%, it is easy to secure conductivity with excellent durability.

The coefficient of variation of the average minor-axis length (diameter)of the metal nanowire can be determined by measuring the averageminor-axis length (diameter) of 300 strands of metal nanowires from, forexample, a transmission electron microscope (TEM) image and calculatinga standard deviation and average thereof

The metal nanowire may be in any form such as the form of a cylinder, acuboid, a column which has a polygonal cross-section, and the like.However, when a high degree of transparency is required for the metalnanowire, a metal nanowire in the form of a cylinder or a metal nanowirewhich is in the form of a polygon having 5 or more sides and has across-sectional shape having no acute angle is preferable.

The cross-sectional shape of the metal nanowire can be detected bycoating a substrate with an aqueous dispersion of the metal nanowire andobserving the cross-section with a transmission electron microscope(TEM).

The metal in the metal nanowire is not particularly limited, and anymetal may be used. One kind of metal may be used, or two or more kindsof metals may be used in combination. Moreover, the metal can be used inthe form of an alloy.

As the metal, at least one kind of metal selected from a groupconsisting of metals of the fourth period, the fifth period, and thesixth period of the long periodic table (IUPAC 1991) is preferable; atleast one kind of metal selected from group 2 to group 14 is morepreferable; and at least one kind of metal selected from group 2, group8, group 9, group 10, group 11, group 12, group 13, and group 14 is evenmore preferable. It is particularly preferable for the metal nanowire tocontain such a metal as a main component.

Specific examples of the metal include copper, silver, gold, platinum,palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium,osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium,bismuth, antimony, lead, an alloy of these, and the like. Among these,copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium,iridium, and an alloy of these are preferable; palladium, copper,silver, gold, platinum, tin, and an alloy of these are more preferable.Particularly, silver or a silver-containing alloy in which a content ofsilver is from 50 mol % to 100 mol % (more preferably 90 mol % to 100mol %) is preferable.

A method for producing the metal nanowire is not particularly limited,and the metal nanowire may be produced by any method. For example, asdescribed below, it is preferable for the metal nanowire to be producedby reducing metal ions in a solvent in which a halogen compound and adispersant are dissolved. Moreover, after the metal nanowire is formed,from the viewpoint of dispersity and temporal stability of aphotosensitive layer, it is preferable to perform desalting treatment bya common method.

As the method for producing the metal nanowire, it is possible to usethe methods described in JP2009-215594A, JP2009-242880A, JP2009-299162A,JP2010-84173A, JP2010-86714A, and the like.

As the solvent used for producing the metal nanowire, a hydrophilicsolvent is preferable, and examples thereof include water, an alcohol,an ether, a ketone, and the like. One kind of these may be used singly,or two or more kinds thereof may be used concurrently.

Examples of the alcohol include methanol, ethanol, propanol, 2-propanol,butanol, ethylene glycol, and the like.

Examples of the ether include dioxane, tetrahydrofuran, and the like.

Examples of the ketone include acetone and the like.

When the metal nanowire is heated during the production thereof, thetemperature is preferably equal to or lower than 250° C., morepreferably from 20° C. to 200° C., even more preferably from 30° C. to180° C., and particularly preferably from 40° C. to 170° C. If thetemperature is controlled to be equal to or higher than 20° C., thelength of the formed metal nanowire falls within a range preferable forobtaining dispersion stability. If the temperature is controlled to beequal to or lower than 250° C., it preferable from the viewpoint oftransparency, since the outer circumference of the cross-section of themetal nanowire has a smooth shape not having an acute angle.

If necessary, the temperature may be changed in a process of formingparticles. In some cases, the change of temperature in the process offorming particles is effective for controlling the formation of anucleus, inhibiting regeneration of a nucleus, and improvingmonodispersity caused by acceleration of selective growth.

It is preferable to additionally use a reductant during the heating.

The reductant is not particularly limited and can be appropriatelyselected from reductants that can reducing metal ions. Examples of thereductants include metal borohydride, aluminum hydride, alkanolamine,aliphatic amine, heterocyclic amine, aromatic amine, aralkylamine, analcohol, an organic acid, reducing sugar, a sugar alcohol, sulfite, ahydrazine compound, dextrin, hydroquinone, hydroxyamine, ethyleneglycol, glutathione, and the like.

Among these, reducing sugar, a sugar alcohol as a derivative thereof,and ethylene glycol are more preferable, and reducing sugar, a sugaralcohol as a derivative thereof, and ethylene glycol are particularlypreferable. Some of the reductants are compounds that function as adispersant or solvent, and these can also be preferably used.

It is preferable for the reductant used for forming the metal nanowireto be removed by means of ultrafiltration, dialysis, gel filtration,decantation, centrifugation, and the like after the metal nanowire isformed, such that the amount of residue thereof becomes less than 0.1%by mass with respect to silver.

It is preferable to additionally use a dispersant, a halogen compound,and a halogenated fine metal particles during the production of themetal nanowire.

The timing of adding the dispersant and the halogen compound may bebefore or after the addition of the reductant or may be before or afterthe addition of the metal ions or the halogenated fine metal particles.However, in order to obtain a metal nanowire having bettermonodispersity, it is preferable for the halogen compound to be added intwo or more stages.

The dispersant may be added to the reaction solution before theparticles are prepared, or alternatively, it may be added after theparticles are prepared. The dispersant may be added in one stage or intwo or more stages.

Examples of the dispersant include an amino group-containing compound, amercapto group-containing compound, a sulfide-containing compound, anamino acid or derivatives thereof, a peptide compound, a polysaccharide,a natural polymer derived from a polysaccharide, a synthetic polymer, apolymer of gel and the like derived from these, and the like.

Examples of polymer compounds preferably used as the dispersant includehydrophilic polymers such as gelatin as a protective colloidal polymer,polyvinyl alcohol, methyl cellulose, hydroxypropyl cellulose,polyalkylene amine, poly(meth)acrylic acid, a salt thereof or a partialalkyl ester thereof, polyvinyl pyrrolidone, a copolymer having apolyvinyl pyrrolidone structure, and poly(meth)acrylic acid derivativeshaving an amino group or a mercapto group.

A weight average molecular weight (Mw) of the polymer used as adispersant that is measured by gel permeation chromatography ispreferably from 3,000 to 300,000, and more preferably from 5,000 to100,000.

Regarding the structure of compounds usable as a dispersant, forexample, the disclosure of “Dictionary of Pigment” (edited by SeishiroIto, published by Asakura Publishing Co., Ltd., 2000) can be referredto. The shape of the obtained metal nanowire can be controlled accordingto the type of the dispersant used.

As the halogen compound, compounds containing bromide ions, chlorideions, or iodide ions are preferable. For example, metal halides such assodium bromide, sodium chloride, sodium iodide, potassium iodide,potassium bromide, potassium chloride, and potassium iodide and halideion salts of onium salts exemplified below that also function as adispersant are preferable.

Fine silver halide particles may be used instead of the halogencompound, or alternatively, the halogen compound and fine silver halideparticles may be used concurrently.

Moreover, a single substance that functions as both the dispersant andhalogen compound may be used. That is, a single compound has thefunction of both the dispersant and halogen compound.

Preferable examples of halogen compounds that function as a dispersantinclude halide ion salts of onium (preferably ammonium or phosphonium).

Examples thereof include hexadecyl trimethyl ammonium bromide (HTAB),hexadecyl trimethyl ammonium chloride (HTAC), dodecyl trimethyl ammoniumbromide, dodecyl trimethyl ammonium chloride, stearyl trimethyl ammoniumbromide, stearyl trimethyl ammonium chloride, decyl trimethyl ammoniumbromide, decyl trimethyl ammonium chloride, dimethyl distearyl ammoniumbromide, dimethyl distearyl ammonium chloride, dilauryl dimethylammonium bromide, dilauryl dimethyl ammonium chloride, dimethyldipalmityl ammonium bromide, dimethyl dipalmityl ammonium chloride, andthe like.

If necessary, after the metal nanowire is formed, these compounds may beremoved by means of ultrafiltration, dialysis, gel filtration,decantation, centrifugation, and the like.

It is preferable for the metal nanowire not to contain inorganic ionssuch as alkali metal ions, alkaline earth metal ions, and halide ions asfar as possible. When the metal nanowire is dispersed in an aqueousmedium, an electric conductivity thereof is preferably equal to or lessthan 1 mS/cm, more preferably equal to or less than 0.1 mS/cm, and evenmore preferably equal to or less than 0.05 mS/cm.

When the metal nanowire is dispersed in an aqueous medium, a viscositythereof at 20° C. is preferably 0.5 mPa·s to 100 mPa·s, and morepreferably 1 mPa·s to 50 mPa·s.

(Metal Nanotube)

Examples of preferable conductive metal fiber other than the metalnanowire include a metal nanotube as hollow fiber. The material of themetal nanotube is not particularly limited, and any metal can be used asthe material. For example, it is possible to use the aforementionedmaterials and the like of the metal nanowire.

The metal nanotube may be in the form of a single layer or a multilayer.However, it is preferable for the metal nanotube to be in the form of asingle layer since conductivity and thermal conductivity thereof becomeexcellent.

A thickness (a difference between the inner diameter and the outerdiameter) of the metal nanotube is preferably 3 nm to 80 nm, and morepreferably 3 nm to 30 nm. If the thickness is equal to or greater than 3nm, sufficient oxidation resistance is obtained. If the thickness isequal to or smaller than 80 nm, light scattering caused by the metalnanotube is inhibited.

In the present invention, the average minor-axis length of the metalnanotubes is 1 nm to 150 nm similarly to the metal nanowires, and apreferable average major-axis length thereof is also the same as that ofthe metal nanowires. The average minor-axis length is preferably 1 μm to40 μm, more preferably 3 μM to 35 μm, and even more preferably 5 μm to30 μm.

The method for producing the metal nanotube is not particularly limitedand can be appropriately selected according to the purpose. For example,the method described in US2005/0056118A can be used.

(b) Component Compound

The conductive composition of the present invention contains at leastone compound selected from a compound represented by the followingFormula (1) and a compound represented by the following Formula (2).

In Formula (1), each of R¹ and R² independently represents an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, or a halogenatom, and R³ represents an alkyl group or an aryl group. At least twoamong R¹, R², and R³ may be linked to each other through an organicgroup having a valency of 2 or higher or a single bond. The Formula (1)may include a structure that plural compounds represented by Formula (1)are linked to each other through an organic group having a valency of 2or higher or through a single bond. That is, the Formula (1) includesthe structure that are formed when a monovalent group of one compound islinked to a monovalent group of other compound through an organic grouphaving a valency of 2 or higher or through a single bond in a singlemolecule. The monovalent group of the compound is formed by removing onehydrogen atom from at least one of the R¹, R², and R³ of the Formula(1).

In Formula (2), each of R⁴ and R⁵ independently represents an alkylgroup. R⁴ and R⁵ may be linked to each other through an organic grouphaving a valency of 2 or higher or through a single bond. Moreover, theFormula (2) may include a structure that plural compounds represented byFormula (2) are linked to each other through an organic group having avalency of 2 or higher or through a single bond. That is, the Formula(2) includes the structure that are formed when a monovalent group ofone compound is linked to a monovalent group of other compound throughan organic group having a valency of 2 or higher or through a singlebond in a single molecule. The monovalent group of the compound isformed by removing one hydrogen atom from at least one of the R⁴ and R⁵of the Formula (2).

The alkyl group represented by R¹, R², and R³ in the Formula (1)represents a substituted or unsubstituted linear, branched, or cyclicalkyl group, and preferably has 1 to 50 carbon atoms, more preferablyhas 1 to 30 carbon atoms, and particularly preferably has 1 to 20 carbonatoms. Preferable examples thereof include methyl, ethyl, n-propyl,isopropyl, cyclopropyl, butyl, isobutyl, t-butyl, sec-butyl, pentyl,isopentyl, neopentyl, t-pentyl, hexyl, cyclohexyl, heptyl, cyclopentyl,octyl, 2-ethylhexyl, nonyl, decyl, dodecyl, tetradecyl, hexadecyl,octadecyl, eicosyl, docosyl, triacontyl, and the like. Among these,methyl, ethyl, n-propyl, isopropyl, butyl, isobutyl, t-butyl, sec-butyl,pentyl, isopentyl, neopentyl, hexyl, cyclohexyl, octyl, 2-ethylhexyl,dodecyl, hexadecyl, and octadecyl are more preferable; and methyl,ethyl, n-propyl, isopropyl, butyl, t-butyl, pentyl, isopentyl, hexyl,cyclohexyl, octyl, 2-ethylhexyl, dodecyl, hexadecyl, and octadecyl areeven more preferable.

The alkyl group represented by R¹, R², and R³ may further have asubstituent. Examples of the substituent include a halogen atom, analkyl group (including a cycloalkyl group), an alkenyl group (includinga cycloalkenyl group and a bicycloalkenyl group), an alkynyl group, anaryl group, a cyano group, a hydroxyl group, a nitro group, a carboxylgroup, an alkoxy group, an aryloxy group, an acyloxy group, acarbamoyloxy group, an alkoxy carbonyloxy group, aryloxy carbonyloxy, anamino group (including an anilino group), an acylamino group, anaminocarbonyl amino group, an alkoxycarbonyl amino group, anaryloxycarbonyl amino group, an acyl group, an aryloxycarbonyl group, analkoxycarbonyl group, a carbamoyl group, and the like.

More specifically, the substituent represents a halogen atom (forexample, a chlorine atom, a bromine atom, or an iodine atom), an alkylgroup [(the alkyl group represents a substituted or unsubstitutedlinear, branched, or cyclic alkyl group. These also include an alkylgroup (preferably an alkyl group having 1 to 30 carbon atoms, forexample, methyl, ethyl, n-propyl, isopropyl, t-butyl, n-octyl, eicosyl,2-chloroethyl, 2-cyanoethyl, and 2-ethylhexyl), a cycloalkyl group(preferably a substituted or unsubstituted cycloalkyl group having 3 to30 carbon atoms, for example, cyclohexyl, cyclopentyl, and4-n-dodecylcyclohexyl), a bicycloalkyl group (preferably a substitutedor unsubstituted bicycloalkyl group having 5 to 30 carbon atoms, thatis, a monovalent group formed when one hydrogen atom is removed frombicycloalkane having 5 to 30 carbon atoms; for example,bicyclo[1.2.2]heptan-2-yl and bicyclo[2.2.2]octan-3-yl), and a tricyclostructure consisting of many cyclic structures. The alkyl group (forexample, an alkyl group in an alkylthio group) in the substituent, whichwill be described later, also represents the alkyl group under the aboveconcept.), an alkenyl group (preferably a substituted or unsubstitutedalkenyl group having 2 to 30 carbon atoms, for example, vinyl, allyl,prenyl, geranyl, and oleyl), a cycloalkenyl group (preferably asubstituted or unsubstituted cycloalkenyl group having 3 to 30 carbonatoms, that is, a monovalent group formed when one hydrogen atom isremoved from cycloalkene having 3 to 30 carbon atoms; for example,2-cyclopenten-1-yl and 2-cyclohexen-1-yl), a bicycloalkenyl group (asubstituted or unsubstituted bicycloalkenyl group which is preferably asubstituted or unsubstituted bicycloalkenyl group having 5 to 30 carbonatoms, that is, a monovalent group formed when one hydrogen atom isremoved from bicycloalkene having one double bond; for example,bicyclo[2.2.1]hepto-2-en-1-yl and bicyclo[2.2.2]octo-2-en-4-yl)],

an alkynyl group (preferably a substituted or unsubstituted alkynylgroup having 2 to 30 carbon atoms, for example, ethynyl, propargyl, ortrimethylsilyl ethynyl group), an aryl group (preferably a substitutedor unsubstituted aryl group having 6 to 30 carbon atoms, for example,phenyl, p-tolyl, naphthyl, m-chlorophenyl, or o-hexadecanoylaminophenyl), a heterocyclic group (preferably a monovalent group formedwhen one hydrogen atom is removed from a 5- or 6-membered substituted orunsubstituted aromatic or non-aromatic heterocyclic compound, and morepreferably a 5- or 6-membered aromatic heterocyclic group having 3 to 30carbon atoms, for example, 2-furanyl, 2-thienyl, 2-pyrimidinyl, or2-benzothiazolinyl), a cyano group, a hydroxyl group, a nitro group, acarboxyl group, an alkoxy group (preferably a substituted orunsubstituted alkoxy group having 1 to 32 carbon atoms, for example,methoxy, ethoxy, isopropoxy, t-butoxy, n-octyloxy, or 2-methoxyethoxy),an aryloxy group (preferably a substituted or unsubstituted aryloxygroup having 6 to 30 carbon atoms, for example, phenoxy,2-methylphenoxy, 4-t-butylphenoxy, 3-nitrophenoxy, or2-tetradecanoylaminophenoxy), a silyloxy group (preferably a silyloxygroup having 3 to 20 carbon atoms, for example, trimethylsilyloxy ort-butylmethylsilyloxy), a heterocyclic oxy group (preferably asubstituted or unsubstituted heterocyclic oxy group having 2 to 30carbon atoms, for example, 1-phenyltetrazol-5-oxy or2-tetrahydropyranyloxy), an acyloxy group (preferably a formyloxy group,a substituted or unsubstituted alkylcarbonyloxy group having 2 to 30carbon atoms, or a substituted or unsubstituted arylcarbonyloxy grouphaving 6 to 30 carbon atoms, for example, formyloxy, acetyloxy,pivaloyloxy, stearoyloxy, benzoyloxy, or p-methoxyphenylcarbonyloxy), acarbamoyloxy group (preferably a substituted or unsubstitutedcarbamoyloxy group having 1 to 30 carbon atoms, for example,N,N-dimethylcarbamoyloxy, N,N-diethylcarbamoyloxy,morpholinocarbonyloxy, N,N-di-n-octylaminocarbonyloxy, orN-n-octylcarbamoyloxy), an alkoxycarbonyloxy group (preferably asubstituted or unsubstituted alkoxy carbonyloxy group having 2 to 30carbon atoms, for example, methoxycarbonyloxy, ethoxycarbonyloxy,t-butoxycarbonyloxy, or n-octylcarbonyloxy), an aryloxycarbonyloxy group(preferably a substituted or unsubstituted aryloxycarbonyloxy grouphaving 7 to 30 carbon atoms, for example, phenoxycarbonyloxy,p-methoxyphenoxycarbonyloxy, or p-n-hexadecyloxyphenoxy carbonyloxy),

an amino group (preferably an amino group, a substituted orunsubstituted alkylamino group having 1 to 30 carbon atoms, asubstituted or unsubstituted anilino group having 6 to 30 carbon atoms,for example, amino, methylamino, dimethylamino, anilino,N-methyl-anilino, diphenylamino), an acylamino group (preferably aformylamino group, a substituted or unsubstituted alkylcarbonylaminogroup having 1 to 30 carbon atoms, or a substituted or unsubstitutedarylcarbonylamino group having 6 to 30 carbon atoms, for example,formylamino, acetylamino, pivaloylamino, lauroylamino, benzoylamino, or3,4,5-tri-n-octyloxyphenyl carbonylamino), an aminocarbonylamino group(preferably a substituted or unsubstituted aminocarbonylamino having 1to 30 carbon atoms, for example, carbamoylamino,N,N-dimethylaminocarbonylamino, N,N-diethylaminocarbonylamino, ormorpholinocarbonylamino), an alkoxycarbonylamino group (preferably asubstituted or unsubstituted alkoxycarbonylamino group having 2 to 30carbon atoms, for example, methoxycarbonylamino, ethoxycarbonylamino,t-butoxycarbonylamino, n-octadecyloxycarbonylamino, orN-methyl-methoxycarbonylamino), an aryloxycarbonylamino group(preferably a substituted or unsubstituted aryloxycarbonylamino grouphaving 7 to 30 carbon atoms, for example, phenoxycarbonylamino,p-chlorophenoxycarbonylamino, or m-n-octyloxyphenoxycarbonylamino), asulfamoylamino group (preferably a substituted or unsubstitutedsulfamoylamino group having 0 to 30 carbon atoms, for example,sulfamoylamino, N,N-dimethylaminosulfonylamino, orN-n-octylaminosulfonylamino), an alkyl or aryl sulfonylamino group(preferably a substituted or unsubstituted alkyl sulfonylamino having 1to 30 carbon atoms, or a substituted or unsubstituted aryl sulfonylaminohaving 6 to 30 carbon atoms, for example, methyl sulfonylamino, butylsulfonylamino, phenyl sulfonylamino, 2,3,5-trichlorophenylsulfonylamino,or p-methyl phenyl sulfonyl amino),

a mercapto group, an alkylthio group (preferably a substituted orunsubstituted alkylthio group having 1 to 30 carbon atoms, for example,methylthio, ethylthio, or n-hexadecylthio), an arylthio group(preferably substituted or unsubstituted arylthio having 6 to 30 carbonatoms, for example, phenylthio, p-chlorophenylthio, orm-methoxyphenylthio), a heterocyclic thio group (preferably asubstituted or unsubstituted heterocyclic thio group having 2 to 30carbon atoms, for example, 2-benzothiazolylthio or1-phenyltetrazol-5-ylthio), a sulfamoyl group (preferably a substitutedor unsubstituted sulfamoyl group having 0 to 30 carbon atoms, forexample, N-ethylsulfamoyl, N-(3-dodecyloxypropyl)sulfamoyl,N,N-dimethylsulfamoyl, N-acetylsulfamoyl, N-benzoylsulfamoyl, orN—(N′-phenylcarbamoyl)sulfamoyl), a sulfo group, an alkyl and arylsulfinyl group (preferably a substituted or unsubstituted alkyl sulfinylgroup having 1 to 30 carbon atoms and a substituted or unsubstitutedaryl sulfinyl group having 6 to 30 carbon atoms, for example, methylsulfinyl, ethyl sulfinyl, phenyl sulfinyl, or p-methylphenyl sulfinyl),

an alkyl or aryl sulfonyl group (preferably a substituted orunsubstituted alkyl sulfonyl group having 1 to 30 carbon atoms and asubstituted or unsubstituted aryl sulfonyl group having 6 to 30 carbonatoms, for example, methyl sulfonyl, ethyl sulfonyl, phenyl sulfonyl, orp-methylphenyl sulfonyl), an acyl group (preferably a formyl group, asubstituted or unsubstituted alkyl carbonyl group having 2 to 30 carbonatoms, a substituted or unsubstituted aryl carbonyl group having 7 to 30carbon atoms, or a substituted or unsubstituted heterocyclic carbonylgroup having 4 to 30 carbon atoms that is bonded to a carbonyl groupthrough carbon atoms, for example, acetyl, pivaloyl, 2-chloroacetyl,stearoyl, benzoyl, or p-n-octyloxyphenylcarbonyl, 2-pyridylcarbonyl, or2-furylcarbonyl), an aryloxycarbonyl group (preferably a substituted orunsubstituted aryloxycarbonyl group having 7 to 30 carbon atoms, forexample, phenoxycarbonyl, o-chlorophenoxycarbonyl,m-nitrophenoxycarbonyl, or p-t-butylphenoxycarbonyl), an alkoxycarbonylgroup (preferably a substituted or unsubstituted alkoxycarbonyl grouphaving 2 to 30 carbon atoms, for example, methoxycarbonyl,ethoxycarbonyl, t-butoxycarbonyl, or n-octadecyloxycarbonyl),

a carbamoyl group (preferably substituted or unsubstituted carbamoylhaving 1 to 30 carbon atoms, for example, carbamoyl, N-methylcarbamoyl,N,N-dimethylcarbamoyl, N,N-di-n-octylcarbamoyl, orN-(methylsulfonyl)carbamoyl), an aryl and heterocyclic azo group(preferably a substituted or unsubstituted arylazo group having 6 to 30carbon atoms and a substituted or unsubstituted heterocyclic azo grouphaving 3 to 30 carbon atoms, for example, phenylazo, p-chlorophenylazo,or 5-ethylthio-1,3,4-thiadiazol-2-ylazo), an imide group (preferablyN-succinimide or N-phthalimide), a phosphino group (preferably asubstituted or unsubstituted phosphino group having 2 to 30 carbonatoms, for example, dimethylphosphino, diphenylphosphino, or methylphenoxyphosphino), a phosphinyl group (preferably a substituted orunsubstituted phosphinyl group having 2 to 30 carbon atoms, for example,phosphinyl, dioctyloxyphosphinyl, or diethoxyphosphinyl), aphosphinyloxy group (preferably a substituted or unsubstitutedphosphinyloxy group having 2 to 30 carbon atoms, for example,diphenoxyphosphinyloxy or dioctyloxyphosphinyloxy), a phosphinylaminogroup (preferably a substituted or unsubstituted phosphinylamino grouphaving 2 to 30 carbon atoms, for example, dimethoxyphosphinylamino ordimethylaminophosphinylamino), and a silyl group (preferably asubstituted or unsubstituted silyl group having 3 to 30 carbon atoms,for example, trimethyl silyl, t-butyl dimethyl silyl, or phenyl dimethylsilyl).

Among the above functional groups, from the functional groups havinghydrogen atoms, the hydrogen atoms may be removed, and then thefunctional groups may be substituted with the above groups. Examples ofsuch functional groups include an alkylcarbonylaminosulfonyl group, anarylcarbonylaminosulfonyl group, an alkylsulfonylaminocarbonyl group, anarylsulfonylaminocarbonyl group, methylsulfonylaminocarbonyl,p-methylphenylsulfonylaminocarbonyl, acetylaminosulfonyl, and abenzoylaminosulfonyl group.

The alkoxy group represented by R¹ and R² represents a substituted orunsubstituted linear, branched, or cyclic alkoxy group. The alkoxy grouppreferably has 1 to 50 carbon atoms, more preferably has 1 to 30 carbonatoms, and particularly preferably has 1 to 20 carbon atoms. Preferableexamples thereof include methoxy, ethoxy, n-propoxy, isopropoxy,cyclopropoxy, butoxy, isobutoxy, t-butoxy, sec-butoxy, pentyloxy,isopentyloxy, neopentyloxy, t-pentyloxy, hexyloxy, cyclohexyloxy,pentyloxy, cyclopentyloxy, octyloxy, 2-ethylhexyloxy, nonyloxy,decyloxy, dodecyloxy, tetradecyloxy, hexadecyloxy, octadecyloxy,eicosyloxy, docosyloxy, triacontyloxy, and the like. Among these,methoxy, ethoxy, n-propoxy, isopropoxy, butoxy, isobutoxy, t-butoxy,sec-butoxy, pentyloxy, isopentyloxy, neopentyloxy, hexyloxy,cyclohexyloxy, octyloxy, 2-ethylhexyloxy, dodecyloxy, hexadecyloxy, andoctadecyloxy are preferable; and methoxy, ethoxy, n-propoxy, isopropoxy,t-butoxy, pentyloxy, isopentyloxy, hexyloxy, cyclohexyloxy, octyloxy,2-ethylhexyloxy, dodecyloxy, hexadecyloxy, and octadecyloxy areparticularly preferable.

The aryl group represented by R¹, R², and R³ represents a substituted orunsubstituted aryl group. The aryl group preferably has 6 to 50 carbonatoms, more preferably has 6 to 30 carbon atoms, and particularlypreferably has 6 to 20 carbon atoms. Preferable examples thereof includephenyl, 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 2-ethylphenyl,4-ethylphenyl, 2,4-dimethylphenyl, 2,6-dimethylphenyl,2,4,6-trimethylphenyl, 1-naphthyl, 2-naphthyl, 2-chlorophenyl,3-chlorophenyl, 4-chlorophenyl, 2-methoxyphenyl, 3-methoxyphenyl,4-methoxyphenyl, 2-benzylphenyl, 4-benzylphenyl, 2-methylcarbonylphenyl,4-methylcarbonylphenyl, and the like.

Among these, phenyl, 2-methylphenyl, 4-methylphenyl, 2-ethylphenyl,4-ethylphenyl, 2,4-dimethylphenyl, 2,6-dimethylphenyl,2,4,6-trimethylphenyl, 1-naphthyl, 2-naphthyl, 2-chlorophenyl,4-chlorophenyl, 2-methoxyphenyl, 3-methoxyphenyl, 4-methoxyphenyl,2-benzylphenyl, 4-benzylphenyl, and the like are more preferable, andphenyl and the like are particularly preferable.

The aryl group represented by R¹, R², and R³ may further have asubstituent, and examples of the substituent include the substituents ofthe alkyl group represented by the R′, R², and R³.

The aryloxy group represented by R¹ and R² represents a substituted orunsubstituted aryloxy group. The aryloxy group preferably has 6 to 50carbon atoms, more preferably has 6 to 30 carbon atoms, and particularlypreferably has 6 to 20 carbon atoms. Preferable examples thereof includephenoxy, 2-methylphenoxy, 3-methylphenoxy, 4-methylphenoxy,2-ethylphenoxy, 4-ethylphenoxy, 2,4-dimethylphenoxy,2,4-di-t-butylphenoxy, 2,6-di-t-butylphenoxy, 2,6-dimethylphenoxy,2,6-di-t-butyl-4-methylphenoxy, 2,4,6-trimethylphenoxy,2,4,6-tri-t-butylphenoxy, 1-naphthyloxy, 2-naphthyloxy, 2-chlorophenoxy,3-chlorophenoxy, 4-chlorophenoxy, 2-methoxyphenoxy, 3-methoxyphenoxy,4-methoxyphenoxy, 2-benzylphenoxy, 4-benzylphenoxy,2-methylcarbonylphenoxy, 4-methylcarbonylphenoxy, and the like.

Among these, phenyl, 2,4,-di-t-butylphenoxy, 2,4,6-tri-t-butylphenoxy,and the like are more preferable.

The aryloxy group represented by R¹ and R² may further have asubstituent. Examples of the substituent include the substituents of thealkyl group represented by the R¹, R², and R³.

In Formula (1), at least one of the R¹ and R² is preferably an alkoxygroup or an aryloxy group, and R³ is preferably an aryl group. Moreover,in terms of the resistance to moist heat, R¹ and R² are preferably analkoxy group or an aryloxy group, and R³ is preferably an alkyl group oran aryl group.

In Formula (1), at least two among R¹, R², and R³ may be linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond.

When one hydrogen atom is removed from at least one of the R¹, R², andR³, the compound represented by Formula (1) becomes a monovalent group,and the compound represented by Formula (1) includes a compound havingplural structures represented by Formula (1) that are formed when themonovalent group is linked to at least one of the R¹, R², and R³ throughan organic group having a valency of 2 or higher or through a singlebond in a single molecule.

Specifically, for example, when one hydrogen atom is removed from thealkyl group, aryl group, alkoxy group, or aryloxy group represented byat least one of the R¹, R², and R³, an alkylene group, an arylene group,an oxyalkylene group, or an arylether group is formed. Examples of thecompound represented by Formula (1) include compounds formed when such amonovalent group is linked to at least one of the alkyl group, arylgroup, alkoxy group, or aryloxy group represented by at least one of theR¹, R², and R³ through an organic group having a valency of 2 or higheror through a single bond.

Alternatively, when the alkyl group, aryl group, alkoxy group, oraryloxy group represented by at least one of the R¹, R², and R³ has theaforementioned substituent, if one hydrogen atom is removed from thesubstituent, a monovalent group is formed. Examples of the compoundrepresented by Formula (1) include compounds formed when such amonovalent group is linked to at least one of the alkyl group, arylgroup, alkoxy group, or an aryloxy group represented by at least one ofthe R¹, R², and R³ or linked to at least one of the substituent of thealkyl group, aryl group, alkoxy group, or an aryloxy group through anorganic group having a valency of 2 or higher or through a single bond.

Examples of the organic group having a valency of 2 or higher includesgroup having a valency of 2 or higher that are formed when one or morehydrogen atoms are removed from the substituents exemplified for thealkyl groups represented by the R¹, R², and R³.

Among the organic group and single bond, a single bond or a group havinga valency of 2 or higher that is formed when one or more hydrogen atomsare removed from an alkyl group, an aryl group, a bisaryl group, anarylalkyl aryl group, an aryloxyaryl group, an alkoxyalkyl group, analkoxyaryl group, or an alkylaryl group is preferable.

When the compound represented by Formula (1) is a compound having pluralstructures represented by Formula (1) in a single molecule, the numberof phosphorus atoms in the single molecule is preferably from 2 to 20,more preferably from 2 to 10, and even more preferably from 2 to 5.

Specific examples of the compound represented by the Formula (1) will beshown below, but the present invention is not limited thereto.

Moreover, as the compound represented by Formula (1), a phosphorous acidester compound described in JP 2011-527357A can also be preferably used.

In the compound represented by the Formula (2), each of R⁴ and R⁵represents an alkyl group.

The alkyl group represented by R⁴ and R⁵ represents a substituted orunsubstituted linear, branched, or cyclic alkyl group. The alkyl grouppreferably has 1 to 50 carbon atoms, more preferably has 2 to 30 carbonatoms, and particularly preferably has 2 to 20 carbon atoms. Preferableexamples of the alkyl group include methyl, ethyl, n-propyl, isopropyl,cyclopropyl, butyl, isobutyl, t-butyl, sec-butyl, pentyl, isopentyl,neopentyl, t-pentyl, hexyl, cyclohexyl, heptyl, cyclopentyl, octyl,2-ethylhexyl, nonyl, decyl, dodecyl, tetradecyl, hexadecyl, octadecyl,eicosyl, docosyl, triacontyl, and the like. Among these, methyl, ethyl,n-propyl, isopropyl, butyl, isobutyl, t-butyl, sec-butyl, pentyl,isopentyl, neopentyl, hexyl, cyclohexyl, octyl, 2-ethylhexyl, dodecyl,hexadecyl, and octadecyl are more preferable; and methyl, ethyl,n-propyl, isopropyl, butyl, t-butyl, pentyl, isopentyl, hexyl,cyclohexyl, octyl, 2-ethylhexyl, dodecyl, hexadecyl, and octadecyl areparticularly preferable.

The alkyl group represented by R⁴ and R⁵ may further have a substituent.Examples of the substituent include a halogen atom, an alkyl group(including a cycloalkyl group), alkenyl group (including a cycloalkenylgroup and a bicycloalkenyl group), an alkynyl group, an aryl group, acyano group, a hydroxyl group, a nitro group, a carboxyl group, analkoxy group, an aryloxy group, an acyloxy group, a carbamoyloxy group,an alkoxycarbonyloxy group, an aryloxycarbonyloxy group, an amino group(including an anilino group), an acylamino group, an aminocarbonylaminogroup, an alkoxycarbonylamino group, an aryloxycarbonylamino group, anacyl group, an aryloxycarbonyl group, an alkoxycarbonyl group, and acarbamoyl group.

Among the substituted alkyl groups represented by R⁴ and R⁵, analkoxycarbonylalkylene group is preferable. In thealkoxycarbonylalkylene group, the number of carbon atoms of thealkoxycarbonyl group is preferably 2 to 50, more preferably 5 to 30, andparticularly preferably 9 to 20.

R⁴ and R⁵ in Formula (2) may be linked to each other through an organicgroup having a valency of 2 or higher or through a single bond. Herein,the organic group having a valency of 2 or higher is the same asdescribed for the Formula (1), and a preferable range thereof is alsothe same.

Moreover, the compound represented by Formula (2) becomes a monovalentgroup when one hydrogen atom is removed from at least one of the R⁴ andR⁵, and the compound represented by Formula (2) includes a compoundhaving plural structures represented by Formula (2) that are formed whenthe monovalent group is linked to at least one of the R⁴ and R⁵ throughan organic group having a valency of 2 or higher or through a singlebond in a single molecule. Herein, the organic group having a valency of2 or higher is the same as described for the Formula (1), and apreferable range thereof is also the same.

Specific examples of the compound represented by the Formula (2) will beshown below, but the present invention is not limited thereto.

A content of the (b) component compound in the conductive composition ofthe present invention, (a total content of plural kinds of compoundswhen the conductive composition contains the plural kinds of compounds)is preferably from 0.005 mmol to 30 mmol, and more preferably from 0.01mmol to 5 mmol, per 1 g of the (a) conductive metal fibers. When theamount of the (b) component compound added is equal to or greater than0.005 mmol, the addition of the (b) component compound tends to bring asufficient effect. When the amount thereof added is equal to or smallerthan 30 mmol, deterioration of resistance that are assumed to resultfrom hindered contact between conductive metal fibers tends to beinhibited.

A molecular weight of the (b) component compound is preferably from 200to 10,000, more preferably from 250 to 5,000, and even more preferablyfrom 250 to 2,000. When the molecular weight is equal to or greater than200, volatility is suppressed, and heat resistance tends to becomeexcellent. When the molecular weight is equal to or smaller than 10,000,deterioration of diffusivity in the film is suppressed, and a sufficienteffect tends to be obtained. When the conductive composition containsplural kinds of compounds as the (b) component compound, a totalmolecular weight of all of the compounds is preferably from 200 to10,000.

Among the (b) component compounds, from the viewpoint of conductivityunder a high-temperature condition, the compound represented by Formula(2) is preferable. Moreover, from the viewpoint of conductivity in thepresence of ozone, the compound represented by Formula (1) ispreferable.

Furthermore, as the (b) component compound, the compound represented byFormula (1) and the compound represented by Formula (2) may be usedconcurrently. The concurrent use makes it possible to improve both theperformances including heat resistance and ozone resistance.

For producing the (b) component compound, any known method can be used.Various conditions such as temperature, selection of a solvent, and thetype and amount of a reaction reagent in producing the compound can beeasily set according to those skilled in the art. The conditions can beset experimentally, and those skilled in the art can easily produce thecompound. Moreover, commercially available products may be used as thecompound.

The conductive composition of the present invention is applied onto asubstrate to form a conductive layer. Furthermore, the conductivecomposition of the present invention contains the (b) componentcompound. However, as described above, the (b) component compound canexerts its own effect, in a case where it is added to a layer cominginto contact with the conductive layer, in addition to a case where itis added to the conductive layer containing the (a) conductive metalfibers. Moreover, the (b) component compound may be added to anotherlayer (for example, a soluble protective layer or an undercoat layer)coming into contact with the conductive layer containing the (a)conductive metal fibers, such that the (b) component compound isintroduced into the conductive layer by being caused to diffuse to theconductive layer from the aforementioned another layer.

(b-1) Compounds Represented by Formulae (3) to (11)

It is preferable for the conductive composition of the present inventionto further contain compounds represented by the following Formulae (3)to (11) in addition to the (b) component compound.

In Formula (3), V₃ represents a hydrogen atom or a substituent.

In Formula (4), V₄ represents a hydrogen atom or a substituent.

In Formula (5), V₅ represents a hydrogen atom or a substituent, and eachof R₅₁ and R₅₂ independently represents a hydrogen atom or a group thatcan be substituted with a nitrogen atom.

In Formula (6), V₆ represents a hydrogen atom or a substituent, and eachof R₆₁ and R₆₂ independently represents a hydrogen atom or a group thatcan be substituted with a nitrogen atom.

In Formula (7), V₇ represents a hydrogen atom or a substituent, and eachof R₇₁ and R₇₂ independently represents a hydrogen atom or asubstituent.

In Formula (8), V₅ represents a hydrogen atom or a substituent, and eachof R₈₁ and R₈₂ independently represents a hydrogen atom or asubstituent.

In Formula (9), V₉ represents a hydrogen atom or a substituent, and eachof R₉₁, R₉₂, R₉₃, and R₉₄ independently represents a hydrogen atom or agroup that can be substituted with a nitrogen atom.

In Formula (10), V₁₀ represents a hydrogen atom or a substituent, andeach of R₁₀₁, R₁₀₂, R₁₀₃, and R₁₀₄ independently represents a hydrogenatom or a group that can be substituted with a nitrogen atom.

In Formula (11), R₁₁₁ represents a hydrogen atom or a group that can besubstituted with a nitrogen atom, and each of V₁₁₁, V₁₁₂, V₁₁₃, and V₁₁₄independently represents a hydrogen atom or a substituent. V₁₁₁ and V₁₁₂as well as V₁₁₃ and V₁₁₄ may form a bicyclo ring or a tricyclo ring bybeing linked to each other.

When the (b) component compound is used together with at least one kindof compound selected from the compounds represented by the Formulae (3)to (11), an effect may be exerted for the following reason, though it isnot a definite reason.

The compounds represented by the Formulae (3) to (11) are considered tofunction to deactivate the radical spices generated in the conductivelayer or in a layer coming into contact with the conductive layer.

Accordingly, from the viewpoint of inhibiting deterioration ofconductivity, it is preferable to use the compounds represented byFormulae (3) to (11) that can deactivate the radical spices,concurrently with the (b) component compound that can deactivateperoxide generated by the radical species.

In Formula (3), V₃ represents a hydrogen atom or a substituent. Thegroup represented by V₃ in Formula (3) shows a binding form in which thegroup binds to any substitutable position of a cyclic structurecontained in Formula (3), in any number within a range from 1 to 4. WhenV₃ represents a substituent, preferable examples of the substituentinclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1). When there are plural groupsrepresented by V₃ in Formula (3), the groups may be the same as ordifferent from each other and may form a ring by being bonded to eachother.

Specific examples of the compound represented by Formula (3) will beshown below, but the present invention is not limited thereto.

In Formula (4), V₄ represents a hydrogen atom or a substituent. Thegroup represented by V₄ in Formula (4) shows a binding form in which thegroup binds to any substitutable position of the cyclic structurecontained in Formula (4), in any number within a range from 1 to 4. WhenV₄ represents a substituent, preferable examples of the substituentinclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1). When there are plural groupsrepresented by V₄ in Formula (4), the groups may be the same as ordifferent from each other or may form a ring by being bonded to eachother.

Specific examples of the compound represented by Formula (4) will beshown below, but the present invention is not limited thereto.

V₅ in Formula (5) represents a hydrogen atom or a substituent.

The group represented by V₅ in Formula (5) shows a binding form in whichthe group binds to any substitutable position of the cyclic structurecontained in Formula (5), in any number within a range from 1 to 4. WhenV₅ represents a substituent, preferable examples of the substituentinclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1). When there are plural groupsrepresented by V₅ in Formula (5), the groups may be the same as ordifferent from each other or may form a ring by being bonded to eachother.

Each of R⁵¹ and R⁵² independently represents a hydrogen atom or a groupthat can be substituted with a nitrogen atom. Preferable examples of thegroup that can be substituted with a nitrogen atom include thesubstituents described for the alkyl group represented by R′, R², and R³of the Formula (1).

Specific examples of the compound represented by Formula (5) will beshown below, but the present invention is not limited thereto.

V₆ in Formula (6) represents a hydrogen atom or a substituent.

The group represented by V₆ in Formula (6) shows a binding form in whichthe group binds to any substitutable position of the cyclic structurecontained in Formula (6), in any number within a range from 1 to 4. WhenV₆ represents a substituent, preferable examples of the substituentinclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1). When there are plural groupsrepresented by V₆ in Formula (6), the groups may be the same as ordifferent from each other or may form a ring by being bonded to eachother.

Each of R₆₁ and R₆₂ independently represents a hydrogen atom or a groupthat can be substituted with a nitrogen atom. Preferable examples of thegroup that can be substituted with a nitrogen atom include thesubstituents described for the alkyl group represented by R′, R², and R³of the Formula (1).

Specific examples of the compound represented by Formula (6) will beshown below, but the present invention is not limited thereto.

In Formula (7), V₇ represents a hydrogen atom or a substituent.

The group represented by V₇ in Formula (7) shows a binding form in whichthe group binds to any substitutable position of the cyclic structurecontained in Formula (7), in any number within a range from 1 to 4. WhenV₇ represents a substituent, preferable examples of the substituentinclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1). When there are plural groupsrepresented by V₇ in Formula (7), the groups may be the same as ordifferent from each other or may form a ring by being bonded to eachother.

Examples of the substituent represented by R₇₁ and R₇₂ include thesubstituents described for the alkyl group represented by theaforementioned R¹, R², and R³. Among the substituents, an alkyl group,an alkenyl group, an alkynyl group, and an aryl group are preferable.Preferable examples of each of these groups include the groups describedfor the R¹, R², and R³.

When R₇₁ and R₇₂ represents substituents, these may further have asubstituent. Examples of the substituent include the substituentsdescribed for the alkyl group represented by R¹, R², and R³ of theFormula (1).

Specific examples of the compound represented by Formula (7) will beshown below, but the present invention is not limited thereto.

In Formula (8), V₈ represents a hydrogen atom or a substituent.

The group represented by V₈ in Formula (8) shows a binding form in whichthe group binds to any substitutable position of the cyclic structurecontained in Formula (8), in any number within a range from 1 to 4. WhenV₈ represents a substituent, preferable examples of the substituentinclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1). When there are plural groupsrepresented by V₈ in Formula (8), the groups may be the same as ordifferent from each other or may form a ring by being bonded to eachother.

Each of R₈₁ and R₈₂ independently represents a hydrogen atom or asubstituent.

Examples of the substituent represented by R₈₁ and R₈₂ include thesubstituents described for the alkyl group represented by the R¹, R²,and R³. Among the substituents, an alkyl group, an alkenyl group, analkynyl group, and an aryl group are preferable. Preferable examples ofeach of these groups include the groups described for the R¹, R², and R³

When R₈₁ and R₈₂ represent substituents, these groups may further have asubstituent. Examples of the substituent include the substituentsdescribed for the alkyl group represented by R¹, R², and R³ of theFormula (1).

Specific examples of the compound represented by Formula (8) will beshown below, but the present invention is not limited thereto.

In Formula (9), V₉ represents a hydrogen atom or a substituent.

The group represented by V₉ in Formula (9) shows a binding form in whichthe group binds to any substitutable position of the cyclic structurecontained in Formula (9), in any number within a range from 1 to 4. WhenV₉ represents a substituent, preferable examples of the substituentinclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1). When there are plural groupsrepresented by V₉ in Formula (9), the groups may be the same as ordifferent from each other or may form a ring by being bonded to eachother.

Each of R₉₁, R₉₂, R₉₃, and R₉₄ independently represents a hydrogen atomor a group that can be substituted with a nitrogen atom. Preferableexamples of the group that can be substituted with a nitrogen atominclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1).

Specific examples of the compound represented by Formula (9) will beshown below, but the present invention is not limited thereto.

In Formula (10), V₁₀ represents a hydrogen atom or a substituent.

The group represented by V₁₀ in Formula (10) shows a binding form inwhich the group binds to any substitutable position of the cyclicstructure contained in Formula (10), in any number within a range from 1to 4. When V₁₀ represents a substituent, preferable examples of thesubstituent include the substituents described for the alkyl grouprepresented by R¹, R², and R³ of the Formula (1). When there are pluralgroups represented by V₁₀ in Formula (10), the groups may be the same asor different from each other or may form a ring by being bonded to eachother.

Each of R₁₀₁, R₁₀₂, R₁₀₃, and R₁₀₄ independently represents a hydrogenatom or a group that can be substituted with a nitrogen atom. Preferableexamples of the group that can be substituted with a nitrogen atominclude the substituents described for the alkyl group represented byR¹, R², and R³ of the Formula (1).

Specific examples of the compound represented by Formula (10) will beshown below, but the present invention is not limited thereto.

In Formula (11), R₁₁₁ represents a hydrogen atom or a group that can besubstituted with a nitrogen atom, and each of V₁₁₁, V₁₁₂, V₁₁₃, and V₁₁₄independently represents a hydrogen atom or a substituent. V₁₁₁ and V₁₁₂as well as V₁₁₃ and V₁₁₄ may form a bicyclo ring or a tricyclo ring bybeing linked to each other.

When V₁₁₁, V₁₁₂, V₁₁₃, and V₁₁₄ represent a substituent, preferableexamples of the substituent include the substituents described for thealkyl group represented by R¹, R², and R³ of the Formula (1). V₁₁₁,V₁₁₂, V₁₁₃, and V₁₁₄ may be the same as or different from each other ormay form a ring by being bonded to each other.

Specific examples of the compound represented by Formula (11) will beshown below, but the present invention is not limited thereto.

For producing the compounds represented by Formulae (3) to (11), anyknown method can be used. Various conditions such as temperature,selection of a solvent, and type and amount of a reaction agent inproducing the compounds can be set by those skilled in the art. Theconditions can be set experimentally, and those skilled in the art caneasily product the compounds.

When the compounds represented by Formulae (3) to (11) are added to theconductive composition, the ratio of the added compounds to the (b)component compound is preferably 1,000 to 0.001, more preferably 100 to0.01, and even more preferably 10 to 0.1, in terms of a molar ratio(Formulae (3) to (11)/(b) component compound). If the molar ratio iscontrolled to be equal to or higher than 0.001, storability of theconductive metal fiber becomes excellent, and if it is controlled to beequal to or lower than 1,000, it is excellent in terms of haze of theconductive member.

The compounds represented by Formulae (3) to (11) is added to theconductive composition, in the same manner as the (b) componentcompound.

For the following reason, it is inefficient to add beforehand thecompounds represented by Formulae (3) to (11) to the conductivecomposition at the time of producing the conductive metal fiber. If thecompounds are added as above, a negative influence is exerted on controlof the shape of the conductive metal fiber in some cases. Moreover, in aprocess of washing the formed conductive metal fibers, most of thefibers are removed. Consequentially, the amount of the fiber becomessmaller than the amount required for exerting the effects of the presentinvention, and as a result, it is necessary to make up for the shortageagain.

Moreover, in a preferable embodiment of the present invention, from theviewpoint of conductivity under a high-temperature condition, it ispreferable for the compound represented by Formula (1) or (2) to becombined with the compound represented by at least one of the Formulae(3) to (11), and it is more preferable for the compound represented byFormula (2) to be combined with the compound represented by at least oneof the Formulae (3) to (11).

Furthermore, from the viewpoint of conductivity in the presence ofozone, it is preferable for the compound represented by Formula (1) orthe compound represented by Formula (2) to be combined with the compoundrepresented by at least one of the Formulae (3) to (11), and it is morepreferable for the compound represented by Formula (1) to be combinedwith the compound represented by at least one of the Formulae (3) to(11).

(c) Matrix

The conductive composition of the present invention may further containa polymerizable compound that can form a matrix. Herein, the “matrix” isa generic term of substances containing the conductive metal fibers andforming a layer and functions to keep the conductive metal fibersdispersed stably. The matrix may be non-photosensitive orphotosensitive. It is more preferable for the conductive layer tocontain the matrix, since the conductive metal fibers are kept stablydispersed in the conductive layer, and the substrate strongly adheres tothe conductive layer even when the conductive layer is directly formedon the substrate surface without the aid of an adhesive layer.

Furthermore, when the matrix is a non-photosensitive matrix asillustrated below for example, the “polymerizable compound that can forma matrix” refers to an alkoxide compound of an element selected from agroup consisting of methacrylate or acrylate which can from an organicpolymer and Si, Ti, Zr, and Al which can form an inorganic polymer, apolymer in a state of sol that is obtained by performing hydrolysis andpolycondensation on a portion of such an alkoxide compound, and thelike. In addition, when the matrix is a photosensitive matrix, thepolymerizable compound refers to an addition-polymerizable unsaturatedcompound and the like contained in the photoresist composition whichwill be described later.

When the conductive composition of the present invention contains thepolymerizable compound that can form a matrix, a content ratio of thepolymerizable compound that can form a matrix/conductive metal fibers ispreferably within an range of 0.001/1 to 100/1 in terms of a mass ratio.If the above range is set, a conductive member is obtained in which anadhesive force of the conductive layer with respect to the substrate andsurface resistance are appropriate. The content ratio of thepolymerizable compound that can form a matrix/conductive metal fibers ismore preferably within a range from 0.01/1 to 20/1, even more preferablywithin a range from 1/1 to 15/1, and particularly preferably within arange from 2/1 to 8/1, in terms of a mass ratio.

Moreover, as explained for the conductive member production method whichwill be described later, the conductive metal fibers and thepolymerizable compound that can form a matrix may be separately appliedonto the substrate so as to form a conductive layer. In this method, theconductive composition may not contain the polymerizable compound thatcan form a matrix.

[Non-Photosensitive Matrix]

The non-photosensitive matrix will be described. Preferable examples ofthe non-photosensitive matrix include matrixes containing an organicpolymer or an inorganic polymer.

Examples of the organic polymer include polymethacrylate (for example,methyl polymethacrylate and a copolymer containing polymethacrylic acidester), polyacrylate (for example, methyl polyacrylate and a copolymercontaining polyacrylic acid ester), polyacrylonitrile, polyvinylalcohol, polyester (for example, polyethylene terephthalate (PET),polyethylene naphthalate, and polycarbonate), a phenol or cresolformaldehyde resin (for example, Novolacs (registered trademark)),polymers having a high degree of aromaticity, such as polystyrene,polyvinyl toluene, polyvinyl xylene, polyimide, polyamide,polyamideimide, polyetherimide, polysulfide, polysulfone, polyphenylene,and polyphenyl ether, polyurethane (PU), an epoxy resin, polyolefin (forexample, polyethylene, polypropylene, and polycycloolefin), anacrylonitrile-butadiene-styrene copolymer (ABS), cellulose derivatives,silicone, a silicon-containing polymer (for example, polysilsesquioxaneand polysilane), polyvinyl chloride (PVC), polyacetate, polynorbornene,synthetic rubber (for example, EPR, SBR, and EPDM), afluorine-containing polymer (for example, polyvinylidene fluoride,polytetrafluoroethylene (TF(E), polyhexafluoropropylene), hydrocarbonolefin (for example, “LUMIFLON” (registered trademark) manufactured byASAHI GLASS CO., LTD.), an amorphous fluorocarbon polymer or copolymer(for example, “CYTOP” (registered trademark) manufactured by ASAHI GLASSCO., LTD. and “Teflon” registered trademark) manufactured by DuPont),and the like. However, the present invention is not limited to these.

Examples of the inorganic polymer include a cured sol-gel substanceobtained by using, as the polymerizable compound that can form a matrix,an alkoxide compound of an element selected from a group consisting ofSi, Ti, Zr, and Al, performing hydrolysis and polycondensation on thepolymerizable compound, and heating and drying the resultant ifnecessary.

The cured sol-gel substance is preferable since the material makes itpossible to easily produce a matrix highly resistant to scratch andabrasion.

The specific alkoxide compound described above is preferably a compoundrepresented by the following Formula (12).

M(OR^(p))_(a)R^(q)4-_(a)  (12)

In Formula (12), M represents an element selected from Si, Ti, Al, andZr; each of RP and R^(q) independently represents a hydrogen atom or ahydrocarbon group; and a represents an integer from 2 to 4.

Preferable examples of the hydrocarbon group represented by each of theR^(p) and R^(q) in Formula (12) include an alkyl group and an arylgroup.

When the hydrocarbon group is an alkyl group, the alkyl group preferablyhas 1 to 18 carbon atoms, more preferably has 1 to 8 carbon atoms, andeven more preferably has 1 to 4 carbon atoms. Moreover, when thehydrocarbon group is an aryl group, a phenyl group is preferable.

The alkyl group and aryl group may further have a substituent. Examplesof the substituent that can be introduced include the substituentsexemplified for the alkyl groups represented by R¹, R², and R³ of theFormula (1). It is preferable for the compound to have a molecularweight of equal to or smaller than 1,000.

Specific examples of the compound represented by Formula (12) will beshown below, but the present invention is not limited thereto.

(Alkoxysilane)

When M is Si, and a is 2, that is, when the compound is dialkoxysilane,examples thereof include dimethyl dimethoxysilane, diethyldimethoxysilane, propylmethyl dimethoxysilane, dimethyldiethoxysilane,diethyldiethoxysilane, dipropyl diethoxysilane,γ-chloropropylmethyldiethoxysilane, acetoxymethyl methyldiethoxysilane,acetoxymethyl methyl dimethoxysilane, phenylmethyl dimethoxysilane,phenylethyl di ethoxysilane, phenylmethyl dipropoxysilane, vinylmethyldimethoxysilane, vinylmethyl diethoxysilane, vinylmethyl dibutoxysilane,isopropenylmethyl dimethoxysilane, isopropenylmethyl diethoxysilane,isopropenylmethyl dibutoxysilane, and the like. Among these, from theviewpoint of easy availability and adhesiveness with respect to ahydrophilic layer, dimethyl dimethoxysilane, diethyl dimethoxysilane,dimethyl diethoxysilane, diethyl diethoxysilane, and the like areparticularly preferable.

When M is Si, and a is 3, that is, when the compound is trialkoxysilane,examples thereof include methyl trimethoxysilane, ethyltrimethoxysilane, propyl trimethoxysilane, methyl triethoxysilane, ethyltriethoxysilane, propyl triethoxysilane, chloromethyl triethoxysilane,vinyl trimethoxysilane, isopropenyl trimethoxysilane, isopropenyltriethoxysilane, and the like. Among these, from the viewpoint of easyavailability and adhesiveness with respect to a hydrophilic layer,methyl trimethoxysilane, ethyl trimethoxysilane, methyl triethoxysilane,ethyl triethoxysilane, and the like are particularly preferable.

When M is Si, and a is 4, that is, when the compound istetraalkoxysilane, examples thereof include tetramethoxysilane,tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane,methoxytriethoxysilane, ethoxytrimethoxysilane, methoxytripropoxysilane,ethoxytripropoxysilane, propoxytrimethoxysilane, propoxytriethoxysilane,dimethoxydiethoxysilane, and the like. Among these, tetramethoxysilane,tetraethoxysilane, and the like are particularly preferable.

(Alkoxytitanate)

When M is Ti, and a is 2, that is, when the compound isdialkoxytitanate, examples thereof include dimethyl dimethoxytitanate,diethyl dimethoxytitanate, propylmethyl dimethoxytitanate, dimethyldiethoxytitanate, diethyl diethoxytitanate, dipropyl diethoxytitanate,phenylethyl diethoxytitanate, phenylmethyl dipropoxytitanate, dimethyldipropoxytitanate, and the like.

When M is Ti, and a is 3, that is, when the compound istrialkoxytitanate, examples thereof include methyl trimethoxytitanate,ethyl trimethoxytitanate, propyl trimethoxytitanate, methyltriethoxytitanate, ethyl triethoxytitanate, propyl triethoxytitanate,chloromethyl triethoxytitanate, phenyl trimethoxytitanate, phenyltriethoxytitanate, phenyl tripropoxytitanate, and the like.

When M is Ti, and a is 2, that is, when the compound istetraalkoxytitanate, examples thereof include tetramethoxytitanate,tetraethoxytitanate, tetrapropoxytitanate, tetraisopropoxytitanate,tetrabutoxytitanate, and the like.

(Alkoxide of Zirconium or Aluminum)

When M is Zr, that is, when the compound is alkoxide of zirconium,examples thereof include zirconate corresponding to the compoundexemplified above as the compound containing titanium.

When M is Al, that is when the compound is alkoxide of aluminum,examples thereof include trimethoxyaluminate, triethoxyaluminate,tripropoxyaluminate, tetraethoxyaluminate, and the like.

These specific alkoxides can be easily obtained in the form ofcommercially available products. Moreover, they may be produced by aknown synthesis method, for example, a reaction between a metal chlorideand any alcohol.

As the specific alkoxide, one kind of compound may be used singly, ortwo or more kinds of compounds may be used in combination.

It is preferable for the conductive layer containing the cured sol-gelsubstance as a matrix to be formed in a manner in which an aqueoussolution containing the specific alkoxide compound is used as a coatingsolution (hereinafter, also referred to as “sol-gel coating solution”)and coated onto a substrate to form a coating solution film, reactionsincluding hydrolysis and polycondensation of the specific alkoxidecompound (hereinafter, the reactions including hydrolysis andpolycondensation are referred to as “sol-gel reaction”) are caused inthe coating solution film, and the resultant is dried if necessary byevaporating water by means of heating.

In preparing the sol-gel coating solution, a dispersion of theconductive metal fibers may be separately prepared in advance, and thenthe dispersion may be mixed with the specific alkoxide compound.Moreover, after a solution containing the specific alkoxide compound isprepared, the solution may be heated such that the solution is put in astate of sol by means of causing at least a portion of the specificalkoxide compound to undergo hydrolysis and polycondensation, and thesolution in the state of sol may be mixed with the dispersion of theconductive metal fibers to obtain the sol-gel coating solution.

(Catalyst)

When the conductive composition of the present invention contains thespecific alkoxide, in order to accelerate the sol-gel reaction, it ispreferable to add an acidic catalyst or a basic catalyst. The catalystwill be described below.

As the catalyst, any catalyst can be used as long as it accelerates thereactions including hydrolysis and polycondensation of the alkoxidecompound.

Such a catalyst include an acid or a basic compound, and these can beused as is. Alternatively, an acid or a basic compound dissolved in asolvent such as water or alcohol may be used (hereinafter, the acid andthe basic compound in such a state will be referred to as an acidiccatalyst and a basic catalyst respectively).

When the acid or basic compound is dissolved in a solvent, theconcentration thereof is not particularly limited and may beappropriately determined according to the characteristics of the acid orbasic compound to be used, an intended content of the catalyst, and thelike. When the concentration of the acid or basic compound constitutingthe catalyst is high, speed of hydrolysis and polycondensation tends tobe heightened. However, if a basic catalyst with an excessively highconcentration is used, precipitates are generated, and defects areformed in the conductive layer in some cases. Accordingly, when thebasic catalyst is used, the concentration thereof is preferably equal toor lower than 1 N expressed in terms of a concentration in an aqueoussolution.

The type of acidic catalyst or basic catalyst is not particularlylimited. However, when a catalyst with a high concentration needs to beused, it is preferable to use a compound that practically does not leaveresidue in the dried conductive layer. Specific examples of the acidiccatalyst include hydrogen halide such as hydrochloric acid, nitric acid,sulfuric acid, sulfurous acid, hydrogen sulfide, perchloric acid,hydrogen peroxide, carbonic acid, carboxylic acid such as formic acidand acetic acid, substituted carboxylic acid obtained when R of thestructural formula thereof represented by RCOOH is substituted withother elements or substituents, sulfonic acid such as benzenesulfonicacid, and the like. Examples of the basic catalyst include an ammoniacalbase such as aqueous ammonia, an amine such as ethyl amine or aniline,and the like.

A Lewis acid catalyst formed of a metal complex can also be preferablyused. Particularly, a metal complex catalyst is preferable as acatalyst, and the metal complex is constituted with a metal elementselected from group 2, group 13, group 4 and group 5 on the periodictable and an oxygen-containing oxo or hydroxy compound selected fromβ-diketone, ketoester, hydroxycarboxylic acid or an ester thereof,aminoalcohol, and an enolic active hydrogen compound.

Among the constituent metal elements, elements of group 2, such as Mg,Ca, St, and Ba, elements of group 13, such as Al and Ga, elements ofgroup 4, such as Ti and Zr, and elements of group 5, such as V, Nb, andTa are preferable. Each of these forms a complex excellent in a catalysteffect. Among these, Zr, Al, and Ti are preferable since they form anexcellent complex.

In the present invention, examples of the oxygen-containing oxo orhydroxy compound constituting a ligand of the above metal complexinclude β-diketone such as acetylacetone(2,4-pentanedione) and2,4-heptanedione, a ketoester such as methyl acetoacetate, ethylacetoacetate, and butyl acetoacetate, hydroxycarboxylic acid and anester thereof such as lactic acid, methyl lactate, salicylic acid, ethylsalicylate, phenyl salicylate, malic acid, tartaric acid, and methyltartrate, a ketoalcohol such as 4-hydroxy-4-methyl-2-heptanone,4-hydroxy-2-heptanone, 4-hydroxy-4-methyl-2-heptanone, and4-hydroxy-2-heptanone, an aminoalcohol such as monoethanolamine,N,N-dimethylethanolamine, N-methyl-monoethanolamine, diethanolamine, andtriethanolamine, an enolic active compound such as methylol melamine,methylol urea, methylol acrylamide, and malonic acid diethyl ester, acompound having a substituent on a methyl group, a methylene group, orcarbonyl carbon of acetylacetone(2,4-pentanedione).

As the ligand, an acetylacetone derivative is preferable, and in thepresent invention, the acetylacetone derivative refers to a compoundhaving a substituent on a methyl group, a methylene group, or carbonylcarbon of acetylacetone. The substituent substituted with the methylgroup of acetylacetone is a linear or branched alkyl group, acyl group,a hydroxyalkyl group, a carboxyalkyl group, an alkoxy group, or analkoxyalkyl group having 1 to 3 carbon atoms. The substituentsubstituted with the methylene group of acetylacetone is a carboxylgroup or a linear or branched carboxyalkyl group and hydroxyalkyl grouphaving 1 to 3 carbon atoms. The substituent substituted with thecarbonyl carbon of acetylacetone is an alkyl group having 1 to 3 carbonatoms. In this case, a hydrogen atom is added to carbonyl oxygen, andthus a hydroxyl group is formed.

Specific examples of preferable acetylacetone derivatives includeethylcarbonylacetone, n-propylcarbonylacetone, i-propylcarbonylacetone,diacetyl acetone, 1-acetyl-1-propionyl-acetylacetone,hydroxyethylcarbonylacetone, hydroxypropylcarbonylacetone, acetoaceticacid, acetopropionic acid, diacetoacetic acid, 3,3-diacetopropionicacid, 4,4-diacetobutyric acid, carboxyethylcarbonylacetone,carboxypropylcarbonylacetone, and diacetone alcohol. Among these,acetylacetone and diacetylacetone are particularly preferable. Thecomplex consisting of the acetylacetone derivative and theaforementioned metal element is a mononuclear complex in which 1 to 4acetylacetone derivatives are coordinated with one metal element. Whenthe number of bond of the metal element that can form a coordinate bondis greater than a total number of bond of the acetylacetone derivativethat can form a coordinate bond, ligands that are widely used in ageneral complex, such as water molecules, halogen ions, a nitro group,and an ammonio group, may be coordinated.

Preferable examples of the metal complex include atris(acetylacetonato)aluminum complex salt, adi(acetylacetonato)aluminum.aquo-complex salt, amono(acetylactonato)aluminum.chloro-complex salt, adi(diacetylacetonato)aluminum complex salt, ethylacetoacetate aluminumdiisopropylate, aluminum tris(ethylacetoacetate), cyclic aluminum oxideisopropylate, a tris(acetylacetonato)barium complex salt, adi(acetylacetonato)titanium complex salt, atris(acetylacetonato)titanium complex salt, adi-i-propoxy-bis(acetylacetonato)titanium complex salt, zirconiumtris(ethylacetoacetate), a zirconium tris(benzoic acid) complex salt,and the like. These are excellently stable in an aqueous coatingsolution and exert an excellent effect of accelerating gelation in asol-gel reaction at the time of heating and drying. Among these, ethylacetoacetate aluminum diisopropylate, aluminum tris(ethylacetoacetate),a di(acetylacetonato)titanium complex salt, and zirconiumtris(ethylacetoacetate) are particularly preferable.

The present specification does not describe a counter-salt of theaforementioned metal complex. However, any counter-salt can be used aslong as it is a water-soluble salt in the form of a complex compoundhaving neutral charge. For example, it is possible to use salts that arestoichiometrically neutral, such as a nitric acid salt, a halogen acidsalt, a sulfuric acid salt, and phosphoric acid salt.

The behavior of the metal complex in a silica sol-gel reaction isdescribed in detail in J. SoL-Gel. Sci. and Tec. 16. 209 (1999). Thefollowing scheme is assumed to be as the reaction mechanism. That is,presumably, the metal complex may have a coordinate structure and remainstable in the coating solution, and in a dehydration condensationreaction in which a step of heating and drying is started after coating,the metal complex may accelerate crosslinking in a mechanism similar tothat of an acid catalyst. In any case, by the use of the metal complex,temporal stability of the coating solution and quality of the filmsurface and durability of the conductive layer become excellent.

The metal complex catalyst is easily obtained in the form ofcommercially available product. Alternatively, it is also obtained by aknown synthesis method, for example, a reaction between a metal chlorideand an alcohol.

The catalyst according to the present invention is used preferably in anamount within a range from 0% by mass to 50% by mass and more preferablyin an amount within a range from 5% by mass to 25% by mass with respectto nonvolatile components in the sol-gel coating solution. One kind ofthe catalyst may be used singly, or two or more kinds thereof may beused in combination.

(Solvent)

If necessary, in order to form a uniform coating solution film on asubstrate, a solvent may be added to the sol-gel coating solution.

Examples of the solvent include water, a ketone-based solvent (forexample, acetone, methyl ethyl ketone, and diethyl ketone), analcohol-based solvent (for example, methanol, ethanol, 2-propanol,1-propanol, 1-butanol, and tert-butanol), a chlorine-based solvent (forexample, chloroform, and dichloromethane), an aromatic solvent (forexample, benzene, toluene, and the like), an ester-based solvent (forexample, ethyl acetate, butyl acetate, and isopropyl acetate), anether-based solvent (for example, diethylether, tetrahydrofuran, anddioxane), a glycol ether-based solvent (for example, ethylene glycolmonomethyl ether and ethylene glycol dimethyl ether), and the like.

In the coating solution film of the sol-gel coating solution formed onthe substrate, reactions including hydrolysis and condensation of thespecific alkoxide compound occur. In order to accelerate the reactions,it is preferable to heat and dry the coating solution film. The heatingtemperature for accelerating the sol-gel reaction is preferably within arange from 30° C. to 200° C., and more preferably within a range from50° C. to 180° C. The heating and drying time is preferably 10 secondsto 300 minutes, and more preferably 1 minute to 120 minutes.

It is preferable for the non-photosensitive matrix to be formed of thecured sol-gel substance since a conducive layer having a high degree offilm strength is obtained.

[Photosensitive Matrix]

Hereinafter, a photosensitive matrix will be described.

Preferable examples of the photosensitive matrix include a photoresistcomposition appropriate for a lithographic process. If the conductivelayer contains the photoresist composition as a matrix, it is preferablesince a conductive layer having a conductive region and a non-conductiveregion in the form of a pattern can be formed by a lithographic process.Particularly preferable examples of the photoresist composition includea photopolymerizable composition since this makes it possible to obtaina conductive layer which is excellent in transparency, flexibility, andadhesiveness with respect to a substrate. Hereinafter, thephotopolymerizable composition will be described.

(Photopolymerizable Composition)

The photopolymerizable composition contains, as basic components, (I) aaddition-polymerizable unsaturated compound and (II) aphotopolymerization initiator that generates radicals when beingirradiated with light. If necessary, the photopolymerizable compositionfurther contains (III) a binder and (IV) additives other than thecomponents (I) to (III).

Hereinafter, those components will be described.

(I) Addition-Polymerizable Unsaturated Compound

The addition-polymerizable unsaturated compound (hereinafter, alsoreferred to as “polymerizable compound”) as the component (I) is acompound which undergoes an addition polymerization reaction in thepresence of radicals and turns into a polymer. Generally, as such acompound, a compound having 1, preferably 2 or more, and even morepreferably 4 or more ethylenically unsaturated bonds on a molecularterminal is used. The compound is in the chemical form such as a monomeror a prepolymer, that is, a dimer, a trimer, an oligomer, and a mixtureof these. Various compounds are known as the polymerizable compound andcan be used as the component (I).

Among the compounds, as the polymerizable compound, from the viewpointof film strength, trimethylolpropane tri(meth)acrylate, pentaerythritoltetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, anddipentaerythritol penta(meth)acrylate are particularly preferable.

A content of the component (I) is preferably within a range from 2.6% bymass to 37.5% by mass, and more preferably within a range from 5.0% bymass to 20.0% by mass, based on a total mass of solid contents of theconductive composition.

(II) Photopolymerization Initiator

The photopolymerization initiator as the component (II) is a compoundthat generates radicals when being irradiated with light. Examples ofthe photopolymerization initiator include compounds generating acidradicals, which finally become an acid, compounds generating otherradicals, and the like when being irradiated with light. Hereinafter,the former will be referred to as “photoacid generator”, and the laterwill be referred to as “photoradical generator”.

—Photoacid Generator—

As the photoacid generator, a photoinitiator for photocationpolymerization, a photoinitiator for photoradical polymerization, aphotodecolorant for dyes, a photoalterant, a known compound thatgenerates acid radicals by being irradiated with actinic rays orradiation used for microresist and the like, or a mixture of these canbe appropriately selected and used.

The photoacid generator is not particularly limited and can beappropriately selected according to the purpose. Examples thereofinclude a triazine compound having at least one dihalomethyl ortrihalomethyl group, 1,3,4-oxadiazole,naphthoquinone-1,2-diazido-4-sulfonyl halide, a diazonium salt, aphosphonium salt, a sulfonium salt, an iodonium salt, imidosulfonate,oxime sulfonate, diazodisulfone, disulfone, o-nitrobenzylsulfonate, andthe like. Among these, imidosulfonate, oxime sulfonate, ando-nitrobenzylsulfonate as compounds generating sulfonic acid areparticularly preferable.

Moreover, it is possible to use groups generating acid radicals by beingirradiated with actinic rays or radiation or compounds obtained byintroducing a compound into a main chain or a side chain of a resin, forexample, the compounds described in U.S. Pat. No. 3,849,137A,DE3914407B, JP1988-26653A (JP-S63-26653A), JP1980-164824A(JP-S55-164824A), JP1987-69263A (JP-S62-69263A), JP1988-146038A(JP-S63-146038A), JP1988-163452A (JP-S63-163452A), JP1987-153853A(JP-S62-153853A), JP1988-146029A (JP-S63-146029A), and the like.

Furthermore, it is possible to use the compounds described in U.S. Pat.No. 3,779,778A, EP126712B, and the like as the acid radical generator.

—Photoradical Generator—

The photoradical generator is a compound that functions to generateradicals by means of causing a degradation reaction or a hydrogenabstraction reaction by directly absorbing light or by beingphotosensitized. It is preferable for the photoradical generator to havean absorption in a region of a wavelength of 200 nm to 500 nm

There are many compounds known as the photoradical generator, andexamples thereof include a carbonyl compound, a ketal compound, abenzoin compound, an acridine compound, an organic peroxy compound, anazo compound, a coumarin compound, an azide compound, a metallocenecompound, a hexaarylbiimidazole compound, an organic boric acidcompound, a disulfonic acid compound, an oxime ester compound, and anacylphosphine (oxide) compound described in JP2008-268884A. These can beappropriately selected according to the purpose. Among these, from theviewpoint of exposure sensitivity, a benzophenone compound, anacetophenone compound, a hexaarylbiimidazole compound, an oxime estercompound, and an acylphosphine (oxide) compound are particularlypreferable.

Examples of the benzophenone compound include benzophenone, Michler'sketone, 2-methylbenzophenone, 3-methylbenzophenone,N,N-diethylaminobenzophenone, 4-methylbenzophenone,2-chlorobenzophenone, 4-bromobenzophenone, 2-carboxybenzophenone, andthe like. One kind of these may be used singly, or two or more kindsthereof may be used concurrently.

Examples of the acetophenone compound include 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone,1-hydroxycyclohexyl phenyl ketone, α-hydroxy-2-methylphenyl propanone,1-hydroxy-1-methylethyl(p-isopropylphenyl)ketone,1-hydroxy-1-(p-dodecylphenyl)ketone,2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one,1,1,1-trichloromethyl-(p-butylphenyl)ketone,2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, and thelike. As specific examples of commercially available products thereof,Irgacure 369, Irgacure 379, Irgacure 907, and the like manufactured byBASF are preferable. One kind of these may be used singly, or two ormore kinds thereof may be used concurrently.

Examples of the hexaarylbiimidazole compound include various compoundsdescried in JP1994-29285B (JP-H06-29285B), U.S. Pat. No. 3,479,185A,U.S. Pat. No. 4,311,783A, U.S. Pat. No. 4,622,286A, and the like.Specific examples of the compounds include2,2′-bis(o-chlorophenyl)-4,4′,5,5′-tetraphenylbiimidazole,2,2′-bis(o-bromophenyl)-4,4,5,5′-tetraphenylbiimidazole,2,2′-bis(o,p-dichlorophenyl)-4,4′,5,5′-tetraphenylbiimidazole,2,2′-bis(o-chlorophenyl)-4,4′,5,5′-tetra(m-methoxyphenyl)biimidazole,2,2′-bis(o,o′-dichlorophenyl)-4,4′,5,5′-tetraphenylbiimidazole,2,2′-bis(o-nitrophenyl)-4,4′,5,5′-tetraphenylbiimidazole,2,2′-bis(o-methylphenyl)-4,4′,5,5′-tetraphenylbiimidazole,2,2′-bis(o-trifluorophenyl)-4,4′,5,5′-tetraphenylbiimidazole, and thelike. One kind of these may be used singly, or two or more kinds thereofmay be used concurrently.

Examples of the oxime ester compound include the compounds described inJ.C.S.Perkin II (1979) 1653-1660, J.C.S.Perkin II (1979) 156-162,Journal of Photopolymer Science and Technology (1995) 202-232,JP2000-66385A, JP2000-80068A, JP2004-534797A, and the like.Specifically, for example, Irgacure OXE-01, OXE-02, and the likemanufactured by BASF are preferable. One kind of these may be usedsingly, or two or more kinds thereof may be used concurrently.

Examples of the acylphosphine (oxide) compound include Irgacure 819,Darocur 4265, Darocur TPO, and the like manufactured by BASF.

From the viewpoint of exposure sensitivity and transparency, as thephotoradical generator,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone,2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one,2,2′-bis(2-chlorophenyl)-4,4,5,5′-tetraphenylbiimidazole,N,N-diethylaminobenzophenone, and Irgacure OXE-01 are particularlypreferable.

One kind of the photopolymerization initiator as the component (II) maybe used singly, or two or more kinds thereof may be used concurrently. Acontent thereof is preferably 0.1% by mass to 50% by mass, morepreferably 0.5% by mass to 30% by mass, and even more preferably 1% bymass to 20% by mass, based on a total mass of solid contents of theconductive composition. If the content is within the above range ofnumerical values, when a pattern having a conductive region and anon-conductive region, which will be described later, is formed into aconductive layer, excellent sensitivity and pattern formability areobtained.

(III) Binder

A binder can be appropriately selected from alkali-soluble resins whichare linear organic high molecular-weight polymers and have at least onegroup (for example, a carboxyl group, a phosphoric acid group, or asulfonic acid group) enhancing alkali solubility in a molecule(preferably, a molecule having an acrylic copolymer or a styrene-basedcopolymer as a main chain).

Among these, binders which are soluble in an organic solvent and in anaqueous alkaline solution are preferable, and binders which have adissociable group and become alkali-soluble when the dissociable groupis dissociated by the action of a base are particularly preferable.Herein, the dissociable group refers to a functional group that can bedissociated in the presence of a base.

For producing the binder, for example, a method performed by a knownradical polymerization method can be used. When the alkali-soluble resinis produced by the radical polymerization method, various conditionsincluding the temperature, pressure, type and amount of radicalinitiator, type of solvent, and the like can be easily set by thoseskilled in the art. The conditions can be set experimentally.

As the linear organic high-molecular weight polymer, polymers havingcarboxylic acid on a side chain are preferable.

The polymers having carboxylic acid on a side chain include amethacrylic acid copolymer, an acrylic acid copolymer, an itaconic acidcopolymer, a crotonic acid copolymer, a maleic acid copolymer, apartially esterified maleic acid copolymer, and the like described inJP1984-44615A (JP-S59-44615A), JP1979-34327B (JP-S54-34327B),JP1983-12577B (JP-S58-12577B), JP1979-25957B (JP-S54-25957B),JP1984-53836A (JP-S59-53836A), and JP1984-71048A (JP-S59-71048A). Thepolymers also include acidic cellulose derivatives having carboxylicacid on a side chain, polymers obtained by adding an acid anhydride to ahydroxyl group-containing polymer, and the like. Moreover,high-molecular weight polymers having a (meth)acryloyl group on a sidechain are also preferable examples of the polymers.

Among these, a benzyl (meth)acrylate/(meth)acrylic acid copolymer and amulti-component copolymer consisting of benzyl(meth)acrylate/(meth)acrylic acid/other monomers are particularlypreferable.

Moreover, a high-molecular weight polymer having a (meth)acryloyl groupon a side chain and a multi-component copolymer consisting of(meth)acrylic acid/glycidyl (meth)acrylate/other monomers are alsouseful examples of the polymers. The polymers can be used by being mixedwith each other in any amount.

In addition to the above, examples of the polymers include a2-hydroxypropyl (meth)acrylate/a polystyrene macromonomer/benzylmethacrylate/methacrylic acid copolymer, a 2-hydroxy-3-phenoxypropylacrylate/a polymethyl methacrylate macromonomer/benzylmethacrylate/methacrylic acid copolymer, a 2-hydroxyethyl methacrylate/apolystyrene macromonomer/methyl methacrylate/methacrylic acid copolymer,a 2-hydroxyethyl methacrylate/a polystyrene macromonomer/methylmethacrylate/methacrylic acid copolymer, and the like described inJP1995-140654A (JP-H07-140654A).

As a specific constitutional unit of the alkali-soluble resin,(meth)acrylic acid and other monomers that can be copolymerized with the(meth)acrylic acid are preferable.

Examples of other monomers that can be copolymerized with the(meth)acrylic acid include alkyl (meth)acrylate, aryl (meth)acrylate, avinyl compound, and the like. Hydrogen atoms of an alkyl group and anaryl group of these monomers may be substituted with a substituent.

Examples of the alkyl (meth)acrylate and aryl (meth)acrylate includemethyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate,butyl (meth)acrylate, isobutyl (meth)acrylate, pentyl (meth)acrylate,hexyl (meth)acrylate, octyl (meth)acrylate, phenyl (meth)acrylate,benzyl (meth)acrylate, tolyl (meth)acrylate, naphthyl (meth)acrylate,cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate,dicyclopentenyl (meth)acrylate, dicyclopentenyloxy ethyl (meth)acrylate,and the like. One kind of these may be used singly, or two or more kindsthereof may be used concurrently.

Examples of the vinyl compound include styrene, α-styrene, vinyltoluene, glycidyl methacrylate, acrylonitrile, vinyl acetate,N-vinylpyrrolidone, tetrahydrofurfuryl methacrylate, a polystyrenemacromonomer, a polymethyl methacrylate macromonomer, CH₂═CR¹R²,CH₂═C(R¹)(COOR³) [here, R¹ represents a hydrogen atom or an alkyl grouphaving 1 to 5 carbon atoms, R² represents a aromatic hydrocarbon grouphaving 6 to 10 carbon atoms, and R³ represents an alkyl group having 1to 8 carbon atoms or an aralkyl group having 6 to 12 carbon atoms], andthe like. One kind of these may be used singly, or two or more kindsthereof may be used concurrently.

In view of an alkaline dissolution rate, physical properties of thefilm, and the like, a weight average molecular weight of the binder ispreferably 1,000 to 500,000, more preferably 3,000 to 300,000, and evenmore preferably 5,000 to 200,000.

Herein, the weight average molecular weight can be measured by gelpermeation chromatography and obtained using a standard polystyrenecalibration curve.

A content of the binder as the component (III) is preferably 5% by massto 90% by mass, more preferably 10% by mass to 85% by mass, and evenmore preferably 20% by mass to 80% by mass, based on a total mass ofsolid contents of the conductive composition. If the content is withinthe above preferable range, both the developability and conductivity ofthe conductive metal fibers can be obtained at the same time.

Moreover, regarding the matrix, the aforementioned polymer compound as adispersant used for producing the conductive metal fiber can be used asat least a portion of the components constituting the matrix.

(IV) Additives Other than the Components (I) to (III)

Additives other than the components (I) to (III) may be added to thephotopolymerizable composition. Examples of the additives includevarious additives such as a sensitizer, a chain transfer agent, acrosslinking agent, a dispersant, a solvent, a surfactant, anantioxidant, an anti-sulfidizing agent, a metal corrosion inhibitor, aviscosity regulator, and a preservative.

(IV-1) Chain Transfer Agent

A chain transfer agent is used for improving exposure sensitivity of thephotopolymerizable composition. Examples of the chain transfer agentinclude N,N-dialkylamino benzoic acid alkyl ester such asN,N-dimethylamino benzoic acid ethyl ester; mercapto compounds having aheterocycle, such as 2-mercaptobenzothiazole, 2-mercaptobenzoxazole,2-mercaptobenzimidazole, N-phenylmercaptobenzimidazole, and1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione,aliphatic polyfunctional mercapto compounds such as pentaerythritoltetrakis(3-mercaptopropionate), pentaerythritoltetrakis(3-mercaptobutyrate), and 1,4-bis(3-mercaptobutyryloxy)butane;and the like. One kind of these may be used singly, or two or more kindsthereof may be used concurrently.

A content of the chain transfer agent is preferably 0.01% by mass to 15%by mass, more preferably 0.1% by mass to 10% by mass, and even morepreferably 0.5% by mass to 5% by mass, based on a total mass of solidcontents of the photopolymerizable composition containing the conductivemetal fibers.

(IV-2) Crosslinking Agent

A crosslinking agent is a compound which forms a chemical bond by a freeradical, an acid, or heat and cures the conductive layer. Examplesthereof include a melamine-based compound substituted with at least onegroup selected from a methylol group, an alkoxymethyl group, and anacyloxymethyl group, a guanamine-based compound, a glycoluril-basedcompound, a urea-based compound, a phenol-based compound, an ethercompound of phenol, an epoxy-based compound, an oxetane-based compound,a thioepoxy-based compound, an isocyanate-based compound, an azide-basedcompound, an ethylenically unsaturated group-containing compound havinga methacryloyl group, an acryloyl group, and the like. Among these, inview of physical properties of the film, heat resistance, and solventresistance, an epoxy-based compound, an oxetane-based compound, and anethylenically unsaturated group-containing compound are particularlypreferable.

One kind of the oxetane resin can be used singly, or alternatively, theoxetane resin can be used by being mixed with an epoxy resin. It isparticularly preferable to concurrently use the oxetane resin with anepoxy resin, since the reactivity and physical properties of the filmare improved.

Moreover, when an ethylenically unsaturated double bond-containingcompound is used as a crosslinking agent, the crosslinking agent is alsoincluded in the (I) polymerizable compound. It should be considered thatthe content of the crosslinking agent is included in the content of the(I) polymerizable compound of the present invention.

A content of the crosslinking agent is preferably 1 part by mass to 250parts by mass, and more preferably 3 parts by mass to 200 parts by mass,based on a total mass of solid contents of the photopolymerizablecomposition containing the conductive metal fibers.

(IV-3) Dispersant

A dispersant is used for dispersing the conductive metal fibers in thephotopolymerizable composition while preventing aggregation of theconductive metal fibers. The dispersant is not particularly limited aslong as it can disperse the conductive metal fibers, and can beappropriately selected according to the purpose. For example,dispersants commercially available as a pigment dispersant can be used,and particularly, polymer dispersants adsorbed onto the conductive metalfibers are preferable. Examples of such polymer dispersants includepolyvinylpyrrolidone, a BYK series (manufactured by BYK-Chemie), aSolsperse series (manufactured by Lubrizol Japan Limited), an Ajisperseries (manufactured by AJINOMOTO CO., INC.), and the like.

Moreover, when the polymer dispersant as a dispersant is further addedin addition to the dispersant used for producing the conductive metalfibers, it should be considered that the polymer dispersant is includedin the binder as the component (III), and the content thereof isincluded in the content of the component (III).

A content of the dispersant is preferably 0.1 parts by mass to 50 partsby mass, more preferably 0.5 parts by mass to 40 parts by mass, andparticularly preferably 1 part by mass to 30 parts by mass, with respectto 100 parts by mass of the binder as the component (III). If thecontent of the dispersant is controlled to be equal to or greater than0.1 parts by mass, aggregation of the conductive metal fibers in thedispersion is effectively inhibited. If the content is controlled to beequal to or smaller than 50 parts by mass, it is preferable since astabilized solution film is formed in the coating step, and occurrenceof coating unevenness is inhibited.

(IV-4) Solvent

A solvent is a component for obtaining the coating solution which is forforming the photopolymerizable component containing the conductive metalfibers into a film on the substrate surface. The solvent can beappropriately selected according to the purpose, and examples thereofinclude propylene glycol monomethyl ether (PGME), propylene glycolmonomethyl ether acetate (PGMEA), methanol, ethanol, 1-propanol,2-propanol, butanol, 1-methoxy-2-propanol, 3-methoxybutanol, acetone,methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methylacetate, ethyl acetate, propyl acetate, isopropyl acetate, butylacetate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, ethyllactate, γ-butyrolactone, propylene carbonate, N-methyl-2-pyrrolidinone,N-ethyl-2-pyrrolidinone, and the like. One kind of these may be usedsingly, or two or more kinds thereof may be used concurrently.

A concentration of solid contents of the coating solution containing thesolvent is preferably within a range of 0.1% by mass to 20% by mass.

(d) Other Additives

The conductive composition of the present invention may further containa compound which can be adsorbed onto a metal or a compound which can becoordinated with a metal ion, in addition to the components (a) to (c).The compound which can be adsorbed onto a metal or the compound whichcan be coordinated with a metal ion is not particularly limited and canbe appropriately selected according to the purpose. For example, anazole compound (benzotriazole, 4-methylbenzotriazole,5-methylbenzotriazole, 4-ethylbenzotrizaole, 5,6-dimethylbenzotriazole,tolyltriazole, benzyltriazole, 5,6-dimethylbenzimidazole, thiadiazole,tetrazole, and the like), a triazine compound, an ammonium compound, aphosphonium compound, a mercapto compound (2-mercaptobenzoxazole,2-mercaptobenzothiazole, 2-mercaptotetrazole, 2-mercaptopyrimidine,2-mercaptobenzimidazole, dithiothiadiazole, alkyldithiothiadiazole,alkylthiol, and the like), a sulfide compound, and a disulfide compoundare preferable.

The compound which can be adsorbed on to a metal or the compound whichcan be coordinated with a metal ion is adsorbed onto the surface ofmetal or forms a complex, and in this manner, a coat is formed. As aresult, the compound exerts a corrosion preventing effect or a rustpreventing effect, and accordingly, the effects of the present inventioncan be further improved.

It is possible to select any method as a method for adding the compoundwhich can be adsorbed onto a metal or the compound which can becoordinated with a metal ion can be added to the conductive composition.For example, the compound may be added to the conductive compositionsingly, or may be added to the conductive composition in the form of asolution obtained by dissolving or dispersing the compound in anappropriate solvent. Alternatively, the prepared conductive layer may bedipped into a solution of the compound which can be adsorbed onto ametal or into a solution of the compound which can be coordinated with ametal ion.

The amount of the added compound which can be adsorbed onto a metal orthe compound which can be coordinated with a metal ion is preferablyfrom 0.1% to 100%, more preferably from 1% to 50%, and particularlypreferably from 2% to 25%, per mass of the conductive metal fiber. Ifthe amount is controlled to be from 0.1% to 100%, occurrence ofcorrosion or rusting of the conductive metal fiber is effectivelyprevented, and at the same time, a high degree of conductive ismaintained.

It is preferable for the conductive composition of the present inventionto contain a solvent, such that the composition can be formed into aconductive layer by being coated onto an intended substrate. Inproducing the conductive metal fiber, when an aqueous dispersionobtained by dispersing the conductive metal fibers in an aqueous mediumis produced by using water as a solvent, the (b) component compound maybe added to the aqueous dispersion. It is preferable for the (b)component compound to be added within a range from 0.005 mmol to 30 mmolper 1 g of the conductive metal fibers.

Meanwhile, when a solvent other than the solvent (for example, water)used for producing the conductive metal fiber, for example, an organicsolvent such as propylene glycol monomethyl ether or propylene glycolmonomethyl ether acetate is required as a solvent of the coatingsolution of the conductive composition, solvent substitution, which isfor partially or completely substituting the solvent (for example,water) used for producing the conductive metal fiber with an intendedsolvent (for example, propylene glycol monomethyl ether acetate), may beperformed, and then the (b) component compound may be added thereto. Itis preferable for the (b) component compound to be added within a rangefrom 0.005 mmol to 30 mmol per 1 g of the conductive metal fibers.

The coating solution of the conductive composition of the presentinvention can be prepared in this manner. Examples of the solvent of thecoating solution include, in addition to the aforementioned solvent, analcohol-based solvent such as methanol, ethanol, 1-propanol, 2-propanol,butanol, 1-methoxy-2-propanol, or 3-methoxybutanol, a ketone-basedsolvent such as acetone, methyl ethyl ketone, methyl isobutyl ketone, orcyclohexanone, an ester-based solvent such as methyl acetate, ethylacetate, propyl acetate, isopropyl acetate, butyl acetate, methyl3-ethoxypropionate, methyl 3-methoxypropionate, ethyl lactate,γ-butyrolactone, or propylene carbonate, an amide-based solvent such asN-methyl-2-pyrrolidinone or N-ethyl-2-pyrrolidinone, a benzene-basedsolvent such as toluene or xylene, a mixed solvent of these, and thelike.

A concentration of the conductive metal fibers in the coating solutionis appropriately determined within a range from 0.001% by mass to 50% bymass, according to an intended thickness of the conductive layer.

The conductive composition of the present invention and the conductivemember which will be described later can be widely used in, for example,a touch panel, an electrode for display, an electromagnetic wave shield,an electrode for organic EL display, an electrode for inorganic ELdisplay, electronic paper, an electrode for flexible display, anintegrated solar cell, a liquid crystal display device, a display deviceequipped with touch panel function, and other various devices.

<Conductive Member>

The conductive member of the present invention has a conductive layer,which contains at least (a) conductive metal fibers having an averageminor-axis length from 1 nm to 150 nm and the (b) component compound, ona substrate.

The conductive layer may be directly disposed on a substrate, or may bedisposed on another layer consisting of one or plural layers such as anunder coat layer, an intermediate layer, and a cushion layer that aredisposed on a substrate. Moreover, on the conductive layer, other layerssuch as a surface-protecting layer (a soluble protective layer or thelike), a hard coating layer, an oxygen barrier layer, and an antistaticlayer may be further disposed. Particularly, when the conductive layeris formed of the conductive composition not containing the (c) matrix,it is preferable to adopt an embodiment in which an adhesive layer isdisposed in advance on a substrate, and a conductive layer constitutedwith the aforementioned conductive composition is disposed on theadhesive layer.

(Substrate)

The substrate is not particularly limited in terms of the shape,structure, size, and the like, as long as it can support the conductivelayer. The substrate can be appropriately selected according to thepurpose and can have the shape of, for example, a plate, a film, and asheet. The substrate can have a single layer structure, a laminatestructure, and the like. The substrate may be transparent or opaque.

The material of the substrate is not particularly limited and can beappropriately selected according to the purpose. Examples of thematerial include a transparent glass substrate, a sheet (film) made of asynthetic resin, a metal substrate, a ceramic plate, a silicon waferused as a semiconductor substrate, and the like.

Examples of the transparent glass substrate include white glass, blueglass, silica-coated blue glass, and the like. Moreover, a thin-filmglass substrate having a thickness of 10 μm to hundreds of μm that hasbeen developed recently may also be used.

Examples of the sheet made of a synthetic resin include a polyethyleneterephthalate (PET) sheet, a polycarbonate sheet, a triacetyl cellulose(TAC) sheet, a polyethersulfone sheet, a polyester sheet, an acrylicresin sheet, a vinyl chloride resin sheet, an aromatic polyamide resinsheet, a polyamide imide sheet, a polyimide sheet, and the like.

Examples of the metal substrate include a aluminum plate, a copperplate, a nickel plate, a stainless steel plate, and the like.

If necessary, the substrate can be treated with a chemical such as asilane coupling agent or can be subjected to pretreatment such as plasmatreatment, ion plating, sputtering, a gas-phase reaction process, orvacuum vapor deposition.

When the conductive layer of the present invention is formed onto thesubstrate used in the present invention, in order to enhanceadhesiveness of functional layers and to improve wettability of thecoating solution, it is preferable to perform pretreatment such ashydrophilizing treatment or embossing treatment on one surface or bothsurfaces of the substrate. Examples of the pretreatment include coronadischarge treatment, glow discharge treatment, plasma treatment,atmospheric plasma treatment, flame treatment, hot air treatment,ozone.UV irradiation treatment, chromic acid treatment (wet type),saponification treatment (wet type), and the like. Among these, thecorona discharge treatment and the plasma treatment (vacuum glowdischarge and atmospheric glow discharge treatment) are particularlypreferable.

[Plasma Treatment]

The plasma treatment used in the present invention is performed byvacuum glow discharge, atmospheric glow discharge, and the like.Examples of other methods include methods such as flame plasmatreatment. These can be performed using the methods described in, forexample, JP1994-123062A (JP-H06-123062A), JP1999-293011A(JP-H11-293011A), and JP1999-5857A (JP-H11-5857A).

In the plasma treatment, gas is plasma-excited by the application ofhigh-frequency voltage. As a result, glow discharge occurs betweenelectrodes, the plasma-excited gas is emitted onto the substratesurface, and consequentially, the substrate surface is modified.

The gas excited with plasma is not particularly limited. As such a gas,argon, helium, neon, krypton, xenon, nitrogen, carbon dioxide, and freonsuch as tetrafluoromethane and a mixture of these are preferable.Moreover, the gas obtained by adding reactive gas, which can provide apolar functional group such as a carboxyl group, a hydroxyl group, or acarbonyl group to the surface of a plastic film, to inert gas such asargon or neon is preferable. As the reactive gas, in addition tohydrogen, oxygen, nitrogen, and gas such as water vapor or ammonia, anorganic compound having a low boiling point, such as low hydrocarbon orketone, can be used if necessary. However, in view of handleability, thegas such hydrogen, oxygen, carbon dioxide, nitrogen, or water vapor ispreferable. When water vapor is used, it is possible to use other gasbubbled in water. Alternatively, other gas may be mixed with watervapor.

A frequency of the high-frequency voltage to be applied is preferablyused in a range from 1 kHz to 100 kHz, and more preferably used in arange from 1 kHz to 40 kHz.

The plasma treatment by glow discharge may be performed in a vacuum orin the atmosphere.

In the plasma discharge treatment by glow discharge, in order toeffectively cause discharge, the aforementioned reactive gas needs to beintroduced in a state in which the atmospheric pressure is being kept at0.005 torr to 20 torr. In order to increase the treatment rate, it ispreferable to adopt high-output conditions by setting the pressure ashigh as possible. However, if the intensity of an electric field isexcessively increased, the substrate is damaged in some cases.

When the atmospheric glow discharge, in which plasma discharge is causedat a pressure close to the atmospheric pressure, is performed, in orderto stably cause discharge, it is preferable to use the reactive gasconcurrently with inert gas such as helium or argon. However, whenplasma is generated in a pulsed electric field, the inert gas is notrequired, and the reaction rate can be increased by increasing theconcentration of the reactive gas.

[Corona Discharge Treatment]

The corona discharge treatment can be performed according to any ofknown methods described in, for example, JP1973-5043B (JP-S48-5043B),JP1972-51905B (JP-S47-51905B), JP1972-28067A (JP-S47-28067A), JP1974-83767A (JP-S49-83767A), JP1976-41770A (JP-S51-41770A), andJP1976-131576A (JP-S51-131576A). As the treatment machine, variouscommercially available corona treatment machines can be used. Forexample, a corona treatment machine manufactured by SOFTAL Korona &Plasma having multi-knife electrodes is useful since this machine isconstituted with plural electrodes and makes it possible to preventheating of a film by blowing air between electrodes and to removelow-molecular weight substances that come up to the surface of a film.Moreover, in the substrate having a conductive layer on one surfacethereof, for the surface on which the conductive layer has not beenformed, in order to avoid sparks caused between an electrode and theconductive layer, it is desirable to perform the corona treatment byusing a dielectric-coated electrode (an ceramic electrode, a quartzelectrode, or the like) as a discharge electrode and using a metal rollsuch as stainless steel as a counter electrode.

The conditions of corona treatment vary with the type of substrate to beused, the type of matrix of coating film, the type of corona treatmentmachine to be used, and the like. However, the corona treatment ispreferably performed using an irradiation energy within a range from 0.1J/m² to 10 J/m², and more preferably performed using an irradiationenergy within a range from 0.5 J/m² to 5 J/m².

When the substrate surface is subjected to hydrophilizing treatment bythe surface treatment performed in the aforementioned manner, a contactangle formed between the substrate surface and water is preferablywithin a range from 0° to 40°, more preferably within a range from 0° to20°, and even more preferably within a range from 0° to 10°.

An average thickness of the substrate is not particularly limited andcan be appropriately set according to the purpose. Generally, it ispreferable to set the average thickness within a range from 1 μm to 500μm. The average thickness is more preferably 3 μm to 400 μm, andparticularly preferably 5 μm to 300 μm. If the average thickness of thesubstrate is set to be equal to or greater than 1 μm, it is easy tohandle the conductive member. If the average thickness is set to beequal to or smaller than 500 μm, the substrate has appropriateflexibility and is handled easily, and consequentially, even when thesubstrate is used as a transfer-type conductive member, uniformtransferability is easily obtained.

When the conductive member is required to have transparency, a totalvisible light transmittance of the substrate is preferably equal to orhigher than 70%, more preferably equal to or higher than 85%, andparticularly preferably equal to or higher than 90%.

Moreover, in the present invention, as the substrate, a substrate thatis colored to an extent that does not hinder the accomplishment of theobject of the present invention can also be used.

(Conductive Layer)

The conductive layer according to the present invention contains atleast (a) conductive metal fibers having an average minor-axis lengthfrom 1 nm to 150 nm and the (b) component compound.

An average thickness of the conductive layer of the present invention ispreferably 0.01 μm to 2 more preferably 0.02 μm to 1 μm, even morepreferably 0.03 μm to 0.8 μm, and particularly preferably 0.05 μm to 0.5μm. If the average thickness of the conductive layer is equal to orgreater than 0.01 μm, it is easy to obtain a conductive layer havingsufficient durability and film strength, and in-plane distribution ofconductivity becomes uniform. Moreover, if the average thickness is setto be equal to or smaller than 2 μm, it is easy to obtain a conductivelayer having a high degree of transmittance and transparency.

A method of forming the conductive layer on a substrate is notparticularly limited, and a general coating method using theaforementioned coating solution of the conductive composition can beused. The method can be appropriately selected according to the purpose,and examples of the method include a roll coating method, a bar coatingmethod, a dip coating method, a spin coating method, a cast coatingmethod, a die coating method, a blade coating method, a gravure coatingmethod, a curtain coating method, a spray coating method, a doctorcoating method, and the like.

Furthermore, as described above, each of the (a) conductive metal fibersand the (b) component compound may be added to different players, and inthis case, the conductive composition of the present inventioncontaining the (a) conductive metal fibers and the (b) componentcompound may not be used.

For the conductive layer according to the present invention, in additionto the conductive metal fibers, other conductive materials, for example,fine conductive particles can be concurrently used, as long as they donot diminish the effects of the present invention. From the viewpoint ofthe effects, a proportion of the conductive metal fibers in theconductive layer is preferably equal to or higher than 50%, morepreferably equal to or higher than 60%, and particularly preferablyequal to or higher than 75% in terms of a volume ratio. Hereinafter, theproportion of the conductive metal fibers will be referred to as“proportion of conductive metal fibers” in some cases.

If the proportion of the conductive metal fibers is set to be equal toor higher than 50%, sufficient conductivity is easily obtained, and aconductive layer having excellent durability is easily obtained.Moreover, particles having a shape different from that of the conductivemetal fiber are not preferable since they do not make a greatcontribution to conductivity and absorb light. Particularly, when theparticles having a shape different from that of the conductive metalfiber are formed of a metal and are spherical particles that exhibitstrong plasmon absorption, transparency deteriorates in some cases.

The proportion of the conductive metal fibers can be determined in thefollowing manner. For example, when the conductive metal fiber is asilver nanowire, an aqueous dispersion containing the silver nanowiresis filtered such that the silver nanowires are separated from otherparticles, and by using an ICP optical emission spectrometer, an amountof silver remaining on the filter paper and an amount of conductivematerial filtered through the filter paper are measured respectively todetermine the proportion of the conductive metal fibers. The conductivemetal fibers remaining on the filter paper are observed with a TEM, anaverage minor-axis length of 300 strands of conductive metal fibers isobserved, and distribution thereof is investigated to detect theproportion.

The method of measuring the average minor-axis length and averagemajor-axis length of the conductive metal fibers is as described above.

(Soluble Protective Layer)

It is also preferable for the conductive member of the present inventionto have a soluble protective layer, which contains at least awater-soluble polymer, on the conductive layer. The soluble protectivelayer contains a water-soluble polymer and further contains othercomponents if necessary. The soluble protective layer of the presentinvention may contains the (b) component compound according to thepresent invention.

—Water-Soluble Polymer—

The water-soluble polymer is not particularly limited and can beappropriately selected according to the purpose. Examples thereofinclude gelatin, gelatin derivatives, casein, agar, starch, polyvinylalcohol, a polyacrylic acid copolymer, carboxyalkyl cellulose, cellulosederivatives such as water-soluble cellulose ether, polyvinylpyrrolidone, dextran, polyalkylene glycol, and the like. One kind ofthese may be used singly, or two or more kinds thereof may be usedconcurrently. Among these, polyvinyl pyrrolidone, polyvinyl alcohol, andwater-soluble cellulose derivatives are particularly preferable.

The polyvinyl pyrrolidone may be a copolymer having a polymerizationunit other than a vinyl pyrrolidone unit, and examples of such acopolymer include a vinyl pyrrolidone/vinyl acetate copolymer and thelike. The polyvinyl alcohol may be a copolymer having a polymerizationunit other than a vinyl alcohol unit, and examples of such a copolymerinclude a vinyl alcohol/vinyl pyrrolidone copolymer and the like.

Examples of the water-soluble cellulose derivatives includecarboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl methylcellulose, and the like.

Examples of the polyalkylene glycol include polyethylene glycol, anethylene glycol/propylene glycol copolymer, and the like. Among these,polyalkylene glycol having a weight average molecular weight of 5,000 to100,000 is preferable.

The aforementioned other components are not particularly limited andappropriately selected according to the purpose. Examples thereofinclude various additives such as a filler, a surfactant, anantioxidant, an anti-sulfidizing agent, a metal corrosion inhibitor, aviscosity regulator, and a preservative.

An average thickness of the soluble protective layer is preferably 0.1μm to 5 μm, more preferably 0.2 μm to 2 μm, and even more preferably 0.5μm to 1 μm. If the average thickness is equal to or greater than 0.1 μm,scratch resistance is easily improved. If the average thickness is equalto or smaller than 5 μm, the time taken for removing the solubleprotective layer is easily shortened, and it is easy to inhibit thesoluble protective layer from remaining on the conductive layer.Moreover, if the average thickness is equal to or smaller than 5 μm, thebinder of the protective layer is prevented from being mixed into theconductive fiber-containing layer and deteriorating density of theconductive fibers, and deterioration of conductivity tends to beinhibited.

Herein, the average thickness of the soluble protective layer can bemeasured by observing the cross-section of the protective layer byusing, for example, a scanning electron microscope (SEM).

The soluble protective layer can be formed by coating the surface of theconductive layer with a composition for a soluble protective layer thatcontains at least a water-soluble polymer. The composition for a solubleprotective layer contains at least a water-soluble polymer, a solvent,and other components if necessary.

The solvent is not particularly limited and can be appropriatelyselected according to the purpose. Examples thereof include methanol,ethanol, 1-propanol, 2-propanol, acetone, 2-butanone, ethyl acetate,propyl acetate, tetrahydrofuran, acetonitrile, dioxane, toluene, xylene,cyclohexanone, ethylene glycol monoethyl ether, propylene glycolmonomethyl ether, propylene glycol monomethyl ether acetate, diethyleneglycol dimethyl ether, diethylene glycol methyl ether, methyl3-methoxypropionate, ethyl 3-ethoxypropionate, N,N-dimethylformamide,acetic acid, water, and the like. One kind of these may be used singly,or two or more kinds thereof may be used concurrently. Among these,solvents that do not dissolve the conductive layer are preferable, andwater is particularly preferable.

A method of “coating” is not particularly limited and can beappropriately selected according to the purpose. Examples of the methodinclude all of general liquid-phase film forming methods such as acoating method, a printing method, and an ink jet method.

The coating method is not particularly limited and can be appropriatelyselected according to the purpose. Examples thereof include a rollcoating method, a bar coating method, a dip coating method, a spincoating method, a cast coating method, a die coating method, a bladecoating method, a gravure coating method, a curtain coating method, aspray coating method, a doctor coating method, and the like.

Examples of the printing method include a letterpress printing method, ascreen printing method, an offset printing method, a gravure printingmethod, and the like.

The soluble protective layer may be removed by the application of asolvent.

The removal of the soluble protective layer may be performed when thepattern of the conductive layer is formed or may be performed along withthe formation of pattern by a user.

The solvent used for removing the soluble protective layer is preferablyeither water or an alkaline solution.

The water is not particularly limited and can be appropriately selectedaccording to the purpose. Examples thereof include pure water such asdeionized water, ultrafiltered water, reverse osmosis water, anddistilled water, ultrapure water, and the like.

The alkali containing in the alkaline solution is not particularlylimited and can be appropriately selected according to the purpose.Examples thereof include tetramethyl ammonium hydroxide, tetraethylammonium hydroxide, 2-hydroxyethyltrimethyl ammonium hydroxide, sodiumcarbonate, sodium hydrogen carbonate, potassium carbonate, potassiumhydrogen carbonate, sodium hydroxide, potassium hydroxide, and the like.

A method of applying the water and alkaline solution is not particularlylimited and can be appropriately selected according to the purpose.Examples thereof include coating, dipping, spraying, and the like. Amongthese, dipping is particularly preferable.

A dipping time of the water and alkaline solution is not particularlylimited and can be appropriately set according to the purpose. Forexample, it is preferably 10 seconds to 5 minutes.

It is preferable to adjust a surface resistivity of the conductivemember of the present invention within a range from 1 Ω/square to 1,000Ω/square. The surface resistivity of the conductive member is preferablywithin a range from 1 Ω/square to 500 Ω/square, particularly preferablywithin a range from 1 Ω/square to 250 Ω/square, and most preferablywithin a range from 1 Ω/square to 200 Ω/square.

The surface resistivity is a value obtained by measuring the surface ofthe conductive layer opposite to the substrate side in the conductivemember according to the present invention by means of a four-point probemethod. The method of measuring surface resistivity by means of thefour-point probe method can be performed based on, for example, JIS K7194:1994 (Testing method for resistivity of conductive plastics with afour-point probe array). The surface resistivity can be simply measuredusing a commercially available surface resistivity meter. In order tocontrol the surface resistivity, at least one of the type and contentratio of the conductive metal fibers contained in the conductive layermay be adjusted. More specifically, for example, if the content ratiobetween the matrix and the conductive metal fibers is adjusted, it ispossible to form a conductive layer having a surface resistivity withinan intended range.

A total light transmittance of the conductive member according to thepresent invention is preferably equal to or higher than 70%, morepreferably equal to or higher than 85%, and particularly preferablyequal to or higher than 90%.

A haze of the conductive member according to the present invention ispreferably equal to or lower than 10%, more preferably equal to or lowerthan 5%, and particularly preferably equal to or lower than 2%.

Preferable Embodiments of the Present Invention

Examples of preferable embodiments of the conductive member of thepresent invention include the following three embodiments.

A first preferable embodiment of the present invention is a conductivemember obtained by disposing a conductive layer containing conductivemetal fibers on a substrate, in which when the conductive member isobserved in a direction vertical to the substrate surface, the entireregion of the conductive layer is a conductive region (hereinafter, sucha conductive layer will also be referred to as “non-patterned conductivelayer”).

The conductive member according to the first embodiment can bepreferably used as a transparent electrode of a solar cell, anelectromagnetic wave shielding material, an antistatic material, and thelike.

A second preferable embodiment of the present invention is a conductivemember obtained by disposing a conductive layer containing conductivemetal fibers on a substrate, in which the conductive layer has aconductive region and a non-conductive region (hereinafter, such aconductive layer will also be referred to as “patterned conductivelayer”). The non-conductive layer may or may not contain the conductivemetal fibers. When the non-conductive layer contains the conductivemetal fibers, the conductive metal fibers contained in thenon-conductive layer are cut, or contact resistance between theconductive metal fibers is extremely high, and as a result, thenon-conductive layer practically does not exhibit conductivity.

The conductive member according to the second preferable embodiment isused for preparing, for example, a touch panel or a wiring material. Inthis case, a conductive region and a non-conductive region having anintended shape are formed, and the shape of electrode formed of theconventional ITO transparent conductive film is exemplified.Specifically, examples thereof include those called a stripe pattern ordiamond pattern described in WO20051114369A, WO2004/061808A,JP2010-33478A, and JP2010-44453 A.

A third preferable embodiment of the present invention is a conductivemember obtained by disposing at least a cushion layer and a conductivelayer containing the conductive metal fibers in this order onto a firstsubstrate. This conductive member is used by transferring the conductivelayer onto a second substrate. In the present embodiment, the substrateis peeled after then conductive member is transferred to a transfermember, and the cushion layer and the conductive layer are transferredto the transfer member.

In the third embodiment, the entire region of the conductive layer maybe conductive (non-patterned conductive layer) or may be a patternedconductive layer having a conductive region and a non-conductive region.When the conductive layer is a non-patterned conductive layer, thepreferable use thereof is the same as in the aforementioned firstpreferable embodiment of the present invention. When the conductivelayer is a patterned conductive layer, preferable use and shape thereofare the same as in the aforementioned second preferable embodiment ofthe present invention.

The first preferable embodiment and the second preferable embodiment ofthe present invention will be described in detail.

The first preferable embodiment and the second preferable embodiment ofthe present invention are a conductive member obtained by disposing aconductive layer containing the conductive metal fibers on a substrate.The combination of the substrate and the conductive layer can beselected in any way according to the purpose. In the present invention,it is preferable to use the aforementioned cured sol-gel substance asthe matrix of the conductive layer.

The patterned conductive layer according to the second preferableembodiment of the present invention can be produced by, for example, thefollowing patterning method.

(1) The patterned conductive layer can be produced by a patterningmethod in which a non-patterned conductive layer is formed in advance,and high-energy laser beams of carbon dioxide laser, YAG laser, or thelike are emitted to the conductive metal fibers contained in an intendedregion of the non-patterned conductive layer so as to form the intendedregion into a non-conductive region by cutting or deleting a portion ofthe conductive metal fibers. This method is described in, for example,JP2010-4496A.

(2) The patterned conductive layer can be produced by a patterningmethod in which a negative or positive photoresist layer is disposed ona non-patterned conductive layer formed in advance; the photoresistlayer is exposed to light patternwise as intended or developed so as toform a cured resist layer having the pattern shape; and then by using awet process, in which the resist layer is treated with an etchingsolution that can etch the conductive metal fibers, or using a dryprocess such as reactive ion etching, the conductive metal fibers in theconductive layer in an unprotected region of the cured resist layer areremoved by etching. This method is described in, for example,JP2010-507199A (particularly, paragraphs <0212> to <0217>).

(3) The patterned conductive layer can be produced by a patterningmethod in which a photosensitive non-patterned conductive layer isformed in advance, and the conductive layer is exposed to lightpatternwise by means of, for example, surface exposure using a photomaskor scanning exposure using laser beams, and then developed. Thepatterning method includes an exposure step and a development step andfurther includes other steps if necessary. This method is described in,for example, JP2009-251186A.

(4) The patterned conductive layer can be produced by a patterningmethod in which a photoresist layer is disposed in the form of patternonto a non-patterned conductive layer formed in advance; the photoresistlayer is exposed to intended light or developed if necessary so as toform a cured resist layer in the form of pattern; and then by using awet process in which the resist layer is treated with an etchingsolution that can etch the conductive metal fibers or using a dryprocess such as reactive ion etching, the conductive metal fiberscontained in the conductive layer in an unprotected region in the curedresist layer are removed by etching.

(5) The patterned conductive layer can be produced by a patterningmethod in which a photoetching layer containing a compound, which canreact with the conductive metal fibers and remove conductivity of thefibers, is formed on a non-patterned conductive layer formed in advance,by exposing the conductive layer to light patternwise; and thephotoetching layer is exposed to intended light such that the conductivemetal fibers in the region irradiated with the light are insulated byoxidation, cutting, or the like.

Among the above, the methods of (1), (2), (4), and (5) are appropriatein a case where the conductive layer is constituted only with theconductive metal fibers or in a case where the conductive layer containsthe conductive metal fibers and a non-photosensitive matrix.

Moreover, a light source used for exposure described in the methods of(2), (3), (4), and (5) is selected in connection with a photosensitivewavelength region of a photoresist composition. However, generally, UVsuch as g-ray, h-ray, i-ray, or j-ray is preferably used. Moreover, ablue LED may also be used.

The pattern exposure method is not particularly limited, and may beperformed by surface exposure using a photomask or scanning exposureusing laser beams and the like. At this time, either refraction exposureusing a lens or reflection exposure using a reflecting mirror may beperformed. Moreover, it is possible to use exposure methods such ascontact exposure, proximity exposure, reduced projection exposure, andreflection projection exposure.

In the patterning methods described in (2) and (4), the resist used forthe photoresist layer is selected from any of negative and positiveresists.

The negative resist contains, for example, a photopolymerizationinitiator and a photocurable material (a monofunctional orpolyfunctional monomer or oligomer or a crosslinking group-containingpolymer). The negative resist can also contain any of additivesincluding a binder, a filler, a sensitizer, a polymerization inhibitor,a dye, a pigment, a surfactant, a thickener, a leveling agent, acrosslinking agent, an adhesion enhancer, and a solvent. Thephotopolymerization initiator can be used by being appropriatelyselected from compounds known as a photoinitiator for photoradicalpolymerization and a mixture of the compounds. The type ofphotopolymerization initiator is not particularly limited, and forexample, an alkylphenone-based compound (for example, a benzyl dimethylketal compound, an α-hydroxyalkylphenone compound, or anα-aminoalkylphenone compound), and an oxime-based compound (for example,an oxime ester-based compound) can be used. One kind of thephotopolymerization initiator may be used singly, or two or more kindsthereof may be used in combination.

The positive resist contains, for example, a photoacid generator and acuring agent. It can also contain any of additives including a binder, afiller, a sensitizer, a polymerization inhibitor, a dye, a pigment, asurfactant, a thickener, a leveling agent, a crosslinking agent, anadhesion enhancer, and a solvent.

A method of applying the resist is not particularly limited, andexamples of the method include a coating method, a printing method, anink jet method, and the like.

The coating method is not particularly limited, and examples thereofinclude a roll coating method, a bar coating method, a dip coatingmethod, a spin coating method, a cast coating method, a die coatingmethod, a blade coating method, a gravure coating method, a curtaincoating method, a spray coating method, a doctor coating method, and thelike.

Examples of the printing method include a letterpress printing method, ascreen printing method, an offset printing method, a gravure printingmethod, and the like.

In the patterning method described in (2) and (4), the solventdissolving the conductive metal fibers can be appropriate selectedaccording to the conductive metal fiber. For example, when theconductive metal fiber is a silver nanowire, examples of the solventinclude a bleach fixer, which is mainly used in a bleach-fixing step ofphotographic printing paper of a silver halide color photosensitivematerial in the field of so-called photographic science, a strong acid,an oxidant, hydrogen peroxide, and the like. Among these, the bleachfixer, dilute nitric acid, and hydrogen peroxide are more preferable,and the bleach fixer and dilute nitric acid are particularly preferable.Furthermore, when the silver nanowire is dissolved by the solvent thatdissolves the conductive metal fibers, the portion of the silvernanowire that comes into contact with the solvent does not need to becompletely dissolved, or alternatively, the portion may partially remainas long as the silver nanowire loses conductivity.

A concentration of the dilute nitric acid is preferably 1% by mass to20% by mass.

A concentration of the hydrogen peroxide is preferably 3% by mass to 30%by mass.

Regarding the bleach fixer, the treatment materials or treatment methodsdescribed in, for example, JP1990-207250A (JP-H02-207250A), p. 26, rightlower column, line 1 to p. 34, right upper column, line 9 andJP1992-97355A (JP-H04-97355A), p. 5, left upper column, line 17 to p.18, right lower column, line 20 can be preferably used.

The bleach-fixing time is preferably equal to or shorter than 180seconds, more preferably from 1 second to 120 seconds, and even morepreferably from 5 seconds to 90 seconds. Moreover, a time required forwashing with water or stabilization is preferably equal to or shorterthan 180 seconds and more preferably from 1 second to 120 seconds.

The bleach fixer is not particularly limited as long as it is a bleachfixer for photographs, and can be appropriately selected according tothe purpose. Examples thereof include CP-48S and CP-49E (bleach fixerfor color paper) manufactured by FUJIFILM Corporation, Ektacolor RAbleach fixer manufactured by KODAK CORPORATION, bleach fixersD-J2P-02-P2, D-30P2R-01, and D-22P2R-01 manufactured by Dai NipponPrinting Co., Ltd., and the like. Among these, CP-48S and CP-49E areparticularly preferable.

A viscosity of the solvent that dissolves the conductive metal fibers ispreferably 5 mPa·s to 300,000 mPa·s, more preferably 10 mPa·s to 150,000mPa·s, at 25° C. If the viscosity is controlled to be 5 mPa·s, it iseasy to control the solvent to diffuse within an intended range, and asa result, and the conductive layer having a clear boundary between aconductive region and a non-conductive region can be patterned. On thecontrary, if the viscosity is controlled to be equal to or lower than300,000 mPa·s, printing of the solvent can be performed without load,and dissolution of the conductive metal fibers can be completed withinan intended treatment time.

A method of applying the solution, which dissolves the conductive metalfibers, patternwise is not particularly limited as long as the solventcan be applied patternwise. The method can be appropriately selectedaccording to the purpose, and examples thereof include screen printing,ink jet printing, and a method of forming in advance an etching mask byusing a resist agent or the like and coating the surface of the maskwith the solvent by means of coater coating, roller coating, dipcoating, or spray coating, and the like. Among these, screen printing,ink jet printing, coater coating, and dip coating are particularlypreferable.

For the ink jet printing, for example, either piezoelectric method or athermal method can be used.

Regarding the aforementioned patterning method described in (5),examples of the patterning method of an etching agent generating anetchable chemical species such as a photoradical generator include 1) amethod of performing bar coating and then performing UV mask exposure,2) a method of performing patterning by using an ink jet and thenperforming UV solid exposure, 3) a method of performing patterning byscreen printing and then performing UV solid exposure, and the like. Theetching agent described in (5) can be removed by any method afterexposure.

It is unclear why the conductive metal fiber-containing conductivematerial can be patterned by the method described in (4). However, thereason is assumed to be as below. From a radical species generated whenthe photoradical generator absorbs light, a peracid, a peroxide, or aperoxyradical may be generated, and it may oxidize the conductive metalfibers in the conductive layer adjacent thereto. As a result, aconductive network may be destroyed, and conductivity of the destroyedportion may deteriorate. This patterning method is more advantageouscompared to the patterning method of completely removing the conductivemetal fibers by means of etching or the like, since a difference in hazebetween a conductive portion and a non-conductive portion is small, andthe pattern is not easily noticed.

In the patterning method described in (5), the photoradical generator isa compound functions to generate radicals by directly absorbing light orbeing photosensitized and causing a degradation reaction or a hydrogenabstraction reaction. It is preferable for the photopolymerizationinitiator to have an absorption in a region of a wavelength of 200 nm to900 nm, preferably in a region of a wavelength of 200 nm to 600 nm, evenmore preferably in a region of a wavelength of 250 nm to 500 nm, andparticularly preferably in a region of a wavelength of 300 nm to 500 nm.

Various compounds are known as such a photoradical generator, andexamples thereof include a carbonyl compound, an acetal compound, abenzoin compound, an acridine compound, an organic peroxy compound, anazo compound, a coumarin compound, an azide compound, a metallocenecompound, a hexaarylbiimidazole compound, an organic boric acidcompound, a disulfonic acid compound, an oxime ester compound, and anacylphosphine (oxide) compound described in JP2008-268884A. These can beappropriately selected according to the purpose. Among these, from theviewpoint of exposure sensitivity, a benzophenone compound, anacetophenone compound, a hexaarylbiimidazole compound, an oxime estercompound, and an acylphosphine (oxide) compound are particularlypreferable.

One kind of these photoradical generators may be used singly. Moreover,the photoradical generators may be diluted with an appropriate solvent,or may be mixed with a polymer, a thickener, or inorganic particles suchthat they obtain coating suitability, ink jet ejection suitability, orscreen printing suitability. Alternatively, in order to improvevisibility, the photoradical generators may be colored with a pigment ora dye added thereto.

The type of pattern is not particularly limited and can be appropriatelyselected according to the purpose. Examples thereof include letters,symbols, motifs, figures, wiring patterns, and the like.

The size of pattern is not particularly limited, and can beappropriately set according to the purpose. The size may be freely setwithin a range from nano-size to milli-size.

(Intermediate Layer)

In the first preferable embodiment and the second preferable embodimentof the present invention, it is preferable that at least oneintermediate layer be disposed between the substrate and the conductivelayer. If the intermediate layer is disposed between the substrate andthe conductive layer, at least one of the adhesiveness between thesubstrate and the conductive layer, total light transmittance of theconductive layer, haze of the conductive layer, and film strength of theconductive layer can be improved.

Examples of the intermediate layer include an adhesive layer which isfor improving adhesion force between the substrate and the conductivelayer, a functional layer which improves functionality by interactingwith the components contained in the conductive layer, and the like. Theintermediate layer to be disposed can be appropriately selected.

Components used for the intermediate layer are not particularly limited,and may improve at least one of the aforementioned characteristics. Forexample, when an adhesive layer is used as the intermediate layer, theintermediate layer contains a compound selected from a polymer used asan adhesive, a silane coupling agent, a titanium coupling agent, asol-gel film obtained by hydrolysis and polycondensation of analkoxysilane compound, and the like.

Moreover it is preferable for the intermediate layer coming into contactwith the conductive layer (that is, the intermediate layer in a casewhere the intermediate layer consists of a single layer, or theintermediate layer coming into contact with the conductive layer in acase where the intermediate layer consists of plural layers) to be afunctional layer containing a compound having a functional group thatcan interact with the conductive metal fibers contained in theconductive layer, since a conductive layer excellent in a total lighttransmittance, a haze, and a film strength is obtained. When theconductive member has such an intermediate layer, even if the conductivelayer contains the conductive metal fibers and the matrix, a conductivelayer excellent in a film strength is obtained.

The action is unclear but is considered to be as below. If theintermediate layer containing a compound having a functional group thatcan interact with the conductive metal fibers contained in theconductive layer is disposed, due to the interaction between theconductive metal fiber contained in the conductive layer and thecompound having a functional group contained in the intermediate layer,aggregation of conductive materials in the conductive layer may beinhibited, and uniform dispersity may be improved. As a result,deterioration of transparency and haze that results from the aggregationof conductive materials in the conductive layer may be inhibited, andthe film strength may be improved due to the adhesiveness. Hereinafter,the intermediate layer that shows the above interaction will be referredto as “functional layer” in some cases.

When the conductive metal fiber is, for example, a silver nanowire, thefunctional group that can interact with the conductive metal fibers ispreferably at least one kind selected from a group consisting of anamide group, an amino group, a mercapto group, a carboxylic acid group,sulfonic acid group, a phosphoric acid group, a phosphonic acid group,and a salt of these. The functional group is more preferably an aminogroup, a mercapto group, a phosphoric acid group, a phosphonic acidgroup, or a salt of these, and most preferably is an amino group.

Examples of the functional group include amide group-containingcompounds such as ureidopropyltriethoxysilane, polyacrylamide, andpoly(N-methylacrylamide); amino group-containing compounds such asN-β(aminoethyl)γ-aminopropyltrimethoxysilane,3-aminopropyltriethoxysilane, bis(hexamethylene)triamine, andpoly(2-aminoethylacrylamide); mercapto group-containing compounds suchas 3-mercaptopropyltrimethoxysilane and 2-mercaptoethyltrimethoxysilane;compounds having sulfonic acid or a slat thereof, such as poly(sodiump-styrenesulfonate) and poly(acrylamide-2-methylpropanesulfonic acid);carboxylic acid group-containing compounds such as polyacrylic acid,polymethacrylic acid, and a polyacrylic acid partial sodium salt;phosphoric acid group-containing compounds such aspoly(2-phosphonoxyethyl methacrylate); and phosphonic acidgroup-containing compounds such as polyvinyl phosphonate.

If the functional group is selected among the above, after the coatingsolution for forming a conductive layer is coated, the conductive metalfibers interact with the functional group contained in the intermediatelayer. Consequentially, it is possible to inhibit the conductive metalfibers from being aggregated in the process of drying and to form aconductive layer in which the conductive metal fibers have uniformlydispersed.

The intermediate layer can be formed by coating a solution, in which thecompound constituting the intermediate layer is dissolved, dispersed, oremulsified, onto the substrate and drying the substrate. A generalmethod can be used as the coating method without particularlylimitation, and the coating method can be appropriately selectedaccording to the purpose. Examples of the coating method include a rollcoating method, a bar coating method, a dip coating method, a spincoating method, a cast coating method, a die coating method, a bladecoating method, a gravure coating method, a curtain coating method, aspray coating method, a doctor coating method, and the like.

FIGS. 1 and 2 are schematic cross-sectional views respectively showingconductive members (1) and (2) according to the first preferableembodiment and the second preferable embodiment of the presentinvention. In FIG. 1, an intermediate layer 30, which has a firstadhesive layer 31 having excellent affinity with the substrate 10 and asecond adhesive layer 32 having excellent affinity with the conductivelayer 20, is disposed between a substrate 10 and a conductive layer 20.

In FIG. 2, the intermediate layer 30, which has a functional layer 33adjacent to the conductive layer 20 in addition to the first adhesivelayer 31 and the second adhesive layer 32 as shown in the firstpreferable embodiment, is disposed between the substrate 10 and theconductive layer 20. In the present specification, the intermediatelayer 30 refers to a layer constituted with at least one layer selectedfrom the first adhesive layer 31, the second adhesive layer 32, and thefunctional layer 33.

FIGS. 3 and 4 are schematic cross-sectional views showing conductivemembers (3) and (4) according to the third preferable embodiment of thepresent invention and a modified example of the third preferableembodiment. Herein, the conductive member (3) of FIG. 3 has a substrate1 and a cushion layer 2 and a conductive layer 3 which are disposed atone side of the substrate 1 in this order. Moreover, the conductivemember (4) of FIG. 4 is obtained by disposing an adhesive layer 4 on theconductive layer 3 of the conductive member (3) of FIG. 3.

The conductive member 3 according to the third preferable embodiment ofthe present invention will be described in detail.

The conductive member 3 has the cushion layer 2 and the conductive metalfiber-containing conductive layer 3 on the substrate 1 in this order. Ifnecessary, the conductive member 3 further has other layers.

An average thickness of the cushion layer 2 is 1 μm to 50 μm, andpreferably 5 μm to 20 μm. When the average thickness of the cushionlayer 2 is equal to or greater than 1 μm, uniform transferability andresponsiveness to concavities and convexities tend to become excellent.When the average thickness is equal to or smaller than 50 μm, colorbalance of the conductive member 3 tends to become excellent.

The conductive member of the present invention is not particularlylimited in terms of the shape, structure, size, and the like, as long asit is constituted as above. The shape, structure, size, and the like canbe appropriately selected according to the purpose. For example, theshape may be a film shape, a sheet shape, and the like, and thestructure may be a single layer structure, a laminate structure, and thelike. Furthermore, the size can be appropriately determined according tothe purpose and the like.

It is preferable for the conductive member to be flexible andtransparent. The “transparent” conductive member includes a colorlessand transparent conductive member, a colored transparent conductivemember, a translucent conductive member, a colored translucentconductive member, and the like.

(Cushion Layer)

In the third preferable embodiment, the conductive member has a cushionlayer. Due to the cushion layer, even when the conductive layer coversthe concavities and convexities of the substrate side, the conductivelayer is not cut, and responsiveness to the concavities and convexitiesis improved. The shape, structure, size, and the like of the cushionlayer are not particularly limited and can be appropriately selectedaccording to the purpose. For example, the shape may be a film shape ora sheet shape, and the structure may be a single layer structure, alaminate structure, or the like. Furthermore, the size can beappropriately determined according to the purpose or the like.

The cushion layer is a layer that plays a role of improvingtransferability with respect to a transfer medium. The cushion layercontains at least a polymer and further contains other components ifnecessary.

The polymer contained in the cushion layer is not particularly limitedas long as it is a polymer softened by heating. The polymer can beappropriately selected according to the purpose, and examples thereofinclude a thermoplastic resin and the like. Examples of thethermoplastic resin include an acrylic resin, a styrene-acryl copolymer,polyvinyl alcohol, polyethylene, an ethylene-vinyl acetate copolymer, anethylene-ethyl acrylate copolymer, an ethylene-methacrylic acidcopolymer and polyvinyl chloride gelatin; cellulose esters such ascellulose nitrate, cellulose triacetate, cellulose diacetate, celluloseacetate butyrate, and cellulose acetate propionate; homopolymers orcopolymers containing vinylidene chloride, vinyl chloride, styrene,acrylonitrile, vinyl acetate, alkyl (having 1 to 4 carbon atoms)acrylate, and vinyl pyrrolidone; soluble polyester; polycarbonate;soluble polyamide; and the like. One kind of these may be used singly,or two or more kinds thereof may be used concurrently.

A glass transition temperature of the cushion layer is preferably 40° C.to 150° C., and more preferably 90° C. to 120° C. If the glasstransition temperature is equal to or higher than 40° C., deteriorationof handleability that is caused when the cushion layer is excessivelysoftened at room temperature is inhibited. If the glass transitiontemperature is equal to or lower than 150° C., a state in whichtransferability of the conductive layer deteriorates without softeningof the cushion layer in a thermal laminate method is prevented. Theglass transition temperature may be regulated by the addition of aplasticizer or the like.

Examples of the aforementioned other components include organic polymersubstances described in the section from paragraph <0001> ofJP1993-72724A (JP-H05-72724A), various plasticizers for regulatingadhesion force between the cushion layer and the substrate, asupercooling substance, an adhesion enhancer, a filler, an antioxidant,a surfactant, a release agent, a thermal polymerization inhibitor, aviscosity regulator, a solvent, and the like.

The cushion layer can be formed by coating a coating solution for acushion layer that contains the polymer and the aforementioned othercomponents if necessary onto the substrate and drying the substrate.

The coating method is not particularly limited and can be appropriatelyselected according to the purpose. Examples thereof include a rollcoating method, a bar coating method, a dip coating method, a spincoating method, a cast coating method, a die coating method, a bladecoating method, a gravure coating method, a curtain coating method, aspray coating method, a doctor coating method, and the like.

The conductive member according to the present invention exhibitsexcellent conductivity and transparency even when being exposed to harshconditions such as a high-temperature, a high-humidity, or the presenceof ozone, and has a low surface resistivity. Accordingly, the conductivemember can be widely used in, for example, a touch panel, an electrodefor display, an electromagnetic wave shield, an electrode for organic ELdisplay, an electrode for inorganic EL display, electronic paper, anelectrode for flexible display, an integrated solar cell, a liquidcrystal display device, a display device equipped with touch panelfunction, and other various devices. Among these, the conductive membercan be particularly preferably used in a touch panel.

<Conductive Member Production Method>

The conductive member production method of the present invention is notparticularly limited as long as it is a method that can form aconductive layer, which contains at least (a) conductive metal fibershaving an average minor-axis length from 1 nm to 150 nm and the (b)component compound, on a substrate. Preferable examples of theproduction method include two methods including methods (1) and (2)described below, and examples of the method (1) include two methodsdescribed below. In any of the methods (1-1), (1-2), and (2), aconductive layer containing the conductive metal fibers as the (a)component, the (b) component compound, and the matrix as the (c)component is formed.

(1) In this method, a conductive layer is formed on a substrate by usingthe conductive composition which contains the (a) conductive metalfibers having an average minor-axis length from 1 nm to 150 nm and the(b) component compound.

Examples of the method (1) include the following methods (1-1) and(1-2).

(1-1) In this method, the conductive composition which contains the (a)conductive metal fibers having an average minor-axis length from 1 nm to150 nm and the (b) component compound is applied onto a substrate, andthen the (c) matrix is applied onto the substrate, whereby a conductivelayer containing the (a) component, the (b) component, and the (c)component is formed.

(1-2) In this method, the conductive composition which contains the (a)conductive metal fibers having an average minor-axis length from 1 nm to150 nm, the (b) component compound, and the (c) matrix is applied onto asubstrate, whereby a conductive layer containing the (a) component, the(b) component, and the (c) component is formed.

(2) In this method, the (a) conductive metal fibers having an averageminor-axis length from 1 nm to 150 nm are applied onto a substrate, andthen a composition which contains the (b) component compound and the (c)polymerizable compound that can form a matrix is applied onto thesubstrate, whereby a conductive layer containing the (a) component, the(b) component, and the (c) component is formed.

Moreover, as described above, the (b) component compound can exerts itseffect even in a case in which the compound is added to a layer adjacentto the conductive layer, in addition to a case in which the compound isadded to the conductive metal fiber-containing conductive layer.Accordingly, examples of a method of adding the (b) component compoundto the conductive layer include the following three methods.

(1) In this method, the (b) component compound is added to theconductive composition.

(2) In this method, a conductive metal fiber-containing layer is formedin advance on a substrate, and the layer is dipped into a solutioncontaining the (b) component compound.

(3) In this method, the (b) component compound is added beforehand to alayer other than the conductive layer, and the (b) component compound isintroduced into the conductive layer from other layer by diffusion whenthe conductive layer is coated and dried.

Among these, the methods (1) and (2) are preferable, and the method (1)is more preferable.

Therefore, examples of the method of producing a conductive member byusing the (a) conductive metal fiber, the (b) component compound, andthe (c) polymerizable compound that can form a matrix include thefollowing methods. These methods will be described with reference toFIGS. 5 to 8. FIGS. 5 to 8 are views illustrating an example of theconductive member production method of the present invention. All of theviews illustrate a case in which the conductive layer contains the (a)component, the (b) component compound, and the (c) component.

[1] Method Described in FIG. 5

A conductive composition, which contains conductive metal fiber 40 asthe (a) component, a (b) component compound 50, and a polymerizablecompound 60 as the (c) component that can form a matrix, is applied ontoa substrate.

This method is advantageous since it simplifies the process.

[II] Method Described in FIG. 6

A conductive composition, which contains the conductive metal fiber 40as the (a) component, and the (b) component compound 50, is applied ontoa substrate (FIG. 6A), and then a solution containing a polymerizablecompound 60 as the (c) component that can form a matrix is applied ontothe substrate (FIG. 6B).

This method is effective when the (b) component compound does not easilydissolve in the solution containing the polymerizable compound 60 as the(c) component that can form a matrix.

[III] Method Described in FIG. 7

The conductive metal fiber 40 as the (a) component is applied onto asubstrate (FIG. 7A), and then a solution containing the (b) componentcompound 50 and the polymerizable compound 60 as the (c) component thatcan form a matrix is applied onto the substrate (FIG. 7B).

This method is excellent since it can decrease contact resistancebetween the conductive metal fibers.

[IV] Method Described in FIG. 8

A solution containing the conductive metal fiber 40 as the (a) componentand the polymerizable compound 60 as the (c) component that can form amatrix is applied onto a substrate so as to form a first layer (FIG. 8A)Thereafter, as another layer, a second layer containing the (b)component compound 50 is formed on the first layer (FIG. 8B), and thenthe (b) component compound 50 is caused to diffuse to the first layerfrom the second layer (FIG. 8C).

This method is excellent since it makes it possible to avoid influenceof the (b) component compound when the (b) component compound exerts aninfluence on the diffusivity or contact resistance of the conductivemetal fiber.

In FIG. 8, another layer comes into contact with the surface of thefirst layer that is far from the substrate 10. However, this layer maycome into contact with the surface of the first layer that is close tothe substrate 10.

<Touch Panel>

The conductive member according to the present invention is applied to,for example, a surface capacitive touch panel, a projected capacitivetouch panel, and a resistive film touch panel. Herein, the touch panelhas a so-called touch sensor and a touch pad.

The layer constitution of an electrode portion of the touch panel sensorin the touch panel is preferably formed by one of the bonding method inwhich two transparent electrodes are bonded to each other, the method inwhich a transparent electrode is provided to both surfaces of asubstrate, the single-side jumper, the through-hole method, and asingle-side lamination method.

The surface capacitive touch panel is described in, for example,JP2007-533044A.

<Solar Cell>

The conductive member according to the present invention is also usefulas a transparent electrode in an integrated solar cell (hereinafter,also referred to as “solar cell device” in some cases). The integratedsolar cell is not particularly limited, and those generally utilized asa solar cell device can be used. Examples thereof include amonocrystalline silicon-based solar cell device, a polycrystallinesilicon-based solar cell device, an amorphous silicon-based solar celldevice constituted with single-junction, a tandem structure, or thelike, a semiconductor solar cell device of a compound of group III-Vsuch as gallium arsenide (GaAs) and indium phosphide (InP), asemiconductor solar cell device of a compound of group II-VI such ascadmium telluride (CdTe), a semiconductor solar cell device of acompound of group I-III-VI such as copper/indium/selenium (so-calledCIS), copper/indium/gallium/selenium (so-called CIGS), andcopper/indium/gallium/selenium/sulfur (so-called CIGSS), adye-sensitized solar cell device, an organic solar cell device, and thelike.

Among these, in the present invention, the solar cell device ispreferably an amorphous silicon-based solar cell device constituted witha tandem structure and a semiconductor solar cell device of a compoundof group such as copper/indium/selenium (so-called CIS),copper/indium/gallium/selenium (so-called CIGS), andcopper/indium/gallium/selenium/sulfur (so-called CIGSS).

In the amorphous silicon-based solar cell device constituted with atandem structure, amorphous silicon, a microcrystalline silicon thinfilm layer, a thin film containing these and germanium (Ge), and atandem structure consisting of two or more layers of these are used as aphotoelectric conversion layer. Moreover, plasma CVD or the like is usedfor forming a film.

The conductive member according to the present invention is applicableto all of the aforementioned solar cell devices. The conductive membermay be contained in any portion of the solar cell device, but it ispreferable for the conductive layer is disposed in a portion adjacent tothe photoelectric conversion layer. Regarding the positionalrelationship of the conductive member and the photoelectric conversionlayer, the following constitution is preferable, but the presentinvention is not limited thereto. Furthermore, the followingconstitution does not show all of the portions constituting the solarcell device but merely shows the range which makes it possible tounderstand the positional relationship of the transparent conductivelayer. Herein, the constitution shown in the bracket corresponds to theconductive member according to the present invention.

(a) [Substrate-conductive layer]-photoelectric conversion layer

(b) [Substrate-conductive layer]-photoelectric conversionlayer-[conductive layer-substrate]

(c) Substrate-electrode-photoelectric conversion layer-[conductivelayer-substrate]

(d) Rear electrode-photoelectric conversion layer-[conductivelayer-substrate]

The details of the solar cell are described in, for example,JP2010-87105A.

EXAMPLES

Hereinafter, examples of the present invention will be described, butthe present invention is not limited to the examples. Moreover, all of“%” and “part(s)” indicating content in the examples are based on mass.

In the following examples, an average diameter (average minor-axislength), an average major-axis length, and a coefficient of variation ofthe average minor-axis length of metal nanowires were measured in thefollowing manner.

<Average Diameter (Average Minor-Axis Length) and Average Major-AxisLength of Metal Nanowires>

A diameter (average minor-axis length) and a major-axis length of 300strands of metal nanowires randomly selected from metal nanowiresobserved under magnification by using a transmission electron microscope(TEM; manufactured by JEOL Ltd., JEM-2000FX) were measured. From theaverage, an average diameter (average minor-axis length) and an averagemajor-axis length of the metal nanowires were obtained.

<Coefficient of Variation of Average Minor-Axis Length (Diameter) ofMetal Nanowires>

An average minor-axis length (diameter) of 300 strands of metalnanowires randomly selected from images of the electron microscope (TEM)was measured. Moreover, a standard deviation and an average thereof werecalculated for the 300 strands of metal nanowires.

Preparation Example 1 Preparation of Silver Nanowire Dispersion (1)

First, the following additive solutions A, B, C, and D were prepared.

[Additive Solution A]

120 mg of stearyl trimethyl ammonium chloride, 12.0 g of a 10% aqueoussolution of stearyl trimethyl ammonium hydroxide, and 4.0 g of glucosewere dissolved in 240.0 g of distilled water, thereby obtaining areaction solution A-1. Moreover, 140 mg of silver nitrate powder wasdissolved in 4.0 g of distilled water, thereby obtaining an aqueoussilver nitrate solution A-1. The aqueous silver nitrate solution A-1 wasadded to the reaction solution A-1 which was being kept at 25° C. undervigorous stirring. After the addition of the aqueous silver nitratesolution A-1, the resultant was vigorously stirred for 180 minutes,thereby obtaining an additive solution A.

[Additive Solution B]

42.0 g of silver nitrate powder was dissolved in 958 g of distilledwater.

[Additive Solution C]

75 g of 25% aqueous ammonia was mixed with 925 g of distilled water.

[Additive Solution D]

400 g of polyvinyl pyrrolidone (K30) was dissolved in 1.6 kg ofdistilled water.

Thereafter, a silver nanowire dispersion (1) was prepared in thefollowing manner. 1.30 g of stearyl trimethyl ammonium bromide powder,33.1 g of sodium bromide powder, 1,000 g of glucose powder, and 115.0 gof nitric acid (1 N) were dissolved in 12.7 kg of distilled water at 80°C. While the resultant solution was being kept at 80° C. under stirringat 500 rpm, 100 g of the additive solution A, the additive solution B,and the additive solution C were sequentially added to the solution atan addition rate of 250 ml/min, 500 ml/min, and 500 ml/min respectively.After the addition, the resultant was continuously heated under stirringfor 100 minutes at 80° C. at a stirring speed of 200 rpm and then cooledto 25° C. Subsequently, the stirring speed was changed to 500 rpm, andthe additive solution D was added thereto at a rate of 500 ml/min. Thesolution obtained in this manner was taken as a preliminary liquid 101.

Next, while 1-propanol was being vigorously stirred, the preliminaryliquid 101 was added thereto at a time such that a mixing ratio betweenthe preliminary liquid 101 and 1-propanol became 1:1 in terms of volumeratio. The obtained mixed solution was stirred for 3 minutes, therebyobtaining a preliminary liquid 102. By using an ultrafiltration modulewith a molecular weight cut-off of 150,000, ultrafiltration wasperformed in the following manner. The preliminary liquid 102 wasconcentrated by 4-fold, and then addition and concentration of a mixedsolution consisting of distilled water and 1-propanol (1:1 in terms of avolume ratio) were repeated until conductivity of the finally obtainedfiltrate became equal to or lower than 50 μS/cm. The obtained filtratewas concentrated, thereby obtaining the silver nanowire dispersion (1)with a metal content of 0.48%.

For the silver nanowires of the obtained silver nanowire dispersion (1),the average minor-axis length, average major-axis length, coefficient ofvariation of minor-axis length of the silver nanowires, and averageaspect ratio were measured. As a result, it was confirmed that theaverage minor-axis length is 20.1 nm, the average major-axis length is10.5 μm, and the coefficient of variation is 19.0%. Moreover, it wasconfirmed that the average aspect ratio is 522, and a proportion of thesilver nanowires having an average aspect ratio of equal to or higherthan 50 is 82.5%. Hereinafter, the “silver nanowire dispersion (1)”indicates a silver nanowire dispersion obtained by the above method.

Preparation Example 2 Preparation of Silver Nanowire Dispersion (2)

A silver nanowire dispersion (2) with a metal content of 0.47% wasobtained in the same manner as in Preparation Example 1, except that125.0 g of distilled water was used instead of the additive solution Ain Preparation Example 1.

For the silver nanowires of the obtained silver nanowire dispersion (2),the average minor-axis length, average major-axis length, coefficient ofvariation of minor-axis length of the silver nanowires, and averageaspect ratio were measured in the aforementioned manner. As a result, itwas confirmed that the average minor-axis length is 47.0 nm, the averagemajor-axis length is 13.0 μm, and the coefficient of variation is 22.9%.Moreover, an average aspect ratio was confirmed to be 277. Hereinafter,the “silver nanowire dispersion (2)” indicates a silver nanowiredispersion obtained by the above method.

Preparation Example 3 Preparation of Silver Nanowire Dispersion (3)

60 g of silver nitrate powder was dissolved in 370 g of propyleneglycol, thereby preparing a silver nitrate solution 301. 72.0 g ofpolyvinyl pyrrolidone (molecular weight of 55,000) was added to 4.45 kgof propylene glycol, and the resultant was heated to 90° C. while agas-phase portion of the container was exposed to nitrogen gas. Thesolution obtained in this manner was taken as a reaction solution 301.In the state where the container was being exposed to nitrogen gas, 2.55g of the silver nitrate solution 301 was added to the reaction solution301 under vigorous stirring, and the resultant was heated under stirringfor 1 minute. Thereafter, to this solution, a solution obtained bydissolving 11.8 g of tetrabutyl ammonium chloride in 100 g of propyleneglycol was added, thereby obtaining a reaction solution 302.

To the reaction solution 302 which was being kept at 90° C. understirring at a stirring speed of 500 rpm, 200 g of the silver nitratesolution 301 was added at an addition rate of 50 ml/min. The stirringspeed was then decreased to 100 rpm, the nitrogen gas flow was cut, andthe resultant was heated under stirring for 15 hours. To the thusobtained solution which was being kept at 90° C. under stirring at astirring speed of 100 rpm, 220 g of the silver nitrate solution 301 wasadded at an addition rate of 0.5 ml/min. After the addition ended, theresultant was continuously heated under stirring for 2 hours. Thestirring speed was then changed to 500 rpm, 1.0 kg of distilled waterwas added to the solution, and then the resultant was cooled to 25° C.,thereby preparing a preliminary liquid 301.

By using an ultrafiltration module with a molecular weight cut-off of150,000, ultrafiltration was performed in the following manner. Theaddition of a mixed solution consisting of distilled water and1-propanol (1:1 in terms of a volume ratio) to the preliminary liquid301 and concentration of the resultant were repeated until conductivityof the finally obtained filtrate became equal to or lower than 50 μS/cm.The obtained filtrate was concentrated, thereby obtaining the silvernanowire dispersion (3) with a metal content of 0.45%.

For the silver nanowires of the obtained silver nanowire dispersion (3),the average minor-axis length, average major-axis length, coefficient ofvariation of minor-axis length of the silver nanowires, and averageaspect ratio were measured. As a result, it was confirmed that theaverage minor-axis length is 26.8 nm, the average major-axis length is14.0 μm, and the coefficient of variation is 17.9%. Moreover, theaverage aspect ratio was confirmed to be 522. Hereinafter, the “silvernanowire dispersion (3)” indicates a silver nanowire dispersion obtainedby the above method.

Preparation Example 4 Pretreatment of Glass Substrate

An alkali-free substrate having a thickness of 0.7 μm was dipped in an1% aqueous solution of sodium hydroxide and irradiated with ultrasonicwaves for 30 minutes by using an ultrasonic washing machine. Thereafter,the substrate was washed with deionized water for 60 seconds and thenheated for 60 minutes at 200° C. Subsequently, a silane couplingsolution (a 0.3% aqueous solution ofN-β(aminoethyl)γ-aminopropyltrimethoxysilane, trade name: KBM603,manufactured by Shin-Etsu Chemical Co., Ltd.) was poured over thesubstrate for 20 seconds by a shower, and then the substrate was washedwith pure water by a shower, thereby obtaining a glass substrate.Hereinafter, the “glass substrate” indicates an alkali-free glasssubstrate obtained by the above pretreatment.

Preparation Example 5 Preparation of PET Substrate 101 HavingConstitution Shown in FIG. 1

An adhesive solution 1 composed of the following components wasprepared.

(Adhesive Solution 1)

Takelac WS-4000 (polyurethane for coating, a solid content 5.0 partsconcentration of 30%, manufactured by Mitsui Chemicals, Inc.) Surfactant(Nanoacty HN-100, manufactured by Sanyo 0.3 parts Chemical Industries,Ltd.) Surfactant (Sandetto BL, a solid content concentration 0.3 partsof 43%, manufactured by Sanyo Chemical Industries, Ltd.) Water 94.4parts 

One surface of a PET film 10 having a thickness of 125 μm was subjectedto corona discharge treatment, and the adhesive solution 1 was coatedonto the surface having undergone the corona discharge treatment. Thefilm was then dried for 2 minutes at 120° C., thereby forming a firstadhesive layer 31 having a thickness of 0.11 μm.

An adhesive solution 2 composed of the following components wasprepared.

(Adhesive Solution 2)

Tetraethoxysilane (KBE-04, manufactured by Shin-Etsu 5.0 parts ChemicalCo., Ltd.) 3-Glycidoxypropyltrimethoxysilane (KBM-403, 3.2 partsmanufactured by Shin-Etsu Chemical Co., Ltd.)2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane (KBM-303, 1.8 partsmanufactured by Shin-Etsu Chemical Co., Ltd.) Aqueous acetic acidsolution (an acetic acid 10.0 parts  concentration of 0.05%, pH of 5.2)Curing agent (boric acid, manufactured by Wako 0.8 parts Pure ChemicalIndustries, Ltd) Colloidal silica (Snowtex O, an average particle 60.0parts  size of 10 nm to 20 nm, a solid content concentration of 20%, pHof 2.6, manufactured by NISSAN CHEMICAL INDUSTRIES, LTD) Surfactant(Nanoacty HN-100, manufactured by Sanyo 0.2 parts Chemical Industries,Ltd.) Surfactant (Sandetto BL, a solid content concentration 0.2 partsof 43%, manufactured by Sanyo Chemical Industries, Ltd.)

An adhesive solution 2 was prepared in the following manner. While anaqueous acetic acid solution was being vigorously stirred,3-glycidoxypropyltrimethoxysilane (KBM-403) was added dropwise to thesolution for 3 minutes. Thereafter, while the obtained aqueous aceticacid solution was being vigorously stirred,2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (KBM-303) was added theretofor 3 minutes. Next, while the aqueous acetic acid solution containingKBM-403 and KBM-303 was being vigorously stirred, tetramethoxysilane wasadded thereto for 5 minutes, and then the solution was continuouslystirred for 2 hours. Subsequently, colloidal silica, a curing agent, anda surfactant were sequentially added thereto, thereby preparing anadhesive solution 2.

The surface of the first adhesive layer 31 was subjected to coronadischarge treatment, and then the surface was coated with the adhesivesolution 2 by means of a bar coating method. Thereafter, the resultantwas heated for 1 minute at 170° C. and dried so as to form a secondadhesive layer 32 having a thickness of 0.5 μm, thereby obtaining a PETsubstrate 101 having the constitution shown in FIG. 1.

Example 1 and Comparative Example 1 Preparation of Conductive Member 1-1

An alkoxysilane compound-containing solution (hereinafter, also referredto as “sol-gel solution”) composed as below was stirred for 1 hour at60° C., and then it was confirmed that the solution is a uniformsolution.

<Solution of Alkoxysilane Compound>

Tetraethoxysilane (compound (II)) (KBE-04, manufactured 5.0 parts byShin-Etsu Chemical Co., Ltd.) 1% Aqueous acetic acid solution 10.0parts  Distilled water 4.2 parts

3.44 parts of the obtained sol-gel solution was mixed with 16.56 partsof the silver nanowire dispersion (1) obtained in Preparation Example 1,and the resultant was mixed with an aqueous solution of the compound 1-1such that a content of the compound 1-1 described in the presentspecification became 0.3 mmol with respect to 1 g of silver nanowires.Thereafter, the resultant was distilled with distilled water and1-propanol, thereby preparing a conductive layer coating solution 1-1with a silver concentration of 0.25% and a 1-propanol concentration of30%.

The surface of the second adhesive layer 32 of the PET substrate 101 wassubjected to corona discharge treatment, and the surface was coated withthe conductive layer coating solution 1-1 by a bar coating method suchthat the amount of silver became 0.012 g/m² and the total amount of thecoated solid contents became 0.096 g/m². Thereafter, the resultant wasdried for 1 minute at 140° C. so as to cause a sol-gel reaction, therebyforming a conductive layer 20. In this manner, a conductive member 1-1having the constitution shown in the cross-sectional view of FIG. 1 wasobtained.

(Preparation of Conductive Member 1-2)

A conductive member 1-2 as a comparative example was prepared by thesame method as the method of preparing the conductive member 1-1, exceptthat the compound 1-1 was not added at the time of preparing theconductive layer coating solution in the method of preparing theconductive member 1-1.

(Preparation of Conductive Members 1-3 to 1-18)

Conductive members 1-3 to 1-18 of the present invention were prepared bythe same method as the method of preparing the conductive member 1-1,except that in the method of preparing the conductive member 1-1, thetype and amount (indicated using “mmol” with respect 1 g of silvernanowires) of the (b) component compound to be added were changed asshown in Table 1.

(Preparation of Conductive Members 1-19 to 1-25)

Conductive members 1-19 to 1-25 of the present invention were preparedby the same method as the method of preparing the conductive member 1-1,except that in the method of preparing the conductive member 1-1,compounds represented by Formulae (3) to (11) were further added inaddition to of the (b) component compound (Table 1 shows the type andamount of those compounds added).

(Preparation of Conductive Members 1-26 to 1-32)

Conductive members 1-26 to 1-32 of the present invention were preparedby the same method as the method of preparing the conductive member 1-1,except that in the method of preparing the conductive member 1-1, inaddition to the (b) component compound, the following compounds A-1 toA-4 as the compound according to the present invention that can beadsorbed onto a metal or can be coordinated with a metal ion werefurther added (Table 1 shows the type and amount of those compoundsadded).

(Preparation of Conductive Members 1-33 and 1-34)

Conductive members 1-33 and 1-34 of the present invention were preparedby the same method as the method of preparing the conductive member 1-1,except that in the method of preparing the conductive member 1-1, inaddition to the (b) component compound, the compounds represented byFormulae (3) to (11) and the above compounds A-1 to A-4 as the compoundaccording to the present invention that can be adsorbed onto a metal andcan be coordinated with a metal ion were further added (Table 1 showsthe type and amount of those compounds added).

(Preparation of Conductive Members 1-35 to 1-39)

Conductive members 1-35 to 1-39 as comparative examples were prepared bythe same method as the method of preparing the conductive member 1-1,except that in the method of preparing the conductive member 1-1,instead of the (b) component compound, the compounds A-1 to A-4 as thecompound according to the present invention that can be adsorbed onto ametal or can be coordinated with a metal ion were further added (Table 1shows the type and amount of those compounds added).

(Preparation of Conductive Members 1-40 to 1-43)

Conductive members 1-40 to 1-43 as comparative examples were prepared bythe same method as the method of preparing the conductive member, exceptthat in the method of preparing the conductive member 1-1, instead ofthe (b) component compound, the following comparative compounds C-1 toC-4 were added (Table 1 shows the type and amount of those compoundsadded).

<Evaluation>

Each of the obtained conductive members was evaluated as below.Moreover, to evaluate optical characteristics, a total lighttransmittance and a level of haze were measured by the following method.Furthermore, to evaluate weather resistance, heat resistance, resistanceto moist heat, and ozone resistance were measured by the followingmethod. The results are shown in Table 1.

[Conductivity (Surface Resistivity)]

A surface resistivity of each of the conductive members was measuredusing Loresta-GP MCP-T600 manufactured by Mitsubishi ChemicalCorporation. In the measurement, in samples of 10 cm×10 cm, the surfaceresistivity of central portion of randomly selected five conductiveregions was measured, and the average was calculated. The conductivemembers were ranked as below.

5: Surface resistivity of less than 165 Ω/square, extremely excellentlevel

4: Surface resistivity of equal to or higher than 165 Ω/square but lessthan 180 Ω/square, excellent level

3: Surface resistivity of equal to or higher than 180 Ω/square but lessthan 200 Ω/square, acceptable level

2: Surface resistivity of equal to or higher than 200 Ω/square but lessthan 250 Ω/square, unproblematic level

1: Surface resistivity of equal to or higher than 250 Ω/square,seriously problematic level

[Resistivity of Conductive Member Having Undergone Patterning](Conductivity (Surface Resistivity))

For evaluation, a pattern having a size of 5 cm×5 cm was prepared.Moreover, the surface resistivity of the central portion of randomlyselected three conductive regions was measured, and average thereof wascalculated. In this manner, the conductive members were ranked as belowaccording to the surface resistivity obtained after patterning.

5: Surface resistivity of less than 165 Ω/square, extremely excellentlevel

4: Surface resistivity of equal to or higher than 165 Ω/square but lessthan 180 Ω/square, excellent level

3: Surface resistivity of equal to or higher than 180 Ω/square but lessthan 200 Ω/square, acceptable level

2: Surface resistivity of equal to or higher than 200 Ω/square but lessthan 250 Ω/square, unproblematic level

1: Surface resistivity of equal to or higher than 250 Ω/square,seriously problematic level

(Fine Line Resistivity)

A fine line resistivity of the conductive member patterned in the formof a stripe pattern or a fine line pattern was measured using a tester(manufactured by CUSTOM corporation, CDM-5000E). For the stripe pattern,the resistivity of five conductive lines of one conductive member wasmeasured, and the average was taken as the resistivity. For the fineline pattern, the resistivity of hundred lines having a line width of300 μm and a length of 30 mm was measured, and the average thereof wascalculated.

[Optical Characteristics (Total Light Transmittance)]

A total light transmittance (%) of each of the conductive members wasmeasured using Haze-Guard Plus manufactured by BYK-Gardner.

The total light transmittance of the conductive portion and anon-conductive portion having undergone patterning was measured in thefollowing sequence. It is difficult to measure the conductive portionand the non-conductive portion of an actual fine line pattern by using ahaze meter. Accordingly, a pattern for evaluation (10 mm square) was putinto a sample similar to the actual fine line pattern, and the totallight transmittance of the conductive portion was measured. The totallight transmittance was measured at an angle of 0° by using a CIEvisibility function y under a C light source. The total lighttransmittance of the central portion of randomly selected fiveconductive regions in a sample of 10 cm×10 cm was measured, and theaverage was calculated. The conductive members were ranked as below.

A: Transmittance of equal to or higher than 90%, excellent levelB: Transmittance of equal to or higher than 85% but less than 90%,slightly problematic level

[Optical Characteristics (Haze)]

A level of haze of a portion corresponding to the conductive region ofthe conductive member was measured using a Haze-Guard Plus manufacturedby BYK-Gardner. In the measurement, the haze of central portion ofrandomly selected five conductive regions of a sample of 10 cm×10 cm wasmeasured, and the average was calculated.

Moreover, the level of haze of the conductive region and thenon-conductive region having undergone patterning was measured in thefollowing sequence. It is difficult to measure the conductive portionand the non-conductive portion of an actual fine line pattern by using ahaze meter. Accordingly, a pattern for evaluation (10 mm square) was putinto a sample similar to the actual fine line pattern, and the level ofhaze of the conductive portion was measured.

[Heat Resistance]

Each of the conductive members was subjected to forced heating treatmentfor 4 hours at 180° C. by using a dry oven OFW-600 manufactured by ASONE Corporation. The surface resistivity (RDT) of each conductive memberhaving undergone the heating treatment was measured by theaforementioned method, and a ration of change of the surface resistivityto a surface resistivity (R0) measured before the heating treatment(RDT/R0) was calculated. In this manner, heat resistance of each of theconductive members was evaluated, and the conductive members were rankedas below.

Furthermore, the patterned fine lines were ranked in the same manner asthe ratio of change of fine line resistivity described above.

Rank 5: Ratio of change of surface resistivity of less than 10%,extremely excellent level

Rank 4: Ratio of change of surface resistivity of equal to or higherthan 10% but less than 20%, excellent level

Rank 3: Ratio of change of surface resistivity of equal to or higherthan 20% but less than 35%, acceptable level

Rank 2: Ratio of change of surface resistivity of equal to or higherthan 35% but less than 50%, slightly problematic level

Rank 1: Ratio of change of surface resistivity of equal to or higherthan 50%, problematic level

[Resistance to Moist Heat]

Each of the conductive members was forcedly treated with moisture andheat by being left in an environment of 85° C. and 85% RH for 240 hoursby using a compact environment tester SH-241 manufactured by ESPEC CORP.The surface resistivity (RWT) of each of the conductive members beforeand after the forced moisture/heat treatment was measured by theaforementioned method, and a ratio of change of RWT to the surfaceresistivity (R0) measured before the forced moisture/heat treatment(RWT/R0) was calculated. In this manner, the resistance of each of theconductive members to moisture and heat was evaluated, and theconductive members were ranked as below.

Furthermore, the patterned fine lines were ranked in the same manner asthe ratio of change of fine line resistivity described above.

Rank 5: Ratio of change of surface resistivity of less than 10%,extremely excellent level

Rank 4: Ratio of change of surface resistivity of equal to or higherthan 10% but less than 20%, excellent level

Rank 3: Ratio of change of surface resistivity of equal to or higherthan 20% but less than 35%, acceptable level

Rank 2: Ratio of change of surface resistivity of equal to or higherthan 35% but less than 50%, slightly problematic level

Rank 1: Ratio of change of surface resistivity of equal to or higherthan 50%, problematic level

[Ozone Resistance]

Each of the conductive members was exposed to an environment with anozone concentration of 15 ppm and a temperature of 25° C. for 4 hours.Moreover, the surface resistivity (ROT) of each of the conductivemembers before and after the treatment was measured by theaforementioned method, and a ratio of change (ROT/R0) of ROT to thesurface resistivity (R0) measured before the exposure to ozone wascalculated. In this manner, the ozone resistance of each of theconductive members was evaluated, and the conductive members were rankedas below.

Furthermore, the patterned fine lines were ranked in the same manner asthe ratio of change of fine line resistivity described above.

Rank 5: Ratio of change of surface resistivity of equal to or higherthan 100% but less than 150%, extremely excellent level

Rank 4: Ratio of change of surface resistivity of equal to or higherthan 150% but less than 200%, excellent level

Rank 3: Ratio of change of surface resistivity of equal to or higherthan 200% but less than 350%, acceptable level

Rank 2: Ratio of change of surface resistivity of equal to or higherthan 350% but less than 500%, slightly problematic level

Rank 1: Ratio of change of surface resistivity of equal to or higherthan 500%, problematic level

TABLE 1 Compound Compound that represented Compounds of can be adsorbedOptical by Formula (1) Formulae onto or coordin- Relationcharacteristics Rank Rank of Rank or Formula (2) (3) to (11) ated withmetal with Rank of of resis- of Conduc- Added Added Added the Rank oftotal Level heat tance ozone tive Com- amount Com- amount Com- amountpresent conduc- light trans- of haze resis- to moist resis- member pound(mmol/g) pound (mmol/g) pound (mmol/g) invention tivity mittance (%)tance heat tance 1-1 1-1 0.3 — — — — Present invention 5 A 1.06 3 4 51-2 — — — — — — Comparative 4 A 1.04 1 1 1 example 1-3 1-10 0.3 — — — —Present invention 5 A 1.06 3 4 5 1-4 1-11 0.3 — — — — Present invention5 A 1.06 3 3 5 1-5 1-19 0.3 — — — — Present invention 5 A 1.06 1 2 3 1-61-20 0.3 — — — — Present invention 5 A 1.05 2 2 4 1-7 1-22 0.3 — — — —Present invention 5 A 1.04 3 4 5 1-8 2-2 0.3 — — — — Present invention 5A 1.05 4 4 3 1-9 2-6 0.3 — — — — Present invention 5 A 1.06 4 4 4 1-101-1 0.03 — — — — Present invention 5 A 1.04 2 2 3 1-11 1-1 0.07 — — — —Present invention 5 A 1.04 2 3 4 1-12 1-1 0.11 — — — — Present invention5 A 1.04 3 4 5 1-13 1-1 0.4 — — — — Present invention 5 A 1.06 3 4 51-14 1-1 1.5 — — — — Present invention 5 A 1.05 3 4 5 1-15 1-1 2.6 — — —— Present invention 5 A 1.06 3 4 5 1-16 1-1 4.8 — — — — Presentinvention 4 A 1.06 3 4 5 1-17 1-1 25 — — — — Present invention 4 A 1.083 4 4 1-18 1-1 39 — — — — Present invention 4 B 1.05 2 4 3 1-19 1-1 0.33-21 0.15 — — Present invention 5 A 1.06 5 5 5 1-20 1-10 0.3 7-15 0.15 —— Present invention 5 A 1.06 5 4 5 1-21 1-11 0.3 8-12 0.15 — — Presentinvention 5 A 1.08 5 5 5 1-22 1-1 0.3 11-4  0.15 — — Present invention 4A 1.08 5 5 5 1-23 2-2 0.3 10-5  0.15 — — Present invention 4 A 1.06 5 45 1-24 2-6 0.3 3-21 0.15 — — Present invention 5 A 1.08 5 4 5 1-25 1-50.3 7-7  0.15 — — Present invention 5 A 1.06 5 4 4 1-26 1-1 0.3 — — A-10.25 Present invention 5 A 1.04 4 5 5 1-27 1-10 0.3 — — A-1 0.25 Presentinvention 5 A 1.04 4 5 5 1-28 1-22 0.3 — — A-1 0.25 Present invention 5A 1.05 4 4 5 1-29 1-1 0.5 — — A-2 0.25 Present invention 5 A 1.06 5 5 51-30 1-10 0.5 — — A-3 0.25 Present invention 5 A 1.04 5 4 5 1-31 1-220.5 — — A-4 0.25 Present invention 5 A 1.04 5 5 5 1-32 2-2 0.5 — — A-40.25 Present invention 5 A 1.05 4 5 5 1-33 1-1 0.3 3-21 0.15 A-1 0.1Present invention 5 A 1.05 5 5 5 1-34 2-2 0.3 3-21 0.15 A-1 0.1 Presentinvention 5 A 1.05 5 5 5 1-35 — — — — A-1 0.25 Comparative 5 A 1.05 3 33 example 1-36 — — — — A-1 3 Comparative 3 A 1.06 2 4 2 example 1-37 — —— — A-2 0.25 Comparative 5 A 1.04 3 2 2 example 1-38 — — — — A-3 0.25Comparative 5 A 1.05 3 2 2 example 1-39 — — — — A-4 0.25 Comparative 4 A1.04 3 4 4 example 1-40 C-1 0.3 — — — — Comparative 4 A 1.15 2 1 1example 1-41 C-2 0.3 — — — — Comparative 5 A 1.05 3 2 2 example 1-42 C-30.3 — — — — Comparative 4 A 1.15 2 2 1 example 1-43 C-4 0.3 — — — —Comparative 5 B 1.20 3 2 2 example

From Table 1, the following can be understood. The conductive members1-1 and 1-3 to 1-34 containing the (b) component compound according tothe present invention show a small extent of change in resistivity whenthey are stored at a high temperature and exhibit excellent ozoneresistance and weather resistance.

Moreover, the conductive members 1-19 to 1-25, 1-33, and 1-34, whichconcurrently use the compounds represented by Formulae (3) to (11) inaddition to the (b) component compound according to the presentinvention, are excellent in overall performance of a conductive memberin terms of the optical characteristics, heat resistance, resistance tomoist heat, and ozone resistance, compared to a case where only the (b)component compound according to the present invention is added to aconductive member.

Furthermore, the conductive members 1-26 to 1-34, which contain thecompound according to the present invention that can be adsorbed onto ametal or the compound that can be coordinated with a metal ion inaddition to the (b) component compound according to the presentinvention, are excellent in overall performance of a conductive memberin terms of the optical characteristics, heat resistance, resistance tomoist heat, and ozone resistance, compared to a case where only the (b)component compound according to the present invention is added aconductive member.

In addition, the conductive members 1-33 and 1-34, which contain thecompounds represented by Formulae (3) to (11) and the compound accordingto the present invention that can be adsorbed onto a metal or thecompound that can be coordinated with a metal ion in addition to the (b)component compound according to the present invention, are excellent inoverall performance of a conductive member in terms of the opticalcharacteristics, heat resistance, resistance to moist heat, and ozoneresistance, compared to a case where only the (b) component compoundaccording to the present invention is added to a conductive member.

On the other hand, the conductive members 1-2 and 1-35 to 1-43 ascomparative examples that do not contain the compound according to thepresent invention are insufficient in terms of the heat resistance,resistance to moist heat, and ozone resistance.

Example 2 and Comparative Example 2 Evaluation of Dependence onMinor-Axis Length

A silver nanowire dispersion was prepared by the same method as themethod of preparing the silver nanowire dispersion described inPreparation Example 1, except that in the method of preparing the silvernanowire dispersion described in Preparation Example 1, the initialtemperature of the mixed solution obtained at the first stage waschanged to 24° C. from 20° C. The obtained silver nanowire dispersionwas named Ag-2.

Moreover, a silver nanowire dispersion was prepared by the same methodas the method of preparing the silver nanowire dispersion of PreparationExample 1, except that in the method of preparing the silver nanowiredispersion of Preparation Example 1, the initial temperature of themixed solution obtained at the first stage was changed to 28° C. from20° C. The obtained silver nanowire dispersion was named Ag-3.

For the silver nanowires contained in Ag-2 and Ag-3, the averageminor-axis length, average major-axis length, and coefficient ofvariation of minor-axis length of the silver nanowires were measured inthe same manner described above.

As a result, it was confirmed that the average minor-axis length of thesilver nanowire contained in Ag-2 is 27.6 nm, the average major-axislength is 31.8 μm, and the coefficient of variation of minor-axis lengthis 25.2%.

Furthermore, it was confirmed that the average minor-axis length of thesilver nanowires contained in Ag-3 is 33.6 nm, the average major-axislength is 28.8 μm, and the coefficient of variation of minor-axis lengthis 27.5%.

Conductive members 2-1 to 2-3 were prepared by the same method as themethod of preparing the conductive members 1-1, 1-2, and 1-8, exceptthat in the method of preparing the conductive members 1-1, 1-2, and 1-8of Example 1, Ag-2 was used instead of the silver nanowire dispersion(1). Moreover, conductive members 2-4 to 2-6 were prepared by the samemethod as the method of preparing the conductive members 1-1, 1-2, and1-8, except that Ag-3 was used instead of the silver nanowire dispersion(1).

In addition, conductive members 2-7 to 2-9 were prepared by the samemethod as the method of preparing the conductive members 1-1, 1-2, and1-8, except that in the method of preparing the conductive members 1-1,1-2, and 1-8 of Example 1, the silver nanowire dispersion (2) ofPreparation Example 2 was used instead of the silver nanowire dispersion(1). Moreover, conductive members 2-10 to 2-12 were prepared by the samemethod as the method of preparing the conductive members 1-1, 1-2, and1-8, except that the silver nanowire dispersion (3) of PreparationExample 3 was used instead of the silver nanowire dispersion (1).

Each of the obtained conductive members 2-1 to 2-12 were evaluated inthe same manner as in Example 1, and the obtained evaluation results areshown in Table 2. Furthermore, for reference, evaluation results of theconductive members 1-1, 1-2, and 1-8 obtained in Example 1 are alsoshown in Table 2.

TABLE 2 Rank of Silver nanowire Compound of Formula (1) or Opticalcharacteristics Rank resis- Rank Average (2) Level of tance ofminor-axis Added Rank of Rank of of heat to ozone Conductive lengthamount conduc- total light haze resis- moist resis- member Dispersion(nm) Compound (mmol/g) tivity transmittance (%) tance heat tance 2-1Ag-2 27.6 1-1 0.3 Present invention 5 A 1.41 4 4 5 2-2 Ag-2 27.6 — —Comparative 5 A 1.44 2 2 2 example 2-3 Ag-2 27.6 2-2 0.3 Presentinvention 5 A 1.43 4 4 4 2-4 Ag-3 33.6 1-1 0.3 Present invention 5 A1.72 5 5 5 2-5 Ag-3 33.6 — — Comparative 5 A 1.75 3 3 4 example 2-6 Ag-333.6 2-2 0.3 Present invention 5 A 1.75 5 5 5 2-7 (2) 47.0 1-1 0.3Present invention 5 A 1.72 4 4 5 2-8 (2) 47.0 — — Comparative 4 A 1.78 22 3 example 2-9 (2) 47.0 2-2 0.3 Present invention 5 A 1.73 4 4 5 2-10(3) 26.8 1-1 0.3 Present invention 4 A 1.05 4 5 5 2-11 (3) 26.8 — —Comparative 4 A 1.07 1 1 1 example 2-12 (3) 26.8 2-2 0.3 Presentinvention 4 A 1.06 5 5 4 1-1 (1) 20.1 1-1 0.3 Present invention 5 A 1.063 4 5 1-2 (1) 20.1 — — Comparative 5 A 1.04 1 1 2 example 1-8 (1) 20.12-2 0.3 Present invention 5 A 1.05 4 4 3

From Table 2, it is understood that the effects of the present inventionare also exerted even in thicker silver nanowires obtained by increasingthe average minor-axis length of silver nanowires. It is also understoodthat as the average minor-axis length of silver nanowires increases, theheat resistance, resistance to moist heat, and ozone resistance areimproved even in a conductive member not containing the compound of thepresent invention, but the degree of improvement is insufficient. On thecontrary, it is understood that as the average minor-axis length ofsilver nanowires increases, the level of haze also increases, and thesmaller the average minor-axis length is, the better the opticalcharacteristics of the transparent conductive film becomes. Furthermore,it is understood that the effects of the present invention areexcellently exerted even in the conductive member using the silvernanowire dispersion (3) prepared in a non-aqueous solvent.

That is, it is understood that in order to obtain better opticalcharacteristics of a transparent conductive film, it is effective to usesilver nanowires having a small average minor-axis length (that is, finesilver nanowires), and the present invention is effective particularlyas means for improving the heat resistance, resistance to moist heat,and ozone resistance that such silver nanowires exhibit.

Example 3 and Comparative Example 3 Evaluation of Patterned ConductiveMember

The conductive member 1-1 obtained in Example 1 was patterned in thefollowing manner. First, a positive resist (light-soluble composition)composed as below was coated onto the conductive member 1-1 by using awire bar coater so as to yield a dry film thickness of 2 μm. Theresultant was pre-baked on a hot plate for 120 seconds at 90° C., andthen subjected to contact exposure by using a high-pressure mercury lampthrough an exposure mask having a stripe pattern (line/space=50 μm/50μm). The sample having undergone exposure was subjected to a developingtreatment which will be described later, and a mask resist withline/space=50 μm/50 μm was formed on a conductive layer. Thereafter,etching treatment which will be described later was performed todissolve silver nanowires present outside the portion in which the maskresist remained, thereby forming a stripe pattern of silver nanowires.Moreover, by performing post-exposure and peeling development treatmentwhich will be described later, the mask resist was completely dissolved.

Each of the above patterning step was performed under the followingconditions.

(Exposure)

Exposure was performed using an i-ray (365 nm) of a high-pressuremercury lamp at an intensity of 150 mJ/cm² (illuminance of 20 mW/cm²).

(Developing Treatment)

Paddle development was performed for 90 seconds in an aqueous solution(23° C.) of 0.4% by mass tetramethyl ammonium hydroxide (TMAH), therebyremoving the exposed portion. Thereafter, the sample was washed withpure water (23° C.) for 90 seconds, and then dried at room temperature.

(Etching Treatment)

Etching was performed for 90 seconds at 23° C. by using the followingetching solution A, and the sample was washed with pure water (23° C.)for 90 seconds. Thereafter, the sample was washed with pure water (23°C.) for 90 seconds, and then dried at room temperature.

—Etching Solution A—

-   -   Ethylenediaminetetraacetic acid iron (III) ammonium . . . 2.71 g    -   Ethylenediaminetetraacetic acid disodium salt dihydrate . . .        0.17 g    -   Ammonium thiosulfate (70% by mass) . . . 3.61 g    -   Sodium sulfite . . . 0.84 g    -   Glacial acetic acid . . . 0.43 g    -   Water for obtaining a total of 1,000 mL of etching solution A

(Post-Exposure)

Exposure was performed using an i-ray (365 nm) of a high-pressuremercury lamp at an intensity of 300 mJ/cm² (illuminance of 20 mW/cm²).

(Peeling Development Treatment)

Paddle development was performed for 90 seconds in an aqueous solution(23° C.) of 0.4% by mass TMAH, thereby removing the exposed portion.Thereafter, the sample was washed with pure water (23° C.) for 90seconds, and then dried at room temperature.

In this manner, a conductive silver nanowire pattern having a stripepattern with line/space=50 μm/50 μm was formed. The obtained conductivemember having undergone patterning was named a conductive member 1-1P.

(Composition of Positive Resist)

Acrylic binder (A-1) 11.0 parts by mass as solid contentsPhotosensitizer 6.2 parts by mass (TAS-200 manufactured by Toyo GoseiCO. Ltd.) EHPA-3150 5.2 parts by mass (manufactured by DaicelCorporation) Adhesion accelerator 0.1 parts by mass (KBM-403manufactured by Shin-Etsu Chemical Co., Ltd) Solvent PGMEA 45.0 parts bymass Solvent MFG 32.5 parts by mass PGMEA: propylene glycol monomethylether acetate MFG: 1-methoxy-2-propanol TAS-200:

<Synthesis of Binder (A-1)>

As monomer components constituting a copolymer, 7.79 g of methacrylicacid (MAA) and 37.21 g of benzyl methacrylate (BzMA) were used.Moreover, as a radical polymerization initiator, 0.5 g ofazobisisobutyronitrile (AIBN) was used. These components were put in55.00 g of a solvent propylene glycol monomethyl ether acetate (PGMEA)to cause a polymerization reaction, thereby obtaining a PGMEA solution(solid content concentration: 45% by mass) of a binder (A−1) representedby the following formula. Furthermore, the polymerization temperaturewas regulated within 60° C. to 100° C.

As a result of performing gel permeation chromatography (GPC), a weightaverage molecular weight (Mw) expressed in terms of polystyrene wasmeasured to be 30,000, and a molecular weight distribution (Mw/Mn) was2.21

Conductive members 1-2P to 1-43P obtained by patterning the conductivemembers 1-2 to 1-43 were prepared by the same method as the method ofpreparing the conductive member 1-1P.

All of these conductive members having undergone patterning wereobserved with an optical microscope. As a result, it was confirmed thatan excellent conductive pattern with line/space of about 50 μm/50 μm isformed in the conductive members.

Each of the conductive members was evaluated in terms of weatherresistance (heat resistance and ozone resistance) in the followingmanner. Herein, a resistivity was measured by the method described inthe [Resistivity of Conductive Member Having Undergone Patterning].Regarding the conductivity, the conductive members were ranked based onthe surface resistivity, and regarding weather resistance, they wereranked based on the fine line resistivity. The evaluation results areshown in Table 3.

<Evaluation of Weather Resistance>

Each of the samples was subjected to the forced heating treatment (for60 minutes at 200° C.) in the same manner as in the evaluation of heatresistance of Example 1. Moreover, the samples were ranked in the samemanner as in Example 1, except that a ratio of resistivities before andafter the forced heating treatment was taken as a rate of increase ofresistivity, and the resistivity was measured by the method described inthe [Resistivity of Conductive Member Having Undergone Patterning].

<Evaluation of Ozone Resistance>

Each of the samples was subjected to the same treatment as in evaluationof ozone resistance in Example 1. Moreover, the samples were ranked inthe same manner as in Example 1, except that a rate of change of thesurface resistivity before and after the treatment was calculated, andthe resistivity was measured by the method described in the [Resistivityof Conductive Member Having Undergone Patterning].

<Evaluation of Resistance to Moist Heat>

Each of the samples was subjected to the same treatment as in evaluationof resistance to moist heat in Example 1. Moreover, the samples wereranked in the same manner as in Example 1, except that a rate of changeof the surface resistivity before and after the treatment wascalculated, and the resistivity was measured by the method described inthe [Resistivity of Conductive Member Having Undergone Patterning].

TABLE 3 Compound Compounds of Compound that can of Formula Formulae beadsorbed onto or Rank Rank of Rank (1) or (2) (3) to (11) coordinatedwith metal of resis- of Added Added Added Rank of heat tance ozoneConductive amount amount amount conduc- resis- to moist resis- memberCompound (mmol/g) Compound (mmol/g) Compound (mmol/g) tivity tance heattance 1-1P 1-1 0.3 — — — — Present invention 5 3 4 4 1-2P — — — — — —Comparative 5 1 1 1 example 1-3P 1-10 0.3 — — — — Present invention 5 34 4 1-4P 1-11 0.3 — — — — Present invention 5 3 3 4 1-5P 1-19 0.3 — — —— Present invention 5 1 2 3 1-6P 1-20 0.3 — — — — Present invention 5 22 4 1-7P 1-22 0.3 — — — — Present invention 5 3 4 4 1-8P 2-2 0.3 — — — —Present invention 5 4 3 3 1-9P 2-6 0.3 — — — — Present invention 5 4 4 31-10P 1-1 0.03 — — — — Present invention 5 2 2 2 1-11P 1-1 0.07 — — — —Present invention 5 2 3 3 1-12P 1-1 0.11 — — — — Present invention 5 3 44 1-13P 1-1 0.4 — — — — Present invention 5 3 4 4 1-14P 1-1 1.5 — — — —Present invention 5 3 4 5 1-15P 1-1 2.6 — — — — Present invention 5 3 45 1-16P 1-1 4.8 — — — — Present invention 4 3 4 5 1-17P 1-1 25 — — — —Present invention 4 3 4 4 1-18P 1-1 39 — — — — Present invention 3 2 4 31-19P 1-1 0.3 3-21 0.15 — — Present invention 5 5 4 5 1-20P 1-10 0.37-15 0.15 — — Present invention 5 4 4 5 1-21P 1-11 0.3 8-12 0.15 — —Present invention 5 5 5 5 1-22P 1-1 0.3 11-4  0.15 — — Present invention4 4 5 5 1-23P 2-2 0.3 10-5   0.15 — — Present invention 4 5 4 5 1-24P2-6 0.3 3-21 0.15 — — Present invention 5 4 4 5 1-25P 1-5 0.3 7-7  0.15— — Present invention 5 5 4 4 1-26P 1-1 0.3 — — A-1 0.25 Presentinvention 5 4 5 5 1-27P 1-10 0.3 — — A-1 0.25 Present invention 5 4 4 51-28P 1-22 0.3 — — A-1 0.25 Present invention 5 4 4 5 1-29P 1-1 0.5 — —A-2 0.25 Present invention 5 4 5 5 1-30P 1-10 0.5 — — A-3 0.25 Presentinvention 5 5 4 4 1-31P 1-22 0.5 — — A-4 0.25 Present invention 5 5 5 51-32P 2-2 0.5 — — A-4 0.25 Present invention 5 4 5 5 1-33P 1-1 0.5 3-210.15 A-1 0.1 Present invention 5 5 5 5 1-34P 2-2 0.5 3-21 0.15 A-1 0.1Present invention 5 5 5 5 1-35P — — — — A-1 0.25 Comparative 5 3 3 2example 1-36P — — — — A-1 3 Comparative 3 2 3 2 example 1-37P — — — —A-2 0.25 Comparative 5 3 2 2 example 1-38P — — — — A-3 0.25 Comparative5 3 2 2 example 1-39P — — — — A-4 0.25 Comparative 4 3 3 4 example 1-40PC-1 0.3 — — — — Comparative 4 2 1 1 example 1-41P C-2 0.3 — — — —Comparative 5 3 2 2 example 1-42P C-3 0.3 — — — — Comparative 4 2 2 1example 1-43P C-4 0.3 — — — — Comparative 4 3 2 2 example

The results listed in Table 3 clearly show that similarly to Example 1,the weather resistance (heat resistance, resistance to moist heat, andozone resistance) enhancing effect of the present invention is alsoobtained from the conductive members having undergone patterning.

Example 4 and Comparative Example 4

Conductive members 4-1 to 4-43 were prepared by the same method as themethod of preparing the conductive members 1-1 to 1-43, except that inthe method of preparing the conductive members 1-1 to 1-43 of Example 1,the PET substrate 101 was replaced with a glass substrate prepared inPreparation Example 2. These conductive members were evaluated in thesame manner as in Example 1. As a result, it was found that all of theconductive members 4-1 and 4-3 to 4-34 of the present invention thatcontain the (b) component compound exhibit excellent weather resistance(heat resistance and ozone resistance), compared to the conductivemember 4-2 that does not contain the (b) component compound.

Example 5 and Comparative Example 5

The conductive member 1-2 of a comparative example was dipped in anaqueous solution of the compound 1-1, 1-10, 1-11, or 2-2 for 5 minutes.Thereafter, the conductive member was washed with flowing water anddried by air blowing, thereby preparing conductive members 5-2P to 5-5Pcontaining the (b) component compound in a conductive layer.

Moreover, conductive members 5-6P and 5-7P were prepared by the samemethod as the method of preparing the conductive member 5-2P, exceptthat in the method of preparing the conductive member 5-2P, the aqueoussolution of the compound 1-1 was replaced with an aqueous solutioncontaining the compound 1-1 or 1-10 and the compound 7-15.

Furthermore, a conductive member 5-8P was prepared by the same method asthe method of preparing the conductive member 5-2P, except that in themethod of preparing the conductive member 5-2P, the aqueous solution ofthe compound 1-1 was replaced with an aqueous solution containing thecompound 2-2 and the compound 7-23.

A content of the (b) component compound in the conductive layer of eachof the conductive members 5-2P to 5-8P was measured by pulverizing eachof the conductive member with a freezer mill, performing solventextraction, and conducting analysis by high performance liquidchromatography. These conductive members were evaluated in the samemanner as in Example 1. The results are shown in Table 4.

In addition, in Table 4, the conductive member 1-2 of a comparativeexample is used as a conductive member 5-1P, and evaluation resultsthereof are also shown in the table.

TABLE 4 Compound represented by Compounds represented by Opticalcharacteristics Rank Resis- Formula (1) or (2) Formulae (3) to (11) Rankof Level of tance Added Added Rank of total light of heat to OzoneConductive amount amount conduc- transmit- haze resis- moist resis-member Compound (mmol/g) Compound (mmol/g) tivity tance (%) tance heattance 5-1P — — — — Comparative 4 A 1.04 1 1 1 example 5-2P 1-1 0.3 — —Present invention 5 A 1.06 3 3 5 5-3P 1-10 0.3 — — Present invention 5 A1.06 3 3 5 5-4P 1-11 0.3 — — Present invention 5 A 1.06 3 3 5 5-5P 2-20.3 — — Present invention 5 A 1.05 4 3 3 5-6P 1-1 0.3 7-15 0.15 Presentinvention 5 A 1.06 5 4 5 5-7P 1-10 0.3 7-15 0.15 Present invention 5 A1.06 5 5 5 5-8P 2-2 0.3 7-23 0.15 Present invention 5 A 1.06 4 4 5

From Table 4, it is understood that the effects of the present inventionare excellently exerted even in the conductive members in which the (b)component compound is added to the conductive layer by dipping.

Example 6 and Comparative Example 6

In the conductive members 1-1, 1-2 and 1-8, a composition for a solubleprotective layer composed as below was coated onto the conductive layer,followed by drying, thereby forming a soluble protective layer having anaverage thickness of 0.8 Moreover, patterning was performed on theconductive members in the same manner as in Example 3, thereby preparingconductive members 6-1P and 6-9P. These conductive members wereevaluated in the same manner as in Example 1. The results are shown inTable 5.

—Preparation of Composition for Soluble Protective Layer—

-   -   Polyvinyl alcohol (PVA, PVA205 (saponification rate=88%);        manufactured by KURARAY CO., LTD.) . . . 10 g    -   Deionized water . . . 90 g    -   Polyoxyethylene lauryl ether (surfactant) . . . 0.05 g    -   (b) Component compound of the present invention . . . type and        amount described in Table 5

The above components were mixed together and stirred, thereby preparingthe composition for a soluble protective layer.

TABLE 5 Conductive layer Soluble protective layer Opticalcharacteristics Rank of Rank of Compound of Added Compound of Added Rankof Ranke of Level of heat ozone Conductive Formula amount Formula amountconduc- total light haze resis- resis- member (1) or (2) (mmol/g) (1) or(2) (mmol/g) tivity transmittance (%) tance tance 6-1P — — — —Comparative 4 A 1.07 2 2 example 6-2P 1-1 0.3 — — Present invention 5 A1.06 5 4 6-3P 2-2 0.3 — — Present invention 5 A 1.06 5 4 6-4P — — 1-10.3 Present invention 4 A 1.07 4 4 6-5P — — 2-2 0.3 Present invention 5A 1.06 4 4 6-6P 1-1 0.3 1-1 0.15 Present invention 5 A 1.06 5 5 6-7P 1-10.3 2-2 0.15 Present invention 5 A 1.06 5 5 6-8P 2-2 0.3 1-1 0.15Present invention 5 A 1.06 5 5 6-9P 2-2 0.3 2-2 0.15 Present invention 5A 1.06 5 5

From Table 5, it is understood that the present invention is effectiveeven in the conductive member having the soluble protective layer, andwhen the (b) component compound of the present invention is contained inone of the conductive layer and soluble protective layer, the effects ofthe present invention are exerted. Even when the (b) component compoundis contained in the soluble protective layer, the effects of the presentinvention are exerted. Accordingly, presumably, the (b) componentcompound of the present invention may exert its effect by moving to aphotosensitive layer from the soluble protective layer. It is alsounderstood that for the effects of the present invention, it is morepreferable to add the (b) component compound to the conductive layercoating solution beforehand and then perform coating, or add the (b)component compound to both the conductive layer and the solubleprotective layer.

Example 7 Preparation of Conductive Member Patterned by being Providedwith Photoresist Layer

—Preparation of Resist Composition (1)—

The following components were mixed together to form the followingmakeup, followed by stirring, thereby preparing a resist composition(1).

(Makeup of Resist Composition (1))

Binder (A-1) synthesized in Example 3 3.80 parts by mass (solid contentof 40.0% by mass, PGMEA solution) KAYARAD DPHA (manufactured by 1.59parts by mass Nippon Kayaku Co., Ltd) as a photosensitive compoundIRGACURE 379 (manufactured by 0.159 parts by mass Ciba SpecialtyChemicals Inc) as a photopolymerization initiator EHPE-3150(manufactured by Daicel 0.150 parts by mass Corporation) as acrosslinking agent MEGAFAC F781F (DIC Corporation) 0.002 parts by massPGMEA 19.3 parts by mass

—Ressit Patterning Step—

For the conductive members 1-1, 1-2, and 1-8, the resist composition (1)obtained as above was coated onto a conductive layer by means of a barcoating method so as to yield a dry film thickness of 5 μm, and theconductive members were dried in an oven at 150° C. for 5 minutes.Exposure was performed by emitting an i-ray (365 nm) of a high-pressuremercury lamp at an intensity of 400 mJ/cm² (illuminance of 50 mW/cm²) tothe substrate through an exposure mask in a nitrogen atmosphere.

The substrate having undergone exposure was subjected to shower exposurefor 60 seconds by using an aqueous solution of 1% sodium hydroxide at35° C. The shower pressure was 0.08 MPa, and it was taken 30 secondsuntil a stripe pattern appeared. The resultant was rinsed with purewater by shower and then dried for 1 minute at 50° C., thereby preparingconductive members 7-1R, 7-2R, and 7-3R having a resist pattern.

Moreover, as the exposure mask, an exposure mask which can form a solidexposed portion, an unexposed portion, and a fine line pattern(L/S=300/300 μm, an electrode length of 30 mm) was used.

—Etching Step—

The conductive members 7-1R, 7-2R, and 7-3R having a resist pattern weresubjected to etching treatment by being dipped in an etching solution,which was obtained by mixing a CP-48S-A solution, a CP-48S-B solution(all manufactured by FUJIFILM Corporation, color paper bleach fixer),and pure water together at a mass ratio of 1:1:6 and had a temperatureregulated to be 35° C., for 2 minutes. After the samples were rinsedwith pure water by shower, water on the surface of the samples was blownaway by an air knife, and the samples were dried for 5 minutes at 60° C.

—Resist Peeling Step—

The etched substrate was subjected shower development for 75 seconds byusing an aqueous solution of 2.5% tetramethyl ammonium hydroxide kept at35° C. The shower pressure was 3.0 MPa. After the samples were rinsedwith pure water by shower, water on the surface of the samples was blownaway by an air knife, and the samples were dried for 5 minutes at 60°C., thereby preparing patterned conductive members 7-1P, 7-2P, and 7-3P.Each of the obtained conductive members was evaluated in terms of thesurface resistivity and optical characteristics (total lighttransmittance and level of haze) in the same manner as in Example 3. Theresults are shown in Table 6.

TABLE 6 Optical characteristics Conductive layer Rank of total LevelRank of Rank of Added Rank of light of heat ozone Conductive amountconduc- transmi- haze resis- resis- material Compound (mmol/g) tivityttance (%) tance tance 7-1P — — Comparative 3 A 1.15 2 2 example 7-2P1-1 0.3 Present 5 A 1.05 5 4 invention 7-3P 2-2 0.3 Present 5 A 1.05 5 4invention

From Table 6, it is understood that the conductive members patterned bya resist tend to deteriorate in terms of conductivity or haze, but thepresent invention is particularly effective for improving such problems.

Example 8 Preparation of Touch Panel

By using the conductive member 1-1 of Example 1, a touch panel wasprepared by the methods described in “The Latest Touch Panel Technology”(published in Jul. 6, 2009, Techno-Times), “Technology and Developmentof Touch Panel” supervised by Yuji Mitani, CMC Publishing Co., Ltd.(published in December, 2004), “FPD International 2009 Forum T-11Lecture Textbook”, “Cypress Semiconductor Corporation Application NoteAN2292”, and the like.

It was found that when the touch panel prepared as above is used, it ispossible to produce a touch panel which has improved light transmittanceand excellent visibility, makes it possible to input letters and thelike by at least one of the bare hands, hands with gloves, and indicatordue to the improved conductivity, and excellently responds to screenmanipulation.

What is claimed is:
 1. A conductive composition at least comprising: (a)conductive metal fibers having an average minor-axis length from 1 nm to150 nm; and (b) at least one compound selected from a compoundrepresented by the following Formula (1) and a compound represented bythe following Formula (2),

in Formula (1), each of R¹ and R² independently represents an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, or a halogenatom, and R³ represents an alkyl group or an aryl group, at least twoamong R¹, R², and R³ may be linked to each other through an organicgroup having a valency of 2 or higher or a single bond, the Formula (1)may include a structure that plural compounds represented by Formula (1)are linked to each other through an organic group having a valency of 2or higher or through a single bond, in Formula (2), each of R⁴ and R⁵independently represents an alkyl group, R⁴ and R⁵ may be linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond, moreover, the Formula (2) may include a structurethat plural compounds represented by Formula (2) are linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond.
 2. The conductive composition according to claim1, further comprising (c) a polymerizable compound that can form amatrix.
 3. The conductive composition according to claim 2, wherein the(c) polymerizable compound that can form a matrix is anon-photosensitive compound.
 4. The conductive composition according toclaim 3, wherein the (c) polymerizable compound that can form a matrixis a compound that can form a cured sol-gel substance.
 5. The conductivecomposition according to claim 2, wherein a ratio of content of the (c)polymerizable compound that can form a matrix to the (a) conductivemetal fibers ((c)/(a)) is 0.001/1 to 100/1 in terms of a mass ratio. 6.The conductive composition according to claim 1, wherein a content of(b) at least one compound selected from a compound represented byFormula (1) and a compound represented by Formula (2) is from 0.005 mmolto 30 mmol per 1 g of the (a) conductive metal fibers.
 7. The conductivecomposition according to claim 1, wherein at least one of the R¹ and R²in Formula (1) is an alkoxy group or an aryloxy group, and R³ is an arylgroup.
 8. The conductive composition according to claim 1, furthercomprising at least one kind of the compound represented by thefollowing Formulae (3) to (11),

in Formula (3), V₃ represents a hydrogen atom or a substituent, inFormula (4), V₄ represents a hydrogen atom or a substituent, in Formula(5), V₅ represents a hydrogen atom or a substituent, and each of R₅₁ andR₅₂ independently represents a hydrogen atom or a group that can besubstituted with a nitrogen atom, in Formula (6), V₆ represents ahydrogen atom or a substituent, and each of R₆₁ and R₆₂ independentlyrepresents a hydrogen atom or a group that can be substituted with anitrogen atom, in Formula (7), V₇ represents a hydrogen atom or asubstituent, and each of R₇₁ and R₇₂ independently represents a hydrogenatom or a substituent, in Formula (8), V₈ represents a hydrogen atom ora substituent, and each of R₈₁ and R₈₂ independently represents ahydrogen atom or a substituent, In Formula (9), V₉ represents a hydrogenatom or a substituent, and each of R₉₁, R₉₂, R₉₃, and R₉₄ independentlyrepresents a hydrogen atom or a group that can be substituted with anitrogen atom, in Formula (10), V₁₀ represents a hydrogen atom or asubstituent, and each of R₁₀₁, R₁₀₂, R₁₀₃, and R₁₀₄ independentlyrepresents a hydrogen atom or a group that can be substituted with anitrogen atom, in Formula (11), R₁₁₁ represents a hydrogen atom or agroup that can be substituted with a nitrogen atom, each of V₁₁₁, V₁₁₂,V₁₁₃, and V₁₁₄ independently represents a hydrogen atom or asubstituent, and V₁₁₁ and V₁₁₂ as well as V₁₁₃ and V₁₁₄ may form abicyclo-ring or a tricyclo-ring by being linked to each other.
 9. Theconductive composition according to claim 7, further comprising at leastone kind of the compound represented by the following Formulae (3) to(11),

in Formula (3), V₃ represents a hydrogen atom or a substituent, inFormula (4), V₄ represents a hydrogen atom or a substituent, in Formula(5), V₅ represents a hydrogen atom or a substituent, and each of R₅₁ andR₅₂ independently represents a hydrogen atom or a group that can besubstituted with a nitrogen atom, in Formula (6), V₆ represents ahydrogen atom or a substituent, and each of R₆₁ and R₆₂ independentlyrepresents a hydrogen atom or a group that can be substituted with anitrogen atom, in Formula (7), V₇ represents a hydrogen atom or asubstituent, and each of R₇₁ and R₇₂ independently represents a hydrogenatom or a substituent, in Formula (8), V₈ represents a hydrogen atom ora substituent, and each of R₈₁ and R₈₂ independently represents ahydrogen atom or a substituent, In Formula (9), V₉ represents a hydrogenatom or a substituent, and each of R₉₁, R₉₂, R₉₃, and R₉₄ independentlyrepresents a hydrogen atom or a group that can be substituted with anitrogen atom, in Formula (10), V₁₀ represents a hydrogen atom or asubstituent, and each of R₁₀₁, R₁₀₂, R₁₀₃, and R₁₀₄ independentlyrepresents a hydrogen atom or a group that can be substituted with anitrogen atom, in Formula (11), R₁₁₁ represents a hydrogen atom or agroup that can be substituted with a nitrogen atom, each of V₁₁₁, V₁₁₂,V₁₁₃, and V₁₁₄ independently represents a hydrogen atom or asubstituent, and V₁₁₁ and V₁₁₂ as well as V₁₁₃ and V₁₁₄ may form abicyclo-ring or a tricyclo-ring by being linked to each other.
 10. Theconductive composition according to claim 1, wherein the conductivemetal fibers contain silver in an amount from 50 mol % to 100 mol %. 11.The conductive composition according to claim 1, wherein the averageminor-axis length of the conductive metal fibers is from 1 nm to 30 nm.12. A conductive member comprising: a substrate; and a conductive layerwhich is disposed on the substrate and formed of the conductivecomposition according to claim
 1. 13. The conductive member according toclaim 12, further comprising, on the conductive layer, a solubleprotective layer containing at least a water-soluble polymer.
 14. Theconductive member according to claim 12, wherein a surface resistance ofthe conductive layer is from 1 Ω/square to 1,000 Ω/square.
 15. Theconductive member according to claim 12, wherein the conductive layerhas a conductive region and a non-conductive region.
 16. The conductivemember according to claim 12, further comprising, between the substrateand the conductive layer, at least one intermediate layer.
 17. A touchpanel comprising the conductive member according to claim
 12. 18. Asolar cell comprising the conductive member according to claim
 12. 19. Aconductive member production method comprising forming a conductivelayer by using the conductive composition according to claim 1 on asubstrate, wherein the conductive composition contains at least (a)conductive metal fibers having an average minor-axis length from 1 nm to150 nm and (b) at least one compound selected from a compoundrepresented by the following Formula (1) and a compound represented bythe following Formula (2),

in Formula (1), each of R¹ and R² independently represents an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, or a halogenatom, and R³ represents an alkyl group or an aryl group, at least twoamong R¹, R², and R³ may be linked to each other through an organicgroup having a valency of 2 or higher or a single bond, the Formula (1)may include a structure that plural compounds represented by Formula (1)are linked to each other through an organic group having a valency of 2or higher or through a single bond, in Formula (2), each of R⁴ and R⁵independently represents an alkyl group, R⁴ and R⁵ may be linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond, moreover, the Formula (2) may include a structurethat plural compounds represented by Formula (2) are linked to eachother through an organic group having a valency of 2 or higher orthrough a single bond.
 20. The conductive member production methodaccording to claim 19, wherein in forming the conductive layer, theconductive composition, which contains the (a) conductive metal fibershaving an average minor-axis length from 1 nm to 150 nm and the (b) atleast one compound selected from a compound represented by Formula (1)and a compound represented by Formula (2), is applied onto thesubstrate, and then (c) a matrix is applied onto the substrate so as toform a conductive layer containing the component (a), the component (b),and the component (c).
 21. The conductive member production methodaccording to claim 19, wherein in forming the conductive layer, aconductive composition, which contains the (a) conductive metal fibershaving an average minor-axis length from 1 nm to 150 nm, the (b) atleast one compound selected from a compound represented by Formula (1)and a compound represented by Formula (2), and (c) a matrix is appliedonto the substrate so as to form a conductive layer containing thecomponent (a), the component (b), and the component (c).
 22. Aconductive member production method, wherein (a) conductive metal fibershaving an average minor-axis length from 1 nm to 150 nm are applied ontoa substrate, and then a composition, which contains (b) at least onecompound selected from a compound represented by the following Formula(1) and a compound represented by the following Formula (2) and (c) amatrix, is applied onto the substrate so as to form a conductive layercontaining the component (a), the component (b), and the component (c).

in Formula (1), each of R¹ and R² independently represents an alkylgroup, an aryl group, an alkoxy group, an aryloxy group, or a halogenatom, and R³ represents an alkyl group or an aryl group, at least twoamong R¹, R², and R³ may be linked to each other through an organicgroup having a valency of 2 or higher or through a single bond, theFormula (1) may include a structure that plural compounds represented byFormula (1) are linked to each other through an organic group having avalency of 2 or higher or through a single bond, in Formula (2), each ofR⁴ and R⁵ independently represents an alkyl group, R⁴ and R⁵ may belinked to each other through an organic group having a valency of 2 orhigher or through a single bond, moreover, the Formula (2) may include astructure that plural compounds represented by Formula (2) are linked toeach other through an organic group having a valency of 2 or higher orthrough a single bond.
 23. A conductive member production method forproducing a conductive member having a patterned conductive layer, themethod comprising: providing a photoresist layer to the conductivemember according to claim 12 that has the substrate and the conductivelayer; forming a photoresist layer in the form of a pattern by exposingthe photoresist layer to light in the form of a pattern and developingthe photoresist layer; and etching the conductive layer through thephotoresist layer in the form of a pattern.